XCKU3P-2FFVD900E - Kintex UltraScale+ FPGA | AMD
MPN： XCKU3P-2FFVD900E ✓ 啟用中XCKU3P-2FFVD900E 概覽
A field-programmable gate array, or FPGA, is a programmable digital semiconductor categorized within integrated circuits, semiconductors, and digital logic. Unlike a fixed-function application-specific integrated circuit, an FPGA combines programmable logic, block RAM, programmable I/O, and dedicated interface resources on one device. This architecture allows engineers to implement parallel processing, control, networking, signal processing, and hardware acceleration while retaining the flexibility to update designs after manufacture.
The Kintex UltraScale+ family combines programmable logic with high-speed connectivity resources. The XCKU3P-2FFVD900E offers 355,950 logic elements organized into 20,340 LAB/CLB blocks and 31,641,600 RAM bits for on-chip storage. Its 304 user I/O support high pin density for parallel interfaces and board-level connectivity. AMD identifies the -2 part as the middle performance option within the device-speed and temperature-grade system.
The 900-FCBGA package provides dense access to logic and I/O resources but requires a carefully designed PCB. Power delivery, ground-plane continuity, decoupling, and high-speed signal routing are central implementation concerns because the package exposes hundreds of balls in a 31 mm by 31 mm area. Designers should use the manufacturer pinout files and device documentation when assigning every power, ground, configuration, clock, and user-I/O connection.
Typical applications include high-throughput signal processing, network packet handling, industrial control, test and measurement, video infrastructure, and embedded edge processing. The 304 user I/O are useful for parallel data acquisition and external memory connectivity, while the large block-RAM capacity supports buffering, lookup tables, and local data storage. The device is especially relevant when deterministic parallel hardware is more valuable than software-only flexibility.
For a new PCB, use the AMD package pinout files, recommended power architecture, and PCB-design guidance before committing the 900-ball land pattern. Confirm the selected board file, power rails, decoupling network, configuration interface, and thermal strategy against the exact -2FFVD900E device. Firmware, bitstream, and board-level constraints must also be checked before hardware production.
This product summary combines the device's published logic, memory, I/O, package, and supply information with practical implementation guidance. It also distinguishes the verified same-package speed-grade alternative and highlights where a new design should use the manufacturer pinout and power-design files rather than relying on generic BGA conventions.
直接替換替代品，適用於 XCKU3P-2FFVD900E — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： XCKU3P-2FFVD900E （相同外形與佔位） — 差異在於 Device Type, Package.
XCKU3P-1FFVD900E
✅ 直接替換📋 參考替代品（不在目錄中）
XCKU3P-2FFVD900E 最大額定值與電氣特性
| Device Type | Kintex UltraScale+ Field-Programmable Gate Array |
| Programmable Logic Elements | 355,950 logic elements |
| Logic Blocks | 20,340 LABs/CLBs |
| Block RAM | 31,641,600 RAM bits |
| User I/O Count | 304 user I/O |
| 封裝 | 900-FCBGA, 31 mm x 31 mm |
| Package Pin Count | 900 balls |
| 供應電壓 | 0.825 V to 0.876 V |
| Process Technology | FinFET |
| Performance Grade | -2 speed grade |
| Package Type | FCBGA |
| Terminal Type | Ball |
| Package Shape | Square |
| 安裝類型 | Surface Mount |
| Device Family | Kintex UltraScale+ |
| Programmable Architecture | FPGA |
XCKU3P-2FFVD900E square 腳位配置指南
XCKU3P-2FFVD900E（square 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： XCKU3P-2FFVD900E.
請參閱 資料表 以查看完整腳位配置。
典型應用
XCKU3P-2FFVD900E 適用於 6 應用s: High-Throughput Signal Processing, Industrial Control and Automation, Network Packet Processing, Test and Measurement Equipment, Video and Image Processing, Embedded Edge Processing.
High-Throughput Signal Processing
The XCKU3P-2FFVD900E fits parallel signal-processing pipelines that require substantial programmable logic and local data storage. Its 355,950 logic elements and 20,340 LABs/CLBs can implement multiple concurrent filters, transforms, correlation functions, or decision engines, while 31,641,600 RAM bits support buffering and intermediate data. The 304 user I/O provide broad connectivity to converters, memory devices, and custom interfaces. Compared with a sequential processor-only implementation, the FPGA architecture can execute independent samples concurrently and reduce the dependence on software scheduling. Final throughput must be validated against the selected UltraScale+ I/O standards, clock architecture, timing constraints, and board-level signal-integrity budget.
推薦
Industrial Control and Automation
The XCKU3P-2FFVD900E is suitable for industrial controllers that coordinate machine control, diagnostics, interlocks, and data acquisition in one programmable device. Its 355,950 logic elements allow concurrent control functions to be combined with communication logic and supervisory state machines, while 31,641,600 RAM bits can hold operating history or temporary processing buffers. The 304 user I/O support distributed digital connections to sensors, actuators, field buses, and operator interfaces. For deployment, engineers should establish deterministic clocking, isolate noisy industrial inputs, provide robust power sequencing, and validate environmental requirements for the production installation rather than assuming generic commercial qualifications.
推薦
Network Packet Processing
The XCKU3P-2FFVD900E can support network packet classification, buffering, protocol acceleration, and traffic-management functions through parallel programmable logic. The device provides 355,950 logic elements for header parsing and state machines, 31,641,600 RAM bits for packet buffers or lookup structures, and 304 user I/O for external networking components. This resource balance allows multiple data paths to operate concurrently and can offload tasks that would otherwise burden a general-purpose processor. Production implementation must be checked against the required Ethernet or other interface rate, memory architecture, timing closure, and thermal conditions. The -2 performance grade is the appropriate selection point when the design requires more timing margin than the -1 alternative.
推薦
Test and Measurement Equipment
The XCKU3P-2FFVD900E is appropriate for modular test systems that combine acquisition, pattern generation, real-time analysis, and instrument control. Its 304 user I/O can connect multiple converters, capture resources, trigger logic, and communication channels, while the large block-RAM capacity enables deep sample buffers and lookup functions. The 20,340 LAB/CLBs provide enough parallel logic to implement digital channelization, digital signal processing, and timing-intensive control paths concurrently. Because measurement accuracy depends on the entire signal chain, use the AMD package files to assign supply and ground balls correctly, design controlled impedance for high-speed links, and evaluate dynamic power and junction temperature under worst-case instrument loading.
推薦
Video and Image Processing
The XCKU3P-2FFVD900E can be used for deterministic image pipelines, pixel classification, frame buffering, and hardware-assisted analytics. Its 355,950 logic elements support parallel pixel operations and feature extraction, while 31,641,600 RAM bits can accommodate line buffers, lookup structures, or compact frame-processing stages. The 304 user I/O enable direct connections to image sensors, display interfaces, frame memory, and supporting processors. Actual video performance depends on the selected interface rate, image resolution, color depth, and whether frames are processed internally or transferred externally. Engineers should establish achievable timing at the target speed grade, plan power delivery for sustained switching activity, and use the manufacturer pinout files when creating the 900-ball PCB footprint.
推薦
Embedded Edge Processing
The XCKU3P-2FFVD900E supports edge systems that require predictable response times for sensor fusion, condition monitoring, and local decision-making. The FPGA's 20,340 LABs/CLBs and 31,641,600 RAM bits allow preprocessing pipelines to execute in parallel without relying entirely on a general-purpose operating system. Its 304 user I/O can connect sensors, industrial links, local memory, and communication hardware within a compact 31 mm by 31 mm package. Deployment decisions should include power-budget analysis, thermal verification, configuration-storage strategy, and long-term supply requirements. When creating a new board, follow the exact package pinout, reference power distribution, and decoupling requirements for this ordering code.
推薦
推薦產品摘要
工程參考資料，適用於 XCKU3P-2FFVD900E — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | XCKU3P-1FFVD900E |
|---|---|---|
| Package | 900-FCBGA, 31 mm x 31 mm | 900-FCBGA, 31 mm x 31 mm |
| Brand | AMD | AMD |
| Performance Grade | -2 | -1 |
| Device Family | Kintex UltraScale+ | Kintex UltraScale+ |
主要差異化特點
- Higher performance grade within the same package family (對比XCKU3P-1FFVD900E)
- High-density programmable logic capacity (對比XCKU3P-1FFVD900E)
- Substantial on-chip RAM and external connectivity (對比XCKU3P-1FFVD900E)
設計說明
Use the exact AMD power architecture for XCKU3P-2FFVD900E and include every required supply rail, sequencing requirement, decoupling value, and plane connection. The published 0.825 V to 0.876 V core range covers the core supply but does not represent the device's total input-power requirement. Estimate worst-case utilization, I/O activity, and temperature before releasing the design, then provide independent local decoupling at the package balls rather than relying on distant bulk capacitors.
A 900-FCBGA package on a 31 mm by 31 mm board footprint requires deliberate thermal planning because dense power delivery and signal routing compete for the same limited surface area. Preserve the package substrate's thermal escape path through the PCB, follow the AMD recommended stack-up and via pattern, and avoid trapping the device beneath components that obstruct convection. Validate junction temperature under maximum sustained switching activity rather than estimating thermal performance from an idle configuration.
Download and use the AMD UltraScale package device pinout files for the exact FFVD900E package. Verify pin assignments for power, ground, configuration, clock, and user I/O before routing, and cross-check the PCB library against the manufacturer package drawing. Keep high-speed interface routes length-matched where required, avoid routing through split plane boundaries, and follow the device's recommended high-speed and supply-pinout guidelines for the selected interfaces.
Do not treat the XCKU3P-1FFVD900E as an unconditional functional substitute for XCKU3P-2FFVD900E. Although both use the FFVD900E package designation, the performance grades differ between -1 and -2. Re-run timing analysis, review power and thermal behavior, and confirm that the configuration, board, and system requirements remain satisfied. For any other XCKU3P package, compare ball count and pinout rather than assuming family-level compatibility.
合規資訊
The available product information identifies an AMD Kintex UltraScale+ FPGA but does not state the regulatory declarations for the exact XCKU3P-2FFVD900E ordering code. Obtain current AMD or supplier documentation before making a compliance claim.
