A3PE3000-FG484I - ProASIC3E FPGA 35K LE 341 I/O | Microchip
料号： A3PE3000-FG484I ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $132.5 | $132.50 |
| 10 | $121.8 | $1,218.00 |
| 100 | $112.4 | $11,240.00 |
| 500 | $104.9 | $52,450.00 |
| 1,000 | $98.6 | $98,600.00 |
A3PE3000-FG484I 概述
An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device that implements digital logic through configurable logic blocks and programmable interconnect. Within the power-management hierarchy of a system, the ProASIC3E family occupies the mid-density, nonvolatile flash FPGA tier: it sits between CPLDs and high-end SRAM FPGAs, offering single-chip operation because configuration data is stored in on-chip flash rather than an external boot flash.
Key features of the A3PE3000-FG484I include instant-on, single-chip operation enabled by the flash fabric, a 1.5V core supply (1.425V to 1.575V operating range), support for optional soft ARM processor integration, and high I/O count (341) suited to wide bus interfaces. The ProASIC3E fabric also integrates embedded memory blocks totaling 516096 bits plus 1 Kbit of flash-based uPROM for secure version storage.
Technically, the device is built on a 130nm flash process with a system performance rating up to 231 MHz. Unlike SRAM FPGAs, no configuration PROM or power-up configuration sequence is required, improving board-level reliability and reducing bill-of-materials cost. Flash cells also resist single-event configuration upsets better than SRAM, which benefits industrial and communications equipment.
Typical applications include industrial automation control, communications and networking line cards, medical instrumentation, and aerospace/defense payloads where instant-on and nonvolatile configuration matter. The 484-ball package balances I/O density with moderate thermal and assembly requirements.
When designing with this FPGA, power the 1.5V core and I/O banks in the sequence specified by the manufacturer datasheet and decouple each bank with low-ESR ceramics; the FBGA package requires careful via fan-out planning in the PCB layout stage.
This page synthesizes distributor pricing, same-brand drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing a one-stop reference for procurement and engineering evaluation.
直接替换替代料： A3PE3000-FG484I ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： A3PE3000-FG484I （相同外形与封装尺寸） ——差异在于 Package, Operating Temperature, Family, System Gates, Process Technology.
快速对比工具——选择替代料号进行并排对比：
A3PE3000-FGG484I
✅ 直接替换✓ 有现货
$1451.56 / 个
查看数据手册 →A3PE3000L-FG484I
✅ 直接替换✓ 有现货
联系询价
查看数据手册 →A3PE3000L-FGG484I
✅ 直接替换✓ 有现货
联系询价
查看数据手册 →A3PE3000-1FGG484I
✅ 直接替换✓ 有现货
$1336.6 / 个
查看数据手册 →A3PE3000-2FGG484I
✅ 直接替换✓ 有现货
$89.4 / 个
查看数据手册 →A3PE3000-FG484I 最大额定值与电气特性
| Family | ProASIC3E (Flash FPGA) |
| System Gates | 3000000 |
| Logic Elements (LEs) | 35K |
| Number of I/O | 341 |
| Total Fabric RAM | 516096 bit (504 Kbit) |
| Fabric uPROM | 1 Kbit |
| Core Supply Voltage | 1.425 V to 1.575 V (1.5 V nominal) |
| Process Technology | 130 nm |
| Maximum System Performance | 231 MHz |
| Configuration Memory | Nonvolatile on-chip flash (single chip) |
| Soft ARM Support | Optional |
| 工作温度 | -40C to +100C (TJ) |
| 封装 | 484-BGA (FBGA-484) |
| 安装类型 | Surface Mount |
| Packaging | Tray |
A3PE3000-FG484I 484-bga (fbga-484) 引脚配置指南
A3PE3000-FG484I（484-bga (fbga-484) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： A3PE3000-FG484I.
请参阅 数据手册 以查看完整引脚配置。
典型应用
A3PE3000-FG484I 适用于 6 应用s: Industrial Automation Control, Communications and Networking Line Cards, Medical Instrumentation, Aerospace and Defense Payloads, Test and Measurement Equipment, Secure Embedded Systems and IoT Gateways.
Industrial Automation Control
The A3PE3000-FG484I fits industrial control and factory automation because its 341 user I/Os can service wide parallel sensor buses, backplane interfaces, and multiple motor-control channels in one device. Its -40C to +100C junction rating covers unconditioned cabinets and outdoor enclosures, and the nonvolatile flash fabric means the controller logic is live the instant 1.5V core power is present - no configuration reload delay after power cycles common on factory floors. With 504 Kbit of embedded RAM, the device buffers process data locally between the I/O fabric and a host CPU or soft ARM core. Place the FPGA between the field I/O connectors and the main controller, decoupling each I/O bank for surge immunity in electrically noisy environments.
推荐
Communications and Networking Line Cards
Networking line cards benefit from the A3PE3000-FG484I's combination of 341 I/Os, 231 MHz system performance, and 516096 bits of distributed fabric RAM, which together handle wide data-path muxing, packet FIFO buffering, and glueless connection to PHYs and framers. The 130nm flash fabric provides deterministic, instant-on startup - valuable for carrier equipment expected to recover within fixed time budgets. The single-chip flash architecture removes the external boot flash, shrinking card area and improving configuration reliability under repeated hot-insertion cycles. Design the card with the core rail at a regulated 1.5V (+/-5%) and segment I/O bank rails by interface voltage; verify timing closure at 231 MHz with static timing analysis in Libero SoC.
推荐
Medical Instrumentation
In medical diagnostic and monitoring instruments, the A3PE3000-FG484I serves as the control and data-acquisition glue logic connecting front-end amplifiers, ADCs, and a host processor. The nonvolatile flash configuration supports instant-on startup demanded by instruments with strict readiness expectations, and the 504 Kbit fabric RAM buffers waveform samples between acquisition bursts. The 3 million gate capacity hosts a soft ARM core for local protocol handling, offloading the main CPU. Because medical benches are thermally benign, the standard 1.5V-core ProASIC3E variant is preferred over the L variant for its wider availability; the 484-ball BGA provides routing density for multi-channel front ends within a compact enclosure.
推荐
Aerospace and Defense Payloads
The A3PE3000-FG484I is widely used in space-constrained aerospace and defense electronics where configuration reliability is critical. The flash cells are inherently more resistant to configuration upset than SRAM-based FPGAs, and no external configuration device exists to fail or be corrupted. Its 341 I/Os interface radar front ends, telemetry buses, and payload controllers, while the -40C to +100C rating and industrial temperature qualification support harsh deployment profiles. The 1 Kbit flash uPROM securely stores board revision or security data. For these programs, Microchip offers military-screening flows on the same die family; on the board, use the standard 1.5V core rail and verify power sequencing against the manufacturer datasheet.
推荐
Test and Measurement Equipment
Bench instruments and automated test equipment use the A3PE3000-FG484I as a reprogrammable timing, trigger, and bus-interface engine. The 231 MHz fabric performance and 130nm process deliver adequate speed for trigger arbitration and timestamping, while the 341 I/Os drive instrument backplanes and probe interfaces. Instant-on flash configuration lets the instrument be ready within milliseconds of power application, and in-system reprogrammability allows firmware-defined instrument personalities over a product line without board changes. Use the embedded 504 Kbit RAM for capture buffers and the 1 Kbit uPROM for calibration constants. Keep core supply noise low; sensitive analog triggering paths share the board with digital switching.
推荐
Secure Embedded Systems and IoT Gateways
Security-oriented embedded systems leverage the A3PE3000-FG484I's nonvolatile flash fabric: configuration data is stored on-chip and is not exposed on a readable SPI bus during boot, unlike SRAM FPGAs that must download their bitstream at power-up. This protects IP and makes bitstream cloning significantly harder. With 35K LEs, 504 Kbit RAM, and optional soft ARM support, the device implements protocol bridges, encryption acceleration, and gateway logic for industrial IoT deployments, while the 1 Kbit uPROM stores security-relevant constants. The industrial -40C to +100C range suits unattended outdoor gateways. Pair the FPGA with a secure element on the same board and power the 1.5V core from a filtered rail to avoid side-channel-inducing supply ripple.
推荐
推荐产品汇总
工程参考数据： A3PE3000-FG484I ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | A3PE3000-FGG484I | A3PE3000L-FG484I | A3PE3000L-FGG484I | A3PE3000-1FGG484I | A3PE3000-2FGG484I |
|---|---|---|---|---|---|---|
| Package | 484-BGA (FBGA) | 484-BGA (FBGA) - same | 484-BGA (FBGA) - same | 484-BGA (FBGA) - same | 484-BGA (FBGA) - same | 484-BGA (FBGA) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Logic Elements | 35K LEs | 35K LEs | 35K LEs | 35K LEs | 35K LEs | 35K LEs |
| Number of I/O | 341 | 341 | 341 | 341 | 341 | 341 |
| Fabric RAM | 516096 bit (504 Kbit) | 516096 bit | 516096 bit | 516096 bit | 516096 bit | 516096 bit |
| Core Voltage | 1.5 V (1.425-1.575 V) | 1.5 V | 1.2 V capable (low power) | 1.2 V capable (low power) | 1.5 V | 1.5 V |
| Speed Grade | Standard | Standard | Standard (L family) | Standard (L family) | -1 (faster) | -2 (fastest) |
| Operating Temperature | -40C to +100C (TJ) | -40C to +100C (TJ) | -40C to +100C (TJ) | -40C to +100C (TJ) | -40C to +100C (TJ) | -40C to +100C (TJ) |
| Configuration | Nonvolatile flash, single chip | Nonvolatile flash | Nonvolatile flash | Nonvolatile flash | Nonvolatile flash | Nonvolatile flash |
关键差异点
- True nonvolatile single-chip configuration （对比 A3PE3000-FGG484I (and SRAM FPGAs generally))
- Low-power family migration path on identical footprint （对比 A3PE3000L-FGG484I)
- Speed-grade headroom without redesign （对比 A3PE3000-2FGG484I)
- Trade-off: higher static power than L variant （对比 A3PE3000L-FG484I)
设计说明
Estimated: the 1.5V core rail must stay within 1.425V to 1.575V (+/-5%) under all load conditions. Size the core regulator for the worst-case dynamic current from Libero SoC power analysis of your design (not the device maximum), and add 20-30% margin. Decouple the core with bulk capacitance plus per-bank 0.1uF ceramics placed within 2 mm of the ball vias. I/O bank rails are powered separately; group banks by interface voltage so mixed-voltage systems do not require level translators.
The 484-ball FBGA requires a planned breakout: use dog-bone via fan-out on outer perimeter rows and via-in-pad for inner rows if layer count allows. Signals leaving the array should exit on internal layers to keep the outer rows routable. Follow Microchip's ProASIC3E PCB layout guidelines in the family datasheet for land pattern and escape geometry. Reserve at least two power planes: a solid 1.5V core plane and segmented I/O planes split by bank voltage domain.
Do not assume cross-family migration is drop-in: Xilinx Spartan-6, Lattice MachXO2, and Intel MAX 10 parts with similar density (per ETEI listings) use entirely different packages and pinouts. Within the Microchip family, when substituting A3PE3000L variants, remember the core can run at 1.2V - if your board supplies a fixed 1.5V, confirm the L variant's 1.5V operation and re-run timing analysis, since lower-voltage grades have different timing derating.
Estimated: at moderate toggle rates typical of this density class, power dissipation in the 484-BGA stays in the low single-digit watt range; the large BGA land array spreads heat effectively through the PCB. Use at least a 4-layer board with copper pours connected to the ground array. For prolonged operation near +100C junction temperature limit in high-ambient enclosures, run the Libero power estimator and verify theta-JA from the datasheet thermal table against your airflow conditions.
合规信息
FG suffix indicates standard package; FGG suffix denotes Pb-free green package per Microchip convention, but explicit compliance declarations for this MPN were not present in the provided data. Verify on the official Microchip product page.