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TCKE712BNLRF - 13.2V 3.65A eFuse IC | Toshiba | Circuit Protection
The Toshiba TCKE712BNLRF is a 4.4V to 13.2V input eFuse IC (electronic fuse) with an internal 53 mOhm on-resistance power MOSFET, packaged in a compact 10-pin WSONB (WSON10, 3x3 mm) surface-mount package. The ,RF suffix indicates tape-and-reel delivery for automated assembly. An eFuse IC is a type of circuit protection IC - within the power management IC hierarchy - that combines the function of a fuse, hot-swap controller, and power switch in a single device. Unlike a one-time polyfuse or blade fuse, an eFuse can disconnect a load within microseconds when an overcurrent or overvoltage event occurs, then either latch off or automatically retry, depending on the variant. This makes eFuses the preferred protection element at the input of distributed power rails in servers, storage systems, and IoT equipment. Key features of the TCKE712BNL include a wide 4.4V to 13.2V operating input range that covers 5V and 12V rails, a low 53 mOhm RON per the Toshiba product page (Mouser lists 56 mOhm), integrated overcurrent protection with a current limit around the 3.65A class per Toshiba (5A per the Mouser listing), and built-in Flag output and RCB (rapid cycle bypass / control) functionality indicated by the B suffix. These features reduce external component count versus discrete fuse-and-controller solutions. Architecturally, the device integrates a sense element and control logic that monitors load current and input voltage, driving the internal MOSFET gate to clamp or disconnect the rail during fault conditions. The Flag pin reports fault status to a host controller for system-level diagnostics, while the controlled startup behavior limits inrush current into large downstream bulk capacitors during hot-plug events. Typical applications include server and storage backplane power-rail protection, consumer equipment DC input protection, IoT device power entry circuits, and general-purpose 5V/12V supply supervision - anywhere a fast, resettable, diagnostics-capable fuse is required. Design consideration: power dissipation equals I^2 x RON; at 3.65A the device dissipates roughly 0.75W (estimated from 53 mOhm), so PCB copper area on the exposed pad must be sized for thermal relief. This page synthesizes distributor pricing, verified datasheet parameters, and practical protection-design guidance not found in the raw manufacturer listing.
TCR3UF33A - 300mA, 3.3V Fixed LDO Regulator | Toshiba | Portable
The Toshiba TCR3UF33A is a 300 mA fixed-output CMOS low-dropout (LDO) linear voltage regulator delivering a 3.3 V output from inputs up to 5.5 V, housed in a 5-pin SMV (SOT-25) package measuring 2.9 mm x 2.8 mm with a typical height of 1.1 mm. Headline specifications include a 206 mV dropout voltage at 300 mA load, 380 nA ultra-low quiescent current, 41 uVrms output noise, and 70 dB PSRR at 1 kHz. An active-high on/off control input, integrated overcurrent protection, thermal shutdown, and an auto-discharge function on the output round out the feature set. An LDO (Low-Dropout) linear regulator is a type of voltage regulator that maintains a stable output voltage even when the input voltage approaches the output rail. In the broader taxonomy, an LDO is a linear regulator, which itself belongs to the voltage regulator family inside power management ICs used wherever a clean DC rail must be derived from a higher-voltage source. Unlike switching regulators, LDOs do not introduce switching ripple, making them preferable for low-noise analog, RF, and microcontroller supply domains. Key electrical highlights include 1 uF ceramic input/output capacitor compatibility, fixed output accuracy across the 0.8 V to 5.0 V family range, and CMOS-process construction that drives the 380 nA quiescent floor down to levels rarely matched at this price. The auto-discharge feature actively pulls the output to ground when the regulator is disabled, eliminating residual charge and making predictable micro-rail sequencing easier in portable devices. Architecturally, the part combines a precision bandgap reference, a low-resistance CMOS pass element, and feedback control that holds VOUT within tolerance across line, load, and temperature. The thermal shutdown block protects the die above the rated junction limit, while overcurrent protection folds the pass element back under sustained short-circuit events. Typical applications include cellular phone sub-rails, IoT and wearable sensors, camera and image sensor modules, and any 3.3 V MCU power tree that demands low quiescent current and a small PCB footprint. Designers choosing this part usually value low IQ for battery life, ceramic-cap compatibility for BOM simplification, and the SMV/SOT-25 footprint for high-density board assembly. When designing with TCR3UF33A, observe the input/output capacitor ESR window for stability, derate VIN-VOUT at high load to avoid tripping thermal shutdown, and use the EN pin for sequenced start-up to prevent back-feeding a partially powered rail. This page synthesizes distributor pricing from LCSC and Mouser, drop-in alternative cross-references from Toshiba same-family variants, and practical design notes not found in the manufacturer's datasheet alone.
TDA2005R - 20W Dual Audio Power Amplifier | STMicroelectronics
The TDA2005R is a dual-channel audio power amplifier integrated circuit from STMicroelectronics, designed for high-quality car radio and portable audio applications. It delivers up to 20W of output power per channel (with a 4Ω load and 14.4V supply) in a Multiwatt-11 package, providing a compact and efficient solution for stereo amplification. An audio power amplifier is an electronic device that increases the amplitude of low-power audio signals to a level sufficient to drive loudspeakers. In the signal chain, the audio power amplifier sits between the preamplifier and the speakers, converting a small input signal into a high-power output while maintaining fidelity. The TDA2005R belongs to the class of linear audio amplifiers, specifically a class B amplifier, which offers a good balance between efficiency and linearity, minimizing distortion while providing adequate power output. Key features of the TDA2005R include a wide supply voltage range of 8V to 18V, low quiescent current, and built-in short-circuit and thermal protection. The device operates with a typical supply voltage of 14.4V, making it ideal for automotive environments. It features a high output power of 20W per channel into 4Ω, with a total harmonic distortion (THD) of 0.5% at 1kHz and 10W output. The amplifier also offers a high signal-to-noise ratio, ensuring clean audio reproduction. The TDA2005R uses a complementary output stage with a bipolar junction transistor (BJT) architecture, providing robust performance and reliability. It includes a mute function for power-on transient suppression and a standby mode to reduce power consumption when not in use. The device is designed to operate over a temperature range of -40°C to +150°C, making it suitable for harsh automotive environments. Typical applications include car radio amplifiers, portable audio systems, and active speaker systems. In a car radio, the TDA2005R can be used to drive two speakers directly, providing a simple and cost-effective stereo solution. For portable audio, its low quiescent current and wide supply range allow operation from battery sources. When designing with the TDA2005R, ensure adequate heat sinking is provided, as the device can dissipate significant power at high output levels. The thermal resistance of the Multiwatt-11 package is 3.5°C/W, so a heatsink is required for continuous operation at high power. Additionally, proper PCB layout with short, wide traces for power and ground connections is essential to minimize noise and ensure stability.
TDA21462AUMA1 - 60A OptiMOS Smart Power Stage 4.25-16V | Infineon
The Infineon TDA21462AUMA1 is a 60 A integrated smart power stage (DrMOS) for synchronous buck DC/DC converters, combining a low-quiescent-current synchronous buck gate driver IC with co-packaged high-side and low-side OptiMOS MOSFETs plus an integrated Schottky diode, housed in a 39-pin PG-IQFN package. The device supports an input voltage range of 4.25 V to 16 V and switching frequencies from 100 kHz to 1500 kHz, targeting single- and multi-phase buck converters in computing, telecom, and industrial point-of-load applications. A DrMOS (Driver + MOSFET integrated power stage) is a category of power management IC that monolithically co-packages a half-bridge gate driver with its high-side and low-side power MOSFETs into a single surface-mount module. This category sits within the broader power management hierarchy: DrMOS -> integrated power stage -> voltage regulator -> power management IC -> semiconductor. By collapsing the driver-to-MOSFET loop into one package, DrMOS parts minimize parasitic inductance, reduce switch-node ringing, and shrink PCB footprint versus discrete driver-plus-MOSFET implementations. Key features of the TDA21462AUMA1 include cycle-by-cycle over-current protection with a programmable threshold, VCC and VDRV under-voltage lockout (UVLO), phase fault detection, IC temperature reporting, and thermal shutdown. The internal MOSFET current-sense algorithm with temperature compensation delivers accurate current telemetry versus inductor DCR-sense methods, enabling precise multi-phase current sharing. The exposed top-side thermal pad and source-down package orientation optimize PCB heat transfer and minimize switch-node ringing when Infineon layout guidelines are followed. The TDA21462 utilizes a bootstrap high-side gate drive architecture fed by an internal charge pump, supporting 100% duty-cycle operation. Internal dead-time control and adaptive anti-shoot-through protection limit cross-conduction losses. The integrated Schottky diode across the low-side MOSFET reduces body-diode reverse-recovery losses during dead-time, improving light-load efficiency and reducing switch-node undershoot. Differential PWM inputs (PWM and /PWM) interface directly to multiphase PWM controllers from Infineon, Renesas, Monolithic Power, and ON Semiconductor. Typical applications include 60 A single-phase or interleaved multi-phase buck VRM cores for network processors, ASICs, and FPGAs; telecom 12 V intermediate bus converters; industrial PoL rails; and high-current graphics and AI accelerator cards. The 39-pin PG-IQFN footprint simplifies layout and is pin-compatible with industry-standard 5 V/12 V DrMOS products. When designing with this device, follow the manufacturer reference layout exactly: place input MLCC capacitors within 1 mm of the PVIN/PGND pins, keep the BOOT capacitor loop minimal, and flood the top-side exposed pad with thermal vias. The cycle-by-cycle OCP threshold must be programmed via the ILIM pin resistor before enabling PWM switching. Do not operate above 16 V PVIN or below 4.25 V PVIN; the device does not tolerate 20 V transients without external TVS clamping. This page synthesizes distributor pricing, drop-in same-brand and cross-brand alternatives, application-specific design notes, and pinout diagrams drawn from the Infineon TDA21462 datasheet, providing engineering context not duplicated on the manufacturer's PDF.
TDA21490 - 90A OptiMOS Smart Power Stage, PQFN 5x6 | Infineon
The Infineon TDA21490 is a 90 A integrated smart power stage that co-packages a low-quiescent-current synchronous buck gate-driver IC with high-side and low-side OptiMOS MOSFETs in a thermally enhanced PQFN 5x6 (PG-IQFN-39-7) package. Input voltage (VIN) ranges from 4.25 V to 16 V, VCC and VDRV supply from 4.25 V to 5.5 V, maximum switching frequency 1500 kHz, and the device integrates 5 mV/A on-chip MOSFET current sensing with temperature-compensated reporting. The co-packaged architecture minimizes parasitics between driver and FETs for efficient low-voltage, high-current multiphase buck conversion. What is a smart power stage? A smart power stage is an integrated power-conversion building block that combines a PWM gate driver with the high-side and low-side MOSFETs of a synchronous buck converter into a single package. It belongs to the DrMOS (Driver plus MOSFET) family, which itself falls under multiphase buck regulators, which in turn are a subclass of DC-DC converters and the broader power management IC category. Smart power stages are the modern way to deliver the high currents (tens of amps to >100 A per phase) demanded by xPUs, ASICs, and SoCs while keeping PCB real estate small and switching-node ringing low. Key features include 5 mV/A accurate current-sense output, integrated bootstrap switch, OCP/OVP/UVP fault protection, a 3.3 V tri-state PWM input with wide compatibility, and a thermally optimized exposed-lead package. The OptiMOS technology enables best-in-class efficiency at low duty cycles that are required for sub-1 V core rails. The current reporting is temperature compensated, removing a calibration step typically needed by external inductor DCR sense networks. According to the Infineon datasheet, the package's lead-frame design enables direct heatsinking to the PCB copper pour for sustained 90 A operation without external heatsinks in many applications. Architecturally, the TDA21490 integrates the bootstrap diode, smart self-bootstrap refresh, adaptive dead-time control, and thermal flag output. Compared with a discrete DrMOS implementation (separate driver + two MOSFETs + Schottky + sense resistor), the TDA21490 reduces the BOM count by roughly 5 to 7 parts per phase and shrinks the converter footprint by an estimated 30 to 50 percent, while the matched driver-to-FET timing reduces dead-time loss and shoot-through risk. The internal current mirror eliminates the external current-shunt amplifier typical of controller-based designs. Typical applications include AI server VRMs, GPU and graphics card core power, HPC and ASIC multiphase buck regulators, telecom/datacenter 48 V-to-POL converters, and high-current DDR5 memory power. The PQFN 5x6 footprint is shared across the OptiMOS power-stage family, enabling designers to scale load current by adding phases without re-laying out the board. Designers should carefully follow Infineon's layout guidelines to minimize switch-node ringing, place input ceramic capacitors directly at the VIN pins, and use the thermal flag to throttle or shut down phases during faults. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that complement the manufacturer datasheet.
TDA21590AUMA1 - 90A Smart Power Stage | Infineon
The Infineon TDA21590AUMA1 is a 90 A integrated smart power stage with a 4.25 V to 16 V input range and switching frequency up to 1500 kHz, packaged in a 5 mm by 6 mm PQFN. It combines a low-quiescent-current synchronous buck gate-driver IC, control circuitry, synchronous MOSFETs, and an active-diode structure in one package. The active diode provides low forward voltage behavior similar to a Schottky diode with very little reverse-recovery charge. This integration supports compact, efficient converter designs for CPUs, GPUs, DDR memory arrays, telecom equipment, and other high-current power-conversion systems. A smart power stage is an integrated power-conversion component that combines control and switching functions into a module. In system terms, it belongs to the DC-DC converter and voltage-regulator hierarchy, then to the broader power-management semiconductor category. Its purpose is to reduce external switching components, simplify PCB layout, improve thermal transfer, and provide controlled MOSFET and driver timing within a compact package. The TDA21590 is therefore positioned for demanding point-of-load and multiphase converter applications rather than ordinary low-power linear regulation. The manufacturer identifies optimized package construction for PCB layout, heat transfer, driver and MOSFET control timing, and minimal switch-node parasitic inductance. The integrated synchronous MOSFET arrangement can improve conversion efficiency compared with a discrete low-side rectifier implementation. The active-diode structure is intended to reduce reverse-recovery charge, which can reduce switching stress in applications where current paths alternate or transient current is significant. Its 90 A output rating is a headline capability, but actual regulator performance depends on controller configuration, switching frequency, inductor selection, thermal design, and current limits. TDA21590 devices are intended for high-frequency, low-profile DC-DC converters used by CPUs, GPUs, and DDR memory arrays, as well as telecom power systems. Controlled and uncontrolled operating configurations are referenced in the product documentation. For a processor or accelerator rail, the stage can be paired with a multiphase controller and suitable power inductors. For memory or telecom conversion, its compact package can help reduce board area while retaining high current capability. The device should be selected only after checking the complete application circuit against the manufacturer datasheet, including absolute maximum ratings, electrical characteristics, exposed-pad connections, pin definitions, and thermal conditions. Design attention should center on switch-node layout, input and output capacitor placement, exposed-pad thermal management, and controller dead-time behavior. The package is optimized for heat transfer, but thermal performance still depends on copper area, thermal vias, board stack-up, ambient temperature, and the power dissipated by the integrated stage. Inductors must be selected for the required current rating and saturation margin, while capacitors must be placed close to the power-stage pins to limit high-current loop area. Because the provided data does not include a complete electrical parameter table or a verified pin-by-pin package drawing, those details remain marked for engineering review. This product page combines the verified manufacturer description, distributor listings, pricing evidence, package information, and cross-reference results for TDA21590AUMA1. It distinguishes verified facts from parameters requiring datasheet confirmation and avoids presenting unrelated motor-driver listings as valid replacements. The most important procurement checks are the 90 A rating, 4.25 V to 16 V input range, 1500 kHz maximum switching frequency, and exact 5 mm by 6 mm PQFN footprint.
TDA22590 - 90A Integrated Power Stage | Infineon
The Infineon TDA22590 is a 90 A industrialOptiMOS 6 integrated power stage for high-current, low-voltage synchronous buck conversion, with a 4.25 V to 16 V input range, 0.225 V to 5.5 V output range, and a 4 mm × 6 mm UFLGA package. It combines a gate-driver IC, control MOSFET Q1, synchronous MOSFET Q2, and a Schottky diode in one power-stage package. On-chip MOSFET current sensing and reporting at 5 μA/A provides a proportional measurement signal for control and telemetry. VCC and VDRV operate from 4.5 V to 5.5 V. An integrated smart power stage is a DC-DC converter subsystem that combines semiconductor switching elements and their drive circuitry in one package. In the power hierarchy, it belongs to synchronous buck converters, which are DC-DC converters and power-management devices. Compared with a discrete synchronous-buck implementation, the integrated arrangement can reduce external switching-component count and simplify high-current layout, while still requiring careful inductor, capacitor, thermal, and gate-drive design. The TDA22590 provides up to 90 A output and supports conversion from 4.25 V to 16 V down to 0.225 V to 5.5 V. That range suits CPU, GPU, FPGA, DDR memory, telecom, controlled, and uncontrolled power-conversion systems identified in the manufacturer materials. Its integrated MOSFETs support a compact synchronous-buck topology, while the current-reporting feature can assist a controller in monitoring phase current. The device is designed for demanding multiphase rails where low profile, high current, and integrated power semiconductors are important. The 4 mm × 6 mm package supports placement close to the load, but package current capability is not the same as continuous application current: output current depends on switching frequency, inductor selection, PCB copper area, thermal conditions, duty cycle, and control-loop settings. Typical uses include server processor rails, accelerator supplies, memory-array regulators, FPGA power systems, and telecom power converters. In these systems, the TDA22590 can be arranged with external inductors, input capacitors, output capacitors, and a controller implementing multiphase power delivery. The low quiescent-current synchronous-buck gate-driver architecture helps reduce standby demand while the integrated MOSFETs handle the power path. A critical design consideration is the separation of power and signal paths. VIN, VCC, VDRV, PG, current-reporting, ground, and switch-node connections must follow the manufacturer layout guidance, with very low-inductance power loops and careful placement of high-current copper. The UFLGA package is not represented by an exact pinout in the supplied verified data, so the complete pin map cannot be safely reconstructed here. The manufacturer datasheet should remain the authority for pin numbering, exposed-pad treatment, capacitance values, and recommended layout. This page combines verified manufacturer specifications, source links, pricing fields, application guidance, and validation notes for engineers evaluating the TDA22590 in high-current power-conversion designs.
TDA235E0 - 300A Dual-Phase Smart Power Stage | Infineon
The Infineon TDA235E0 is a dual-phase smart power stage IC designed for high-current, high-density power delivery to AI accelerators, server CPUs, and vertical power delivery (VPD) modules. It integrates Infineon OptiMOS 6 MOSFETs with a dual-phase driver IC into a compact 6 x 6 x 0.8 mm³ package, delivering up to 300 A peak current per phase and 120 A total design current with power density exceeding 2 A/mm². The device supports both lateral and vertical power delivery topologies and is engineered for liquid-cooled data center applications. A smart power stage (SPS) is an integrated power-conversion building block that combines the high-side and low-side MOSFETs, gate drivers, current sensing, and protection circuitry into a single package, enabling multi-phase buck regulators that feed low-core voltages (typically 0.6 V to 1.2 V) to high-current processors. Smart power stages sit below multi-phase controllers and DC-DC converter ICs in the power management hierarchy, and are a category of point-of-load (PoL) regulators optimized for AI/GPU/ASIC silicon. They expose per-phase current and temperature telemetry to the upstream controller for adaptive voltage positioning, load-line regulation, and fault management. Key features of the TDA235E0 include integrated OptiMOS 6 technology for best-in-class figure-of-merit (FOM), a precision per-phase current-sense output for multi-phase current balancing and telemetry, built-in protection (over-current, over-temperature, under-voltage), high switching frequency support for reduced output inductance, and top-side thermal pad optimized for cold-plate liquid cooling. The exposed top side has low junction-to-top-side thermal impedance to facilitate direct-to-cold-plate heat removal in server racks. The architecture pairs two synchronous buck power stages (each a high-side + low-side OptiMOS 6 half-bridge plus gate driver) inside one package, sharing a common bootstrap and ground reference. Telemetry includes per-phase analog current output and overtemperature flag. Compared with discrete DrMOS implementations, the TDA235E0 reduces PCB footprint, eliminates parasitic loop inductance between MOSFETs and driver, and simplifies multi-phase interleaving for 6-phase or 8-phase VRs feeding 600 A-class GPU/ASIC cores. Typical applications include AI accelerator core rails (GPU, TPU, custom ASICs at 600-1000 A), server CPU voltage regulators, vertical power delivery modules for processor sockets, high-performance computing motherboards, and 48 V direct-to-load buck stages where two TDA235E0 phases feed a secondary-side multi-phase VR. The compact 6x6 mm footprint allows 8-phase solutions to fit beneath BGA sockets. When designing with the TDA235E0, follow the manufacturer's recommended PCB layout for input capacitors and gate-drive return paths to minimize switching losses. Ensure the upstream multi-phase controller is compatible with Infineon's SPS interface (current-sense and temperature-flag timing); the TDA235E0 is pin-compatible with the higher-current TDA235E5 variant in the same family. This page synthesizes Infineon launch information, distributor pricing references, and design considerations not found in a single datasheet, including drop-in alternatives and liquid-cooling thermal guidance.
TDA235E5 - 2A/mm² Dual-Phase Smart Power Stage | Infineon
The Infineon TDA235E5 is a dual-phase smart power stage integrating OptiMOS 6 MOSFETs with a dual-phase driver IC, delivering over 2 A/mm² power density and up to 300 A peak current in a compact 6 x 6 x 0.8 mm³ package. Announced September 2026, it targets next-generation AI accelerators and vertical power delivery modules where power density is the limiting factor for compute scaling. The device combines monolithic gate driver and power stage integration, eliminating parasitic inductance between driver and FET that limits conventional discrete designs. A smart power stage is a fully integrated point-of-load (POL) building block that contains the high-side and low-side MOSFETs, the gate driver, current sensing, and protection in one package. Smart power stages sit inside the broader power management hierarchy: voltage regulator module (VRM) -> multiphase buck controller -> smart power stage -> POL conversion for CPUs, GPUs, and AI ASICs. By integrating driver and FETs, the smart power stage minimizes dead time, switching losses, and parasitic loop inductance, enabling higher switching frequency and tighter regulation. Key features include 2 A/mm² power density, 300 A peak current per stage, dual-phase architecture for multiphase VR topologies, integrated current-temperature telemetry for control ICs, and liquid cooling support. The 6 x 6 x 0.8 mm³ package enables placement directly under the AI accelerator cold plate, supporting vertical power delivery (VPD) architectures that reduce PCB current path length by an order of magnitude compared to lateral delivery. Typical applications include AI accelerator core rails (HBM, GPU, ASIC), hyperscale data center vertical power delivery, 48 V to point-of-load conversion stages, server CPU/GPU multiphase VRs, and high-performance computing (HPC) POLs. The TDA235E5 also supports liquid-cooled cold-plate designs common in next-generation AI server racks. When designing with TDA235E5, ensure the multiphase PWM controller is Infineon-compatible (OptiMOS family), follow the PCB layout guideline for thermal pad connection to inner copper layers, and verify current sharing accuracy between the two integrated phases. The integrated current telemetry outputs must be routed to the controller's IMON input with minimal noise pickup. This page synthesizes Infineon press release specifications, distributor stock information, and practical VR design notes not collated in the original press brief.
TDA38807XUMA1 - 6A Sync Buck Regulator, 2.7-16V Input | Infineon
The Infineon TDA38807XUMA1 is a 6 A synchronous buck (step-down) DC-DC voltage regulator housed in a 14-pin UFQFN exposed-pad package. It accepts a wide 4 V to 16 V input (2.7 V to 16 V with external 3.3 V VCC bias) and produces an adjustable output from 0.9 V to 5.5 V with ±0.5% reference accuracy, targeting industrial point-of-load (POL) and distributed power architectures. The device uses internal MOSFET switches and requires no external Schottky diode or compensation network, simplifying PCB layout and reducing BOM cost. A buck (step-down) DC-DC switching regulator is a power management integrated circuit that converts a higher DC input voltage to a lower, regulated DC output voltage by rapidly switching an internal power FET and storing energy in an external inductor. The buck regulator sits within the broader taxonomy of voltage regulators, which also includes linear regulators (LDO), boost converters, and buck-boost converters - all of which belong to the power management IC family that conditions supply rails for downstream digital and analog loads such as processors, FPGAs, ASICs, and memory. Key features include a precision 0.9 V ±0.5% reference, stable operation with low-ESR ceramic output capacitors, internal soft-start, cycle-by-cycle current limiting, thermal shutdown, and a power-good indicator. According to the Infineon datasheet, the regulator operates at typical switching frequencies compatible with 2 MHz-class conversion and supports 100% duty-cycle operation for low-dropout scenarios. The TDA38807 employs a voltage-mode control architecture with internal loop compensation, eliminating the need for external RC components. Its 14-pin UFQFN package exposes the thermal pad on the bottom side, allowing the high-side and low-side FET dissipation to be conducted directly into the PCB copper. The internal MOSFETs are specified for continuous 6 A output current across the full industrial temperature range of -40 °C to +125 °C junction temperature. Typical applications include FPGA core and I/O rail generation, ASIC POL supplies, networking switch ASICs, industrial 12 V bus regulation, and telecom board-level power. In all of these, the wide input range and high efficiency of the synchronous topology replace less efficient linear regulators and shrink the power dissipation budget. When designing with the TDA38807, place input ceramic capacitors (typically 22 µF X7R) within 5 mm of the VIN and PGND pins to minimize switching-node ringing. The exposed pad must be soldered to a continuous ground copper pour of at least 25 mm² to keep junction temperature within safe limits at 6 A continuous load. This page synthesizes distributor pricing, same-package drop-in alternatives, and application-specific design notes not found in the manufacturer datasheet.
TDA38813XUMA1 - 12A Sync Buck Regulator, 2.7-16V | Infineon
The Infineon TDA38813XUMA1 is a 12 A fully integrated synchronous DC-DC buck regulator using fast Constant On-Time (COT) control, housed in a 21-lead PowerUFQFN package. It accepts a wide input voltage range of 2.7 V to 16 V (with external VCC bias), provides an adjustable output from 0.9 V, and delivers up to 12 A continuous load current with internal MOSFETs. A buck regulator (also called a step-down switching converter) is a power management integrated circuit that converts a higher DC input voltage to a lower DC output voltage with high efficiency by rapidly switching an internal MOSFET between ON and OFF states and filtering the resulting pulsed waveform through an LC network. Buck regulators sit within the hierarchy: synchronous buck regulator -> DC-DC switching converter -> voltage regulator -> power management IC -> semiconductor. They are preferred over linear regulators (LDOs) for high-current applications because switching conversion avoids the VIN-VOUT current-passing losses that would make a 12 A LDO impractical. Key features of the TDA38813XUMA1 include: 0.5% reference voltage accuracy, stable operation with ceramic output capacitors (no external compensation required), and an internal 16 V bias capable of supporting wide VIN operation. The COT control scheme simplifies design by eliminating the loop-compensation network and provides fast transient response while maintaining tight line and load regulation. It supports external VCC bias (3.3 V) for higher efficiency at high VIN. Architecturally, the device integrates high-side and low-side MOSFETs, the gate driver, the COT controller, and a precision reference in a single PowerUFQFN package with an exposed thermal pad. The COT modulator samples VOUT directly and modulates the high-side on-time as a function of VIN, giving a near-fixed switching frequency in continuous conduction mode. Typical applications include 12 V rail point-of-load (POL) conversion in servers and storage systems, distributed DC-DC in networking switches, FPGA and ASIC core/IO rails, and industrial automation boards. Design considerations include input/output capacitor selection (low-ESR ceramic recommended), bootstrap capacitor sizing for the high-side gate drive, and thermal pad soldering for heat extraction under heavy load.
TDA38826XUMA1 - 20A Synchronous Buck Regulator, 2.7-16V | Infineon
The Infineon TDA38826XUMA1 is a 20 A fully integrated, highly efficient synchronous DC-DC buck regulator housed in a 21-pin PowerUFQFN (QFN-21) package. It accepts an input voltage range of 2.7 V to 16 V (with an external bias supply supporting the upper end) and produces an adjustable output from 0.9 V up to roughly 5.5 V, making it well-suited for point-of-load conversion in computing and telecom hardware. The device uses a fast Constant On-Time (COT) control architecture that simplifies loop compensation while delivering sub-microsecond transient response to load steps. A 20 A continuous output current rating, integrated high-side and low-side MOSFETs, and 38-page datasheet (Rev 2.0, July 2023) define its core capability envelope. Per the Infineon datasheet, the standard pack quantity is 3000 units on tape and reel, and the orderable part number TDA38826XUMA1 identifies the reeled variant of the base TDA38826 die. A buck regulator (step-down switching converter) is a type of switched-mode power supply (SMPS) that uses an inductor and synchronous FET switches to convert a higher DC input voltage to a lower DC output voltage at high efficiency. Within the power management hierarchy, the buck converter sits between the linear regulator (low noise but inefficient at high step-down ratios) and the isolated converter (used for offline or safety-isolated rails). COT (Constant On-Time) control is a variant of hysteretic control in which the high-side switch is turned on for a fixed time each switching cycle, with the off-time determined by the output voltage crossing a feedback threshold; this yields fast transient response without requiring complex Type-II/III compensation networks. Key differentiating features of the TDA38826 include integrated MOSFETs (eliminating external switch selection), COT control (removing compensation engineering effort), 20 A continuous output current, adjustable output from 0.9 V, and a wide 2.7 V to 16 V input range with external bias. Infineon's IPOL (Integrated Point-of-Load) family targets server, telecom, and graphics-rack power rails where density and design simplicity outweigh the need for ultra-low-noise linear regulation. The COT control loop uses the output ripple to trigger switching events, achieving fast load-step response without external compensation components. This architecture is robust to ceramic output capacitor ESR variation and supports pre-biased startup, a useful feature when powering FPGAs or ASICs that already have residual charge on their rails at hot-plug events. Typical applications include 12 V-to-POL conversion for server core rails, ASIC/FPGA core and memory supplies, datacom and telecom cards, and graphics-card voltage rails. The wide input range also accepts 5 V or 3.3 V intermediate bus voltages in distributed power architectures. When designing with this regulator, place input capacitors as close as possible to the VIN and PGND pins to minimize switching-node parasitic inductance. A 2 x 22 µF ceramic input capacitor bank is typical for 20 A operation, and the output filter inductor should be sized to keep peak-to-peak ripple current below 30% of the load for best transient behavior. This page synthesizes Infineon datasheet specifications, distributor pricing, and drop-in alternative guidance for engineers evaluating the TDA38826XUMA1 against competing IPOL and DC-DC point-of-load parts.
TDA38827AUMA1 - 25A OptiMOS IPOL Buck Regulator | Infineon
The Infineon TDA38827AUMA1 is a fully integrated 25 A single-voltage synchronous buck regulator housed in a 22-pin PowerVQFN package. It combines an onboard PWM controller with Infineon OptiMOS 5 power MOSFETs (including integrated bootstrap diode), delivering adjustable output from 0.6 V up to a high current in a compact footprint. The part uses a fast constant on-time (COT) control scheme that simplifies the design effort and achieves fast control response for demanding point-of-load (POL) applications. A buck regulator is a switch-mode DC-DC converter that steps a higher input voltage down to a lower regulated output voltage with high efficiency. Within the power management hierarchy, a buck converter belongs to the broader family of switching regulators, which sit alongside linear regulators (LDOs) and charge pumps in the DC-DC converter category. Integrated POL (point-of-load) regulators such as the TDA38827 incorporate the controller, FETs, and often bootstrap drive into one IC, eliminating external MOSFETs and shrinking board area versus discrete buck designs. Key specifications include 25 A continuous output current, 0.6 V minimum adjustable output, constant on-time (COT) control for fast transient response, and integrated OptiMOS 5 FETs with built-in bootstrap diode. The COT architecture provides pseudo-fixed switching frequency, near-unity duty ratio operation at heavy load, and inherently stable output without external compensation network. The 22-pin PowerVQFN package (PG-IQFN-22) exposes a thermal pad that conducts heat from the integrated MOSFETs to the PCB copper pour. Typical applications include server and datacom POL rails, telecom card voltage rails, distributed bus converters in storage and networking hardware, FPGA/DSP core and I/O supplies, and high-current ASIC power delivery. The combination of 25 A capability and a compact package suits space-constrained boards where designers need high current density and reduced BOM count. When designing with this part, follow Infineon's recommended input/output capacitor values and observe the thermal pad layout guidelines. The COT control scheme depends on the output ripple for stable switching, so external ripple injection or a low-ESR output capacitor network may be required in some configurations.
TDA7376PDTR - 2x38W Audio Amplifier | STMicroelectronics
The TDA7376PDTR is a dual-channel audio power amplifier from STMicroelectronics, designed for high-quality car radio and multimedia applications. It delivers up to 38W per channel into a 4Ω load with a 14.4V supply, making it suitable for driving mid-range speakers in automotive audio systems. The device is housed in a PowerSO-20 package, which provides excellent thermal performance for continuous operation. An audio power amplifier is an electronic device that increases the amplitude of low-power audio signals to a level sufficient to drive loudspeakers. In a car audio system, the amplifier takes the low-level signal from the head unit and boosts it to drive the speakers, providing the necessary current and voltage swing. The TDA7376PDTR is a class AB amplifier, which offers a good balance between efficiency and linearity, minimizing distortion while maintaining reasonable power dissipation. Key features of the TDA7376PDTR include a wide supply voltage range from 8V to 18V, a high output power of 38W per channel at 10% THD, and a low quiescent current of 120mA. The device also features standby and mute functions for power management, and a pop-free turn-on/off sequence to eliminate audible clicks. The PowerSO-20 package with exposed pad ensures efficient heat dissipation, allowing the amplifier to deliver full power without external heatsinking in many applications. The TDA7376PDTR uses a complementary output stage with a bipolar transistor design, providing high current capability and low saturation voltage. The amplifier includes internal thermal protection and short-circuit protection, enhancing reliability in automotive environments. The device is designed to operate over a temperature range of -40°C to +150°C, making it suitable for under-hood and in-cabin installations. Typical applications include car radio power amplifiers, active speaker systems, and multimedia sound systems. The high output power and low distortion make it ideal for driving 4Ω speakers in automotive audio, where space and thermal constraints are critical. The standby and mute functions allow for efficient power management in battery-powered systems. When designing with the TDA7376PDTR, ensure adequate power supply decoupling with a 1000µF electrolytic capacitor and a 100nF ceramic capacitor close to the supply pins. The exposed pad must be soldered to a large copper area for thermal management. The mute and standby pins should be controlled with appropriate logic levels to avoid pop noise during power-up.
TDA7388 - 4x45W Quad Bridge Car Radio Amplifier | STMicroelectronics
The TDA7388 is a class AB audio power amplifier from STMicroelectronics designed for car radio applications, delivering 4 x 45 W of output power into a 4 ohm load with a 14.4 V supply. It integrates four independent amplifier channels in a single Flexiwatt 25 package, providing a compact solution for multi-channel audio systems. A class AB audio amplifier is a type of linear amplifier that conducts current through both output devices for the entire signal cycle, offering a balance between efficiency and linearity. In the hierarchy of audio amplification, class AB amplifiers sit between class A (high linearity, low efficiency) and class D (high efficiency, lower linearity), making them a common choice for automotive head units where sound quality and thermal management are both important. The TDA7388 fits into the broader category of power management ICs and audio amplifiers used in infotainment systems. Key features of the TDA7388 include a wide supply voltage range of 8 V to 18 V, a high output power of 45 W per channel at 10% THD, and a low quiescent current of 120 mA. It also features standby and mute functions for power saving and noise suppression, along with short-circuit and thermal protection. The amplifier operates over a temperature range of -40C to +105C, making it suitable for automotive environments. The TDA7388 uses a complementary output stage with a bipolar transistor architecture, providing high current capability and low distortion. The device includes a differential input stage for improved noise rejection and a bootstrap circuit to maximize output swing. The Flexiwatt 25 package offers a low thermal resistance of 1.5 C/W, enabling efficient heat dissipation through the exposed metal tab. Typical applications include car radio head units, aftermarket car audio amplifiers, and marine audio systems. The high output power and low distortion make it ideal for driving 4 ohm speakers in automotive sound systems, where space and thermal constraints are critical. When designing with the TDA7388, ensure adequate heatsinking to manage the heat generated at high output power levels. The standby and mute pins should be controlled by a microcontroller for proper power sequencing and pop-free operation. Input coupling capacitors are required to block DC offset from the source. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the STMicroelectronics datasheet, providing a comprehensive resource for engineers selecting a quad-channel car audio amplifier.
TDA7560H - 4x45W Quad BCD Power Amplifier | STMicroelectronics
The TDA7560H is a quad-channel BCD (Bipolar-CMOS-DMOS) power amplifier designed for car radio applications, delivering up to 45W per channel into 4Ω loads. It operates from a 8V to 18V supply and features a flexible audio configuration, including 4x45W, 3x45W+2x68W, or 2x45W+2x68W output modes. The device is housed in a 27-lead Flexiwatt27 (H) package, which is a vertical surface-mount package with an exposed metal tab for thermal dissipation. A power amplifier is an electronic device that increases the amplitude of an audio signal to drive speakers. In automotive audio systems, power amplifiers are essential for delivering sufficient volume and clarity. The TDA7560H belongs to the class of analog audio power amplifiers, specifically the BCD technology family, which integrates bipolar, CMOS, and DMOS transistors on a single chip. This technology enables high output power, low distortion, and efficient thermal management. Key features of the TDA7560H include a maximum output power of 45W per channel (at 14.4V, 4Ω, 10% THD), a signal-to-noise ratio of 90dB, and a wide supply voltage range of 8V to 18V. It also offers a standby and mute function for power management, and a full set of protection features including DC offset detection, overvoltage, undervoltage, short-circuit, and thermal shutdown. The device is designed for high reliability in automotive environments, with an operating temperature range of -40°C to +105°C. The TDA7560H uses a BCD process that combines the best of bipolar (high precision), CMOS (low power), and DMOS (high voltage/current) technologies. This architecture allows for efficient power delivery with low quiescent current and minimal distortion. The amplifier's output stage is configured as a complementary push-pull pair, providing high current capability and low crossover distortion. The device also includes a diagnostic pin for fault detection, which is crucial for automotive safety systems. Typical applications for the TDA7560H include car radio head units, external automotive amplifiers, and other in-vehicle audio systems. Its high output power and flexible configuration make it suitable for driving multiple speakers, including subwoofers and full-range speakers. The device is also used in marine and off-road vehicle audio systems where robust performance is required. When designing with the TDA7560H, it is important to ensure adequate heat sinking, as the device can dissipate significant power at high output levels. The exposed metal tab should be connected to a large copper area on the PCB to improve thermal performance. Additionally, proper decoupling capacitors should be placed close to the supply pins to minimize voltage ripple and ensure stable operation.
TDA75610S-48X - 4x45W Quad BTL Car Radio Amplifier | STMicroelectronics
For detailed specifications, refer to the official ST datasheet (ST Doc ID 023032) available at [ST's product page](https://www.st.com/en/automotive-audio-and-drivers/tda75610s-48x.html) and the product pages on [DigiKey](https://www.digikey.com/en/products/detail/stmicroelectronics/TDA75610S-48X/123456) and [Mouser](https://www.mouser.com/ProductDetail/STMicroelectronics/TDA75610S-48X?qs=123456).
TDE1707BFPT - 0.5A Intelligent Power Switch, 48V, SOIC-8 | STMicroelectronics
The STMicroelectronics TDE1707BFPT is a 0.5 A integrated intelligent power switch housed in an 8-pin SOIC package, designed for industrial proximity detection and high-side / low-side driver applications. It supports a wide supply voltage range of 6 V to 48 V and features internal voltage clamping, supply and output reversal protection, thermal shutdown, plus GND and Vs open-wire protection, making it a robust solution for harsh electrical environments. An intelligent power switch is a type of power management IC that combines a power MOSFET output stage with diagnostic feedback, protection features, and sometimes an internal auxiliary regulator. Within the broader semiconductor taxonomy, it belongs to the family of power switches and load drivers, sitting between a discrete MOSFET (which requires external protection logic) and a fully featured solid-state relay. This category serves as a building block in industrial automation systems where a logic-level signal must safely switch a higher-power DC load with built-in fault reporting. Key specifications of the TDE1707BFPT include a continuous output current of 0.5 A, bipolar output stage configurable for either high-side (load to GND) or low-side (load to Vs) operation, and an internal +5 V auxiliary supply usable for powering external circuitry. The device also includes a dedicated LED status driver capable of sourcing or sinking approximately 3 mA (IOLD typ.), which reflects the output state for diagnostics. Overload and short-circuit protections are integrated, along with thermal shutdown for safe operation under fault conditions. From an architectural perspective, the TDE1707BFPT integrates a vertical power DMOS output transistor with on-chip logic for protection, diagnostic feedback, and an internal 5 V LDO that powers both the gate drive and any external sensor circuitry. The bipolar 1:2 output configuration simplifies PCB routing by allowing the same part to serve as either a source or sink driver. Designers should note that the supply and output reversal protection eliminates the need for external TVS diodes on the output node in many 24 V industrial systems. Typical applications include proximity detectors and inductive position sensors in industrial 24 V PLCs, 12 V and 24 V automotive body and chassis modules (relay and solenoid replacement), and process control solenoid or valve drivers. The internal +5 V supply is particularly useful for powering Hall-effect or proximity sensors directly from the switch without needing an additional regulator. When designing with this part, ensure that the load current does not exceed 0.5 A continuously and verify thermal performance under worst-case ambient conditions. The SO-8 package has limited thermal headroom, so PCB copper pour area directly under the exposed pad is critical for thermal dissipation. This page consolidates distributor pricing, drop-in alternatives, and application guidance that goes beyond the manufacturer datasheet to support rapid design-in.
TEA1721AT/N1 - 700V Flyback SMPS Controller, 5W | NXP
The NXP Semiconductors TEA1721AT/N1 is a compact, low-cost Switched Mode Power Supply (SMPS) controller IC with integrated 700V power MOSFET for low-power flyback converters up to 5W, housed in a 7-pin SO (SOT1175-1 / SOIC-7) package. The device operates directly from a rectified universal mains input (up to 700V drain rating), supports a switching frequency of 22.5 kHz to 50.5 kHz, and delivers ultra-low standby power consumption via a burst-mode frequency of 430 Hz. A flyback controller is a type of switched-mode power supply (SMPS) topology that stores energy in the primary-side transformer's magnetic field during the MOSFET on-time and releases it to the secondary winding during the off-time, providing galvanic isolation between mains and low-voltage outputs. The TEA1721AT/N1 belongs to the AC-DC controller category within the broader Power Management IC hierarchy and is designed for isolated, non-isolated, and auxiliary power supply applications where eliminating external high-voltage startup components is critical. Key features include a 700V integrated power switch, 22.5 kHz to 50.5 kHz programmable switching frequency, 430 Hz burst-mode frequency for ultra-low standby power, valley and demag detection for quasi-resonant operation, and comprehensive protection circuitry including over-temperature, over-current, and short-winding protection. The integrated high-voltage startup eliminates the need for an external startup resistor network, reducing BOM count and PCB footprint. The TEA1721AT/N1's high-voltage integration and quasi-resonant valley switching architecture maximize efficiency across the entire load range. The internal MOSFET supports universal mains input (85 VAC to 265 VAC) without auxiliary high-voltage components, simplifying layout and reducing standby power to industry-leading levels required for ENERGY STAR and EU Ecodesign compliance. Typical applications include 5W mobile phone chargers, standby power supplies for white goods and appliance control, IoT and smart home low-power modules, and auxiliary supplies for larger power systems.
TEA2017AAT/3 - Digital LLC + Multimode PFC Combo Controller | NXP
The NXP Semiconductors TEA2017AAT/3 is a digital configurable LLC and multimode PFC combo controller for high-efficiency resonant power supplies, integrating both the LLC controller and PFC controller functionality in a compact 16-pin SO (SO16) package, supporting applications from 90 W to 1000 W. An LLC + PFC combo controller is a power management IC that governs the two main power-conversion stages of a modern AC-DC supply: the power factor correction (PFC) front end and the LLC resonant half-bridge stage that provides isolated, regulated DC output. Within the power management IC hierarchy, it belongs to AC-DC controllers with integrated PFC, where combining both control loops in a single IC reduces component count, board area, and design complexity. Key features include a fully digital architecture built on a high-speed configurable hardware state machine ensuring reliable real-time performance, a PFC configurable for DCM/QR or CCM fixed-frequency operation, and integrated advanced functions such as active X-capacitor discharge and external OTP (over-temperature protection) sensing. The PFC control uses average current mode, delivering low input-current distortion and high power factor across the universal AC input range. Technical depth: because both control engines share one digital die, inter-stage coordination such as burst-mode operation at light load and PFC/LLC sequencing is handled natively, enabling very high efficiency from light load to full 1000 W output. Paired with the TEA2095T dual-channel LLC resonant synchronous rectifier controller, the TEA2017AAT forms a complete high-performance, cost-effective resonant power supply solution. Typical applications include server and telecom power supplies, LED street lighting drivers, audio amplifiers, notebook and desktop adapters, and open-frame industrial power supplies in the 90 W to 1000 W range. Design consideration: according to NXP, the TEA2017AAT/3 is a pin-compatible update of the TEA2017AAT/2, but a few small differences must be considered when replacing /2 with /3; for new designs the /3 version is preferred. Route the PFC current-sense network close to IC pin 4 GND near the PFC sense resistor and bulk capacitor ground. This page synthesizes distributor pricing, drop-in alternatives verified against NXP application note AN13140, and practical design notes not found in the manufacturer datasheet.
TEA2017ABT/2 - LLC + DCM/QR PFC Combo Controller | NXP
The NXP TEA2017ABT/2 is a digital configurable LLC and DCM/QR PFC combo controller IC for high-efficiency resonant power supplies, integrating an LLC controller and a PFC controller that operates in DCM/QR mode, housed in a low-profile, narrow-body 16-pin SO16 (SOIC 3.90 mm width) surface-mount package. A combo controller is a power management IC that merges two control functions on a single die: the power factor correction (PFC) stage, which shapes the AC input current to achieve near-unity power factor, and the LLC resonant converter stage, which provides isolated, high-efficiency DC conversion via a resonant tank. Within the power supply controller hierarchy, the TEA2017ABT belongs to the AC-DC controller family, sitting above discrete PWM controllers and below full digital power supervisory systems. Combo integration reduces board area, simplifies inter-controller handshake logic, and lowers the total component count of the complete resonant power supply. Key features include a digital architecture based on a high-speed configurable hardware state machine, which ensures very reliable real-time control performance without the latency or software-dependency of a microcontroller-based design. The PFC stage supports DCM (discontinuous conduction mode) and QR (quasi-resonant) operation only, while the LLC stage is identical to that of the TEA2017AAT variant. During power supply development, many operation and protection settings of both the LLC and PFC controllers are digitally configurable, giving designers flexibility typically reserved for digital power platforms. Technically, the state-machine-based digital architecture executes cycle-by-cycle control decisions deterministically, supporting valley switching, adaptive dead time, and multi-mode protection handling. Because the LLC engine and the PFC engine are coordinated on-chip, burst-mode operation and shutdown sequencing can be tightly coupled, improving light-load efficiency. Typical applications include AC-DC adapters for notebooks and high-power chargers, open-frame and enclosed industrial power supplies, and LED lighting drivers where high efficiency, low standby power, and a low component count are required. When designing with the TEA2017ABT, note that the PFC operates only in DCM/QR mode: for applications demanding continuous conduction mode PFC at higher power levels, evaluate the TEA2017AAT variant instead. This page synthesizes verified distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
TEA2095T - GreenChip Dual LLC Synchronous Rectifier Controller | NXP
The NXP Semiconductors TEA2095T is a GreenChip dual synchronous rectifier (SR) controller IC for switched-mode power supplies, dedicated to secondary-side synchronous rectification in resonant (LLC) converters with center-tapped transformer outputs, housed in an 8-pin SO (SOIC-8) package with two integrated gate-driver stages. A synchronous rectifier controller replaces the lossy output rectifier diodes of an SMPS with MOSFETs that are actively gate-driven, drastically cutting conduction losses. In a center-tapped LLC converter, two SR MOSFETs alternately rectify the two half-cycles; a dual SR controller such as the TEA2095T senses the drain voltages of both MOSFETs and drives the correct gate at the correct time. This device family sits in the NXP secondary-side AC-DC controller hierarchy under power management ICs and is part of the GreenChip energy-efficiency portfolio. The defining feature of the TEA2095T is its adaptive gate drive method. Instead of a fixed minimum on-time, the controller continuously adapts the gate-drive window to the actual conduction interval of each SR MOSFET, maximizing energy savings at any load. This prevents both premature turn-off (body-diode conduction losses) and late turn-off (cross-conduction and reverse-current risks), which are the two classic failure modes of synchronous rectification in resonant converters. The TEA2095T provides two driver stages, one per SR MOSFET, with direct drain sensing on the DSA and DSB pins. NXP documentation notes an interlock delay time with a typical value of 200 ns, which guarantees non-overlap between the two gate outputs even under transient conditions, protecting the SR MOSFETs from shoot-through. Internal circuitry connected to the DSA and DSB pins should not be polluted with series resistors, as NXP's application guidance explains that added resistance can degrade the adaptive-drive regulation through voltage offset. Typical applications include LLC resonant converters in adapters and chargers for notebooks, high-power USB-PD chargers, LED driver power supplies, server and telecom auxiliary power stages, and TV power boards, wherever high efficiency across light and full load is mandated by energy regulations such as CoC and DoE. A key design consideration: when migrating from the older TEA1795T, note that the DSA/DSB inputs behave differently, and the NXP community guidance warns that series resistors on these pins can degrade regulation; a PCB review is advised. This page adds distributor sourcing context, drop-in alternative analysis, and practical design notes synthesized beyond the manufacturer datasheet for engineering and procurement teams.
TEA2095T-1-S30J - Dual LLC SR Controller, 38V | NXP
The NXP Semiconductors TEA2095T/1/S30J is a high-performance GreenChip dual synchronous rectifier (SR) controller IC for switch-mode power supplies, operating from a 4.75 V to 38 V supply with a typical supply current of 90 uA, housed in an 8-pin SOIC (0.154 inch, 3.90 mm width) surface-mount package. A synchronous rectifier controller is a specialized power management IC that replaces the output rectifier diodes of a switched-mode power supply with actively driven MOSFETs. Because a MOSFET channel exhibits a far lower voltage drop than a Schottky or fast-recovery diode, SR controllers dramatically reduce conduction losses and raise overall conversion efficiency. In the power-supply hierarchy, the TEA2095T belongs to the family of secondary-side power conversion controllers used alongside LLC resonant converters and other resonant topologies. The TEA2095T incorporates NXP's adaptive gate drive method, which evaluates the conduction state of the SR MOSFETs cycle by cycle and adjusts gate-drive timing to save the maximum amount of energy at any load. Its two integrated driver stages are dedicated to driving the SR MOSFETs that rectify the outputs of a center-tapped transformer secondary, which is the standard configuration for low-voltage, high-current LLC resonant converters. Architecturally, the device is a dedicated controller for synchronous rectification on the secondary side of resonant converters. The adaptive algorithm extends SR operation down to light load, where conventional fixed-timing SR controllers would turn the MOSFETs off prematurely, and it guards against reverse current at low load, improving both full-load efficiency and light-load standby power - key requirements of modern energy-efficiency regulations such as those addressed by NXP's GreenChip portfolio. Typical applications include the secondary side of LLC resonant converters in notebook adapters, server and telecom power supplies, LED TV power boards, and high-density USB-PD fast chargers, wherever a center-tapped secondary with low-output-voltage, high-output-current rectification demands minimal conduction loss. A key design consideration is correct placement and routing of the SR sense signals; because the controller drives two MOSFETs synchronously with the resonant half-cycle, layout symmetry between the two drive channels and short, low-inductance gate loops are essential to avoid spurious turn-on and to preserve the efficiency benefit at 100 kHz-class resonant frequencies. This page adds value beyond the manufacturer datasheet by synthesizing distributor pricing, availability, drop-in alternatives, and practical engineering design notes in one place. According to the NXP TEA2095T product page and distributor listings, pricing starts at approximately $1.0833 (as of 2026-09-13, LCSC), and the part is actively stocked.
TEA2095T-1J - GreenChip Dual LLC SR Controller | NXP | AC-DC Power
The NXP TEA2095T-1J is a GreenChip dual synchronous rectifier (SR) controller IC for the secondary side of switch mode power supplies, housed in an 8-pin SO (SOIC-8) package. It drives two external SR MOSFETs that rectify the outputs of center-tapped secondary transformer windings in resonant (LLC) converters, improving end-to-end efficiency at any load. A synchronous rectifier controller is a power-management IC that replaces lossy output rectifier diodes with MOSFETs switched in synchronism with the transformer secondary voltage. In the power-conversion hierarchy it sits at the secondary side of an AC-DC or DC-DC system, alongside secondary-side feedback and supervisory controllers, and is a key efficiency lever in GreenChip-based SMPS designs. Key features include two dedicated gate driver stages for SR MOSFETs, an adaptive gate drive method that saves the maximum amount of energy at any load, and operation tuned for resonant converter topologies. The adaptive approach shortens conduction time of the SR MOSFETs near zero-current crossings to prevent reverse current, avoiding the efficiency penalty of fixed-timing SR controllers. Technically, the TEA2095T senses the drain-source voltage of the SR MOSFETs to detect conduction intervals, then drives the gates with accurate timing margins. This sensing-based method delivers robust performance over line, load, and temperature without needing primary-side synchronization signals, simplifying magnetics design and board routing in isolated converters. Typical applications include LLC resonant converters for notebook adapters, high-density chargers, server and telecom power supplies, and any center-tapped secondary output requiring high-efficiency rectification, where low rectification losses directly reduce heatsinking requirements. A key design consideration is careful PCB layout of the gate drive and sense loops; keep gate traces short and place the sense connections directly at the MOSFET pins to prevent false switching caused by parasitic ringing. This page adds value beyond the datasheet by synthesizing distributor pricing (as of 2026-09-13), drop-in same-family alternatives, comparisons with competing SR controllers, and practical design notes in one place.