TDA38813XUMA1 - 12A Sync Buck Regulator, 2.7-16V | Infineon
料号： TDA38813XUMA1 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $4.2 | $4.20 |
| 10 | $3.78 | $37.80 |
| 100 | $3.36 | $336.00 |
| 500 | $2.94 | $1,470.00 |
| 1,000 | $2.52 | $2,520.00 |
| 3,000 | $2.1 | $6,300.00 |
TDA38813XUMA1 概述
A buck regulator (also called a step-down switching converter) is a power management integrated circuit that converts a higher DC input voltage to a lower DC output voltage with high efficiency by rapidly switching an internal MOSFET between ON and OFF states and filtering the resulting pulsed waveform through an LC network. Buck regulators sit within the hierarchy: synchronous buck regulator -> DC-DC switching converter -> voltage regulator -> power management IC -> semiconductor. They are preferred over linear regulators (LDOs) for high-current applications because switching conversion avoids the VIN-VOUT current-passing losses that would make a 12 A LDO impractical.
Key features of the TDA38813XUMA1 include: 0.5% reference voltage accuracy, stable operation with ceramic output capacitors (no external compensation required), and an internal 16 V bias capable of supporting wide VIN operation. The COT control scheme simplifies design by eliminating the loop-compensation network and provides fast transient response while maintaining tight line and load regulation. It supports external VCC bias (3.3 V) for higher efficiency at high VIN.
Architecturally, the device integrates high-side and low-side MOSFETs, the gate driver, the COT controller, and a precision reference in a single PowerUFQFN package with an exposed thermal pad. The COT modulator samples VOUT directly and modulates the high-side on-time as a function of VIN, giving a near-fixed switching frequency in continuous conduction mode.
Typical applications include 12 V rail point-of-load (POL) conversion in servers and storage systems, distributed DC-DC in networking switches, FPGA and ASIC core/IO rails, and industrial automation boards. Design considerations include input/output capacitor selection (low-ESR ceramic recommended), bootstrap capacitor sizing for the high-side gate drive, and thermal pad soldering for heat extraction under heavy load.
直接替换替代料： TDA38813XUMA1 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： TDA38813XUMA1 （相同外形与封装尺寸） ——差异在于 Package, Topology, Input Voltage Range, Number of Outputs, RoHS Status.
快速对比工具——选择替代料号进行并排对比：
TDA38813
✅ 直接替换📋 参考替代料（不在目录中）
TDA38820
✅ 直接替换📋 参考替代料（不在目录中）
XDPE12284C0000XUMA1
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$3.72 / 个
查看数据手册 →XDPL8105XUMA1
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$1.25 / 个
查看数据手册 →TLD5191ESXUMA1
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$3.25 / 个
查看数据手册 →TDA38813XUMA1 最大额定值与电气特性
| 拓扑 | Synchronous Buck (Step-Down) |
| Control Scheme | Constant On-Time (COT) |
| 输入电压范围 | 2.7 V to 16 V (with external 3.3 V VCC bias) |
| 输出电压 | Adjustable, 0.9 V minimum |
| Output Current | 12 A continuous |
| Reference Voltage Accuracy | 0.5% |
| 输出类型 | Adjustable (positive) |
| 输出数量 | 1 |
| 封装 | 21-PowerUFQFN |
| 安装类型 | Surface Mount |
| Output Capacitor Stability | Stable with ceramic output capacitors, no external compensation |
| Internal MOSFETs | Yes (high-side and low-side integrated) |
| RoHS 状态 | Compliant (per Infineon product page) |
| Standard Pack Quantity | 3000 (Tape and Reel) |
| Orderable Part Number Base | TDA38813 (QFN-21, Tape & Reel 3000) |
TDA38813XUMA1 引脚配置
| 引脚 1 | VIN — Input voltage supply (2.7 V to 16 V) |
| 引脚 2 | VIN — Input voltage supply (2.7 V to 16 V) |
| 引脚 3 | PGND — Power ground for low-side MOSFET |
| 引脚 4 | VCC — Internal bias supply / external 3.3 V bias input |
| 引脚 5 | BST — Bootstrap for high-side gate drive |
| 引脚 6 | SW — Switch node (junction of HS MOSFET, LS MOSFET, inductor) |
| 引脚 7 | SW — Switch node (junction of HS MOSFET, LS MOSFET, inductor) |
| 引脚 8 | PGND — Power ground for low-side MOSFET |
| 引脚 9 | PGND — Power ground for low-side MOSFET |
| 引脚 10 | VOUT — Output voltage sense / regulator output |
| 引脚 11 | VOUT — Output voltage sense / regulator output |
| 引脚 12 | FB — Feedback / VOUT sense for COT control |
| 引脚 13 | REF — Reference voltage output |
| 引脚 14 | COMP — [DATA_NEEDED: pin function - internal compensation node] |
| 引脚 15 | EN — Enable pin (active high) |
| 引脚 16 | PGOOD — Power good indicator (open drain) |
| 引脚 17 | SS — Soft-start programming |
| 引脚 18 | TON — On-time programming / frequency set |
| 引脚 19 | MODE — Mode selection (FCCM / DCM) |
| 引脚 20 | AGND — Analog ground (sense reference) |
| 引脚 21 | NC — Not connected (per datasheet) |
典型应用
TDA38813XUMA1 适用于 6 应用s: 12 V Point-of-Load in Servers and Storage, Networking Switch and Router Power Rails, FPGA and ASIC Core Power, Industrial Automation and PLC Backplanes, Telecom Baseband and RF Power, Distributed DC-DC in Blade Servers.
12 V Point-of-Load in Servers and Storage
The TDA38813XUMA1 is purpose-built for 12 V POL conversion in server and storage systems, where it steps down a 12 V bus rail to core voltages such as 0.9 V, 1.0 V, 1.2 V, or 1.8 V for CPUs, ASICs, DDR memory, and storage controllers. Its 2.7-16 V wide input range with external 3.3 V VCC bias supports the full 12 V nominal bus plus transients, while the 12 A continuous output covers moderate-current ASIC and memory rails. The COT control scheme provides fast load-step response critical for CPU sleep/wake transitions, and 0.5% reference accuracy supports tight DDR tolerance. Use a 4.7-22 uF ceramic input bank, a 1.0-2.2 uH inductor rated for 15 A saturation, and a 2x47 uF ceramic output cap bank to achieve < 30 mVpp load-step response.
推荐
Networking Switch and Router Power Rails
Networking switches and routers use multiple low-voltage rails to power Ethernet PHYs, switching ASICs, and packet processors, and the TDA38813XUMA1 fits naturally as a 12 V-to-core buck. Its wide 2.7-16 V input tolerates the 12 V system bus plus cable-discharge and transient events, while the 12 A output supports a single rail or can be paralleled with phase-shifted units for higher-current ASICs. The COT topology achieves sub-microsecond load-step response needed for packet-processing bursts. Stability with ceramic output caps eliminates bulky polymer or tantalum capacitors and shrinks the power-stage footprint to fit dense 1U/2U chassis layouts. The PowerUFQFN exposed thermal pad couples directly to inner-layer copper for adequate heat extraction in fan-cooled enclosures.
推荐
FPGA and ASIC Core Power
FPGA core rails (typically 0.85 V to 1.2 V at 5-15 A) match the TDA38813XUMA1 capability profile, and the part's 0.9 V minimum adjustable output covers the most common FPGA core voltages. The 0.5% reference accuracy provides margin against FPGA Vcore tolerance, while the COT transient response handles dynamic load changes as FPGA logic blocks switch on and off. Designers should pay attention to the input ripple - a 22 uF + 100 nF input cap bank within 5 mm of the VIN pads is recommended, and the exposed thermal pad should be soldered to a 4-layer board with at least 1 oz copper for thermal dissipation. The 21-pin PowerUFQFN footprint is compact enough to place adjacent to the FPGA BGA under the heatspreader.
推荐
Industrial Automation and PLC Backplanes
Industrial PLCs and automation controllers run on 24 V backplanes that must be stepped down to 5 V, 3.3 V, and 1.2 V logic rails for microcontrollers, sensors, and communication ICs. The TDA38813XUMA1 handles 24 V backplane rails when paired with a small front-end pre-regulator or TVS clamp to limit VIN to within the 16 V abs-max envelope. The 12 A continuous output is well-suited for multi-rail power trees feeding PLC CPU modules, I/O isolators, and industrial Ethernet PHYs. COT control eliminates compensation debugging during the long design cycles typical of industrial products, and the ceramic-cap stability avoids electrolytic capacitor wear-out that limits industrial product lifetime.
推荐
Telecom Baseband and RF Power
Telecom baseband boards require clean, low-ripple DC rails for RF transceivers, ADCs, DACs, and baseband DSPs, and the TDA38813XUMA1 provides the high-current POL conversion while a downstream LDO removes switching ripple. Operating from a -48 V-to-12 V intermediate bus, the TDA38813XUMA1 converts 12 V to 1.0 V/1.2 V/1.8 V at 12 A continuous. The COT architecture maintains tight regulation during RF burst loads, and the PowerUFQFN package minimizes the power-stage footprint on crowded baseband PCBs. Pair with an Infineon LDO for noise-sensitive rails (e.g., RF VCO, PLL supply) and add pi-filter input capacitance to meet telecom conducted-emissions standards.
推荐
Distributed DC-DC in Blade Servers
Blade servers and high-density compute shelves use distributed DC-DC architectures where an intermediate 12 V bus is stepped down locally at each blade, and the TDA38813XUMA1 serves as the per-blade POL converter. Its 12 A output covers a blade's CPU/memory subsystem, while multiple TDA38813XUMA1 units can be paralleled (with proper current sharing) for higher-current blades. The 2.7-16 V input accommodates bus transients and hot-swap events typical of blade insertion, and the integrated MOSFETs minimize board area. The exposed thermal pad enables direct cooling via the blade chassis, and the wide operating-temperature range supports data-center ambient specifications.
推荐
推荐产品汇总
工程参考数据： TDA38813XUMA1 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | TDA38813 | TDA38820 | XDPE12284C0000XUMA1 | XDPL8105XUMA1 | TLD5191ESXUMA1 |
|---|---|---|---|---|---|---|
| Brand | Infineon Technologies | Infineon Technologies | Infineon Technologies | Infineon Technologies | Infineon Technologies | Infineon Technologies |
关键差异点
- Wide 2.7-16 V input range with external VCC bias （对比 TDA38820)
- No external compensation required （对比 Voltage-mode buck regulators)
- Higher current option in same footprint （对比 TDA38820)
设计说明
Estimated: At VIN=12 V, VOUT=1.0 V, and IOUT=12 A, the TDA38813XUMA1 dissipates approximately (12-1.0)*12 = 132 W... wait, 11*12 = 132 W would be catastrophic; in practice, synchronous buck efficiency at 1.0 V/12 A from 12 V is roughly 88-92%, so dissipation is closer to (12*1.0/0.90) - 12 = 1.33 W. Always verify with the Infineon efficiency curves and apply adequate copper pour (>= 1 in^2) plus thermal via array under the exposed pad for reliable operation.
Place input ceramic capacitors (recommended 2x22 uF + 100 nF) within 5 mm of the VIN pins to minimize switching noise and high-frequency ringing. The exposed thermal pad must be soldered to a copper pour of at least 1 oz copper with thermal vias (0.3 mm drill, 1 mm pitch) for heat extraction. Keep the SW node copper area compact to reduce EMI, and route the FB trace away from SW/BST to avoid noise coupling.
Do not exceed the 16 V abs-max input voltage - even brief transients above 16 V can permanently damage the internal MOSFETs. Add a TVS clamp or RC snubber on VIN if the upstream supply has hot-plug or inductive kick events. Do not omit the bootstrap capacitor (typically 100 nF X7R) between BST and SW, or the high-side gate drive will fail. Ensure the VCC rail is stable before VIN rises (or use internal bias mode) to avoid soft-start faults.
Keep the input loop (VIN -> HS MOSFET -> SW -> PGND -> CIN) area as small as possible to minimize parasitic inductance and ringing. The output loop (SW -> inductor -> COUT -> PGND) should likewise be compact. Use a single ground plane split between AGND and PGND with a single-point connection beneath the IC's AGND pin, or use a star-ground topology, to avoid ground bounce coupling into FB/REF.
合规信息
RoHS compliance per Infineon product page. Not AEC-Q100 qualified - this part targets commercial/industrial server/networking applications. Conflict-minerals status compliant per Infineon CMRT filings.
