TDA38807XUMA1 - 6A Sync Buck Regulator, 2.7-16V Input | Infineon
料号： TDA38807XUMA1 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $1.95 | $1.95 |
| 10 | $1.74 | $17.40 |
| 100 | $1.45 | $145.00 |
| 500 | $1.21 | $605.00 |
| 1,000 | $1.02 | $1,020.00 |
TDA38807XUMA1 概述
A buck (step-down) DC-DC switching regulator is a power management integrated circuit that converts a higher DC input voltage to a lower, regulated DC output voltage by rapidly switching an internal power FET and storing energy in an external inductor. The buck regulator sits within the broader taxonomy of voltage regulators, which also includes linear regulators (LDO), boost converters, and buck-boost converters - all of which belong to the power management IC family that conditions supply rails for downstream digital and analog loads such as processors, FPGAs, ASICs, and memory.
Key features include a precision 0.9 V ±0.5% reference, stable operation with low-ESR ceramic output capacitors, internal soft-start, cycle-by-cycle current limiting, thermal shutdown, and a power-good indicator. According to the Infineon datasheet, the regulator operates at typical switching frequencies compatible with 2 MHz-class conversion and supports 100% duty-cycle operation for low-dropout scenarios.
The TDA38807 employs a voltage-mode control architecture with internal loop compensation, eliminating the need for external RC components. Its 14-pin UFQFN package exposes the thermal pad on the bottom side, allowing the high-side and low-side FET dissipation to be conducted directly into the PCB copper. The internal MOSFETs are specified for continuous 6 A output current across the full industrial temperature range of -40 °C to +125 °C junction temperature.
Typical applications include FPGA core and I/O rail generation, ASIC POL supplies, networking switch ASICs, industrial 12 V bus regulation, and telecom board-level power. In all of these, the wide input range and high efficiency of the synchronous topology replace less efficient linear regulators and shrink the power dissipation budget.
When designing with the TDA38807, place input ceramic capacitors (typically 22 µF X7R) within 5 mm of the VIN and PGND pins to minimize switching-node ringing. The exposed pad must be soldered to a continuous ground copper pour of at least 25 mm² to keep junction temperature within safe limits at 6 A continuous load.
This page synthesizes distributor pricing, same-package drop-in alternatives, and application-specific design notes not found in the manufacturer datasheet.
直接替换替代料： TDA38807XUMA1 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： TDA38807XUMA1 （相同外形与封装尺寸） ——差异在于 Package, Topology, Mounting Type, Number of Outputs, Operating Junction Temperature.
快速对比工具——选择替代料号进行并排对比：
TDA38806XUMA1
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
TDA21462AUMA1
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$2.51 / 个
查看数据手册 →XDPE12284C0000XUMA1
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$3.72 / 个
查看数据手册 →TLD5191ESXUMA1
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$3.25 / 个
查看数据手册 →BTS3256DAUMA1
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$2.43 / 个
查看数据手册 →TDA38807XUMA1 最大额定值与电气特性
| 拓扑 | Synchronous Buck (Step-Down) |
| Input Voltage Range (Internal Bias) | 4 V to 16 V |
| Input Voltage Range (External 3.3 V VCC) | 2.7 V to 16 V |
| 输出电压范围 | 0.9 V to 5.5 V (adjustable) |
| Reference Voltage Accuracy | 0.9 V ±0.5% |
| Continuous Output Current | 6 A |
| 输出类型 | Adjustable (positive) |
| 输出数量 | 1 |
| 封装 | 14-UFQFN (exposed pad) |
| 安装类型 | Surface Mount |
| 工作结温 | -40 °C to +125 °C |
| Internal MOSFETs | Yes (high-side and low-side) |
| External Compensation | Not required |
| External Schottky Diode | Not required |
| 软启动 | Internal |
| 限流 | Cycle-by-cycle (per datasheet) |
| 热关断 | Yes |
| Power Good Indicator | Yes |
| RoHS 状态 | Compliant |
TDA38807XUMA1 14-ufqfn (exposed pad) 引脚配置指南
TDA38807XUMA1（14-ufqfn (exposed pad) 封装）的引脚配置。 该功率器件具有栅极、漏极和源极端子。对于无极性封装，请参阅制造商数据手册以了解确切的引脚 1 方向和封装尺寸细节。常见应用包括电源设计、电机驱动和负载开关。
暂无详细引脚数据： TDA38807XUMA1.
请参阅 数据手册 以查看完整引脚配置。
典型应用
TDA38807XUMA1 适用于 6 应用s: FPGA Core and I/O Voltage Rail Generation, Industrial 12 V Bus POL Conversion, Networking Switch ASIC Power, Telecom Board-Level Distributed Power, Server and Storage DDR Memory Power, Automotive ECU Auxiliary Rails.
FPGA Core and I/O Voltage Rail Generation
The TDA38807XUMA1's 0.9 V to 5.5 V adjustable output covers every rail required by modern FPGAs: 0.85 V/1.0 V core, 1.8 V auxiliary, 2.5 V HP I/O, and 3.3 V standard I/O. Its 6 A continuous current supports large FPGA banks at full utilization without thermal throttling. The internal synchronous MOSFETs eliminate the external Schottky, shrinking the PCB footprint around the FPGA BGA. According to the Infineon datasheet, the 14-UFQFN exposed pad dissipates heat directly into the inner ground plane, keeping the junction temperature below 125 °C even at full industrial ambient. Use 22 µF X7R input ceramic capacitors within 5 mm of the VIN pin to suppress switching-node ringing.
推荐
Industrial 12 V Bus POL Conversion
Factory automation, PLCs, and industrial sensors commonly operate from a 24 V or 12 V backplane rail. The TDA38807XUMA1 accepts 4 V to 16 V directly on VIN, eliminating the need for an upstream pre-regulator in 12 V systems. Its 6 A output and 90%+ efficiency at typical loads reduce heatsinking requirements compared to an LDO solution. The internal cycle-by-cycle current limit and thermal shutdown protect downstream ASICs from fault conditions on the 12 V industrial bus, which can experience voltage transients during motor switching events. Place a TVS diode across VIN for surge protection per industrial IEC 61000-4-5 requirements.
推荐
Networking Switch ASIC Power
Multi-gigabit Ethernet switches and routers use dozens of point-of-load converters to power switch ASICs, PHYs, and memory. The TDA38807XUMA1 delivers 6 A at voltages between 0.9 V and 3.3 V, exactly matching the typical switch ASIC core (0.9 V), DDR memory (1.2 V), and I/O (1.8 V) rails. Its high switching frequency allows use of small 1 µH to 2.2 µH inductors, reducing the height of the power section to fit slim 1U rack chassis. The exposed-pad UFQFN package sits flat on the PCB, enabling dense placement adjacent to the switch ASIC BGA.
推荐
Telecom Board-Level Distributed Power
ATCA and advanced telecom boards distribute -48 V via isolated intermediate buses, then step down to 12 V and 5 V at the point of load. The TDA38807XUMA1 converts the 12 V intermediate bus to the ASIC core voltages directly, replacing two-stage conversion with a single high-efficiency buck stage. Its wide 4 V to 16 V input tolerates transients on the intermediate bus during load steps on adjacent cards. Soft-start is internal, preventing inrush current that could trip the upstream OR-ing controller. Use the PG (power-good) signal to sequence multiple rails during FPGA configuration.
推荐
Server and Storage DDR Memory Power
DDR4 and DDR5 memory requires tight regulation at 1.2 V and 1.1 V respectively, with high transient current capability to handle memory bursts. The TDA38807XUMA1's 0.9 V ±0.5% reference and 6 A output regulate DDR VTT and VDDQ rails directly. The internal compensation supports ceramic output capacitors, eliminating the bulk electrolytics required by older controllers and shrinking the DDR power section. For DDR applications requiring termination voltage (VTT), use two TDA38807 channels - one for VDDQ and one for VTT - sharing the same input rail.
推荐
Automotive ECU Auxiliary Rails
Modern automotive ECUs combine a main MCU with auxiliary processors, CAN transceivers, and sensor interfaces, each requiring separate regulated rails. The TDA38807XUMA1 generates 3.3 V and 5 V rails from the 12 V battery bus, supporting sensor and communication IC power. Its -40 °C to +125 °C junction temperature range covers the full automotive under-hood and cabin ambient specifications. Use the cycle-by-cycle current limit to protect against short circuits in the wiring harness. For full AEC-Q100 qualification, consider the IRPS5401 alternative in the same UFQFN footprint family.
推荐
推荐产品汇总
工程参考数据： TDA38807XUMA1 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | TDA38806XUMA1 | TDA21462AUMA1 | XDPE12284C0000XUMA1 | TLD5191ESXUMA1 |
|---|---|---|---|---|---|
| Brand | Infineon | Infineon (same brand) | Infineon (same brand) | Infineon (same brand) | Infineon (same brand) |
| Package | 14-UFQFN (exposed pad) | 14-UFQFN - same | 14-UFQFN - same | 14-UFQFN - same | 14-UFQFN - same |
| Topology | Synchronous Buck (single-channel POL) | Synchronous Buck (single-channel POL) | Integrated DrMOS power stage | Digital PWM controller | Buck-Boost LED driver |
| Output Current | 6 A continuous | 4 A continuous (-33%) | Up to 6 A (DrMOS) | Controller - depends on external stage | Up to 3 A LED load |
| Input Voltage Range | 4 V to 16 V (2.7 V with ext VCC) | 4 V to 16 V (2.7 V with ext VCC) - same | 4.5 V to 16 V | 4.5 V to 16 V | 4.5 V to 40 V |
| Output Voltage Range | 0.9 V to 5.5 V | 0.9 V to 5.5 V - same | DrMOS - depends on controller | Controller - depends on stage | Up to 60 V LED string |
| Internal MOSFETs | Yes (high-side + low-side) | Yes - same | Yes (integrated DrMOS) | No - controller only | Yes (high-side only) |
| Operating Temperature | -40 °C to +125 °C junction | -40 °C to +125 °C - same | -40 °C to +125 °C - same | -40 °C to +125 °C - same | -40 °C to +150 °C |
关键差异点
- True 6 A continuous output in compact 14-UFQFN （对比 TDA38806XUMA1)
- Self-contained synchronous buck with internal compensation （对比 TDA21462AUMA1)
- Purpose-built POL converter, not a repurposed LED driver （对比 TLD5191ESXUMA1)
- Adjustable analog POL converter - simpler than digital controller （对比 XDPE12284C0000XUMA1)
设计说明
Place input ceramic capacitors (typically 22 µF X7R 25 V) within 5 mm of the VIN and PGND pins to minimize switching-node ringing and overshoot. Use short, wide traces on the input loop, SW node, and output inductor path to reduce parasitic inductance. The 14-UFQFN exposed pad must be soldered to a continuous ground copper pour of at least 25 mm² to provide the thermal path for the internal MOSFETs. Estimated: at 6 A continuous and 12 V to 3.3 V conversion, power dissipation is approximately (12-3.3) × 6 × (1 - 0.92) ≈ 3.4 W with a 2-layer 1 oz copper board (theta_JA ~50 C/W), giving a junction temperature rise of 170 °C above ambient - external cooling or a 4-layer board is required.
Keep the feedback (FB) trace away from the SW node and inductor to avoid noise injection that destabilizes the loop. Place the feedback divider resistors close to the FB pin with the ground return routed directly to the AGND pin rather than the power ground plane. According to the Infineon TDA38807 datasheet, the AGND and PGND pins must be connected at a single point under the exposed pad to prevent ground bounce from corrupting the internal reference.
Do not exceed 16 V on VIN - the internal MOSFET breakdown voltage is 25 V but transients above 16 V can trigger OVP. Always use ceramic output capacitors with X7R or X5R dielectric rated for at least 2× the output voltage (e.g., 6.3 V or 10 V parts for 3.3 V or 5 V outputs). The SS (soft-start) capacitor value determines the inrush current; do not leave the SS pin floating - use the recommended value from the datasheet to avoid start-up overshoot.
Estimated thermal analysis: at VIN = 12 V, VOUT = 3.3 V, IOUT = 6 A, assuming 92% efficiency, internal dissipation is approximately 1.6 W. With theta_JA = 40 C/W on a 4-layer JEDEC test board (1 oz copper), junction temperature rises 64 °C above ambient. In an enclosed industrial chassis at 70 °C ambient, the junction reaches 134 °C - above the 125 °C limit. Reduce ambient, increase copper area, or add airflow to maintain margin.
合规信息
RoHS and REACH compliant per Infineon product page. Industrial grade - not AEC-Q100 qualified; for automotive use consider Infineon's AEC-Q100-qualified POL family.
