射频模块
产品（294)
ATSAMB11-XR2100A - BLE 4.1 SiP Module with Cortex-M0 | Microchip
The Microchip Technology ATSAMB11-XR2100A is an ultra-low-power Bluetooth Low Energy (BLE) 4.1 System in Package (SiP) module integrating an Arm Cortex-M0 applications processor, 2.4 GHz transceiver, modem, MAC, power amplifier, transmit/receive switch, and power management unit on a single substrate. It is part of the SmartConnect wireless portfolio and is supplied as a surface-mount module for external antenna use. A BLE System in Package is a pre-qualified multi-die module that combines a microcontroller, radio transceiver, and passives into a footprint that designers solder directly onto a PCB, eliminating RF layout risk and certification effort. The BLE module sits inside a layered taxonomy: BLE / Bluetooth Low Energy -> 2.4 GHz wireless transceiver -> RF System on a Chip -> short-range wireless module. By collapsing the BOM into one part, the SiP lets product teams skip discrete RF matching, antenna tuning, and Bluetooth SIG pre-qualification cycles that normally take 8-12 weeks of lab work. Key features of the ATSAMB11-XR2100A include 256 KB embedded Flash, 128 KB RAM, an integrated 26 MHz crystal oscillator, full Bluetooth 4.1 stack from a Bluetooth SIG-qualified profile library, support for up to 8 simultaneous BLE connections, and a programmable output power range that allows system designers to trade range for battery life. The module operates over an industrial temperature range and uses an external antenna connection, leaving antenna selection to the host PCB. Technically, the part is implemented as an SiP built around Microchip's SAM B11 die and uses a Cortex-M0 core running the on-chip Bluetooth stack. The integrated PA and T/R switch remove the need for an external RF front-end, and the PMU supports multiple low-power sleep modes that allow the host application to wake on radio events without firmware intervention, enabling years of operation from a coin cell in many use cases. Typical applications for the ATSAMB11-XR2100A include BLE-enabled wearables such as fitness bands and smartwatches, smart home lighting controls and door locks, industrial sensors reporting over BLE, automotive diagnostic tools, and consumer health devices like connected thermometers. Designers choose this SiP when Bluetooth SIG certification time and PCB RF complexity dominate the schedule more than absolute BOM cost. Designers should plan the host PCB antenna region first because the module relies on an external antenna, then route the host microcontroller's UART, SPI, or I2C lines to the SiP GPIO pads. Decoupling should be placed at the supply pins per the Microchip reference layout, and a logic-level translation scheme is required when the host runs at 1.8 V while system peripherals run at 3.3 V. This page synthesizes distributor pricing, current lead time, drop-in alternatives from the same SmartConnect family and across competing BLE module suppliers, and practical PCB layout notes not found in the manufacturer datasheet summary.
ATSAMB11-XR2100AT - BLE 4.2 SiP Module w/ Cortex-M0 | Microchip
The Microchip Technology ATSAMB11-XR2100AT is an ultra-low-power Bluetooth Low Energy (BLE) v4.2 System-in-Package (SiP) module that integrates an ARM Cortex-M0 applications processor, 2.4 GHz transceiver, modem, MAC, power amplifier, transmit/receive switch, and power management unit into a single 49-pin LFLGA package. Operating across 2.402 GHz to 2.480 GHz with an external wire antenna, it delivers a complete BLE connectivity solution in a surface-mount form factor measuring approximately 5.0 mm × 5.0 mm. What is a BLE SiP module? A System-in-Package (SiP) module is a miniaturized electronic assembly that combines multiple ICs - here a microcontroller, radio transceiver, power management, and passive RF components - inside one substrate-level package. Compared to a discrete MCU plus transceiver design, a BLE SiP shortens RF design time, eliminates bill-of-material duplication, and minimizes the PCB footprint required to add Bluetooth Low Energy to an embedded product. Within the wireless module hierarchy, ATSAMB11 sits between bare SoCs (which require external balun, antenna matching, and crystal) and pre-certified modules (which add the regulatory certification layer). Key specifications of the ATSAMB11-XR2100AT include an integrated Cortex-M0 core with embedded Flash memory, support for BLE v4.2 protocol features, and ultra-low-power operating modes targeted at battery-powered IoT endpoints. The module's PMU handles DC-DC conversion internally, freeing the host board from complex power-tree design. Its surface-mount LFLGA-49 footprint is suitable for reflow soldering on standard FR-4 PCBs. Architecturally, the SiP pairs an ATSAM D-series-class Cortex-M0 microcontroller die with Microchip's BLE radio die, interconnected via an internal serial bus. This co-design allows the firmware to control radio events, sleep cycles, and advertising intervals directly from the application code, eliminating the external host-processor burden common to discrete BLE chipsets. Typical applications include IoT sensor nodes, smart-home lighting controls, fitness bands, BLE beacons for asset tracking, and wireless human-interface devices (HID) such as remote controls and smart styluses. The integrated antenna and pre-tuned RF matching simplify Type 1 antenna designs. Design consideration: because this is a SiP module rather than a bare IC, layout should treat the module as a single RF component - keep the keep-out area beneath the antenna trace clear of copper, route the host MCU I/O away from the RF section, and follow the reference PCB stackup in the manufacturer's datasheet for antenna-matching reproducibility. This page synthesizes distributor stock levels, same-family Microchip SiP alternatives, and practical design notes not collected in any single manufacturer document.
ATSAMB11-XR210PA - Bluetooth SiP Module w/ Antenna | Microchip
The Microchip Technology ATSAMB11-XR210PA is a Bluetooth Low Energy (BLE) System-in-Package (SiP) module from the SmartConnect ATSAMB11 family, integrating a 2.4 GHz transceiver, baseband, ARM Cortex-M0 microcontroller, and a chip antenna in a single surface-mount module. It supports Bluetooth 4.1 specification and is designed for low-power wireless connectivity in IoT, consumer, and industrial applications. What is a Bluetooth SiP module? A Bluetooth SiP (System-in-Package) module is a pre-certified wireless module that integrates the RF transceiver, baseband processor, microcontroller, passives, and antenna into a single surface-mount package. Compared to discrete Bluetooth SoC designs, an SiP module reduces BOM count, eliminates RF layout complexity, and shortens time-to-market by bundling modular regulatory pre-certification. SiP modules sit within the broader category of wireless modules, which are themselves a subset of RF & Wireless connectivity products. Key features include integrated BLE 4.1 stack support, embedded ARM Cortex-M0 core, on-module crystal and passive components, and a top-mounted chip antenna (XR variant). The module provides GPIO and standard peripheral interfaces from the underlying ATSAMB11 die, simplifying host-MCU integration. The pre-certified RF section eliminates costly FCC/ETSI/IC certification cycles for the OEM. The ATSAMB11 SiP module uses a QFN-style SiP substrate, with the chip antenna mounted on top of the SiP, providing an omnidirectional radiation pattern optimized for 2402-2480 MHz BLE operation. The die-down configuration places the RF shielding and antenna trace stack-up to deliver consistent RF performance across end-product enclosures, supporting indoor range up to 30 m line-of-sight. Typical applications include wearable fitness devices, smart-home sensors and beacons, BLE proximity tags, industrial wireless sensor nodes, and remote controls. The integrated antenna variant (XR) is ideal when external antenna connectors are not feasible due to enclosure constraints or cost targets. Use the MR variant when an external antenna is preferred for tuned radiation. When designing with this device, follow Microchip's reference layout for the host PCB keep-out region beneath the SiP to preserve antenna gain. Confirm regulatory certifications for the target geographies, and verify the host enclosure does not attenuate the BLE signal in the 2.4 GHz band. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet to help engineers evaluate the ATSAMB11-XR210PA for production deployment.
ATSAMR21B18-MZ210PA - 2.4GHz 802.15.4 Zigbee Module | Microchip
The Microchip Technology ATSAMR21B18-MZ210PA is an 802.15.4 / Zigbee transceiver module operating in the 2.4 GHz ISM band, integrating an ATSAMR21E18 SoC together with a serial data flash and a trace antenna in a 19.7 mm x 16.3 mm surface-mount package. The module integrates 256 kB of on-chip Flash, ARM Cortex-M0+ compute, an integrated 2.4 GHz IEEE 802.15.4 radio, and onboard non-volatile memory for OTA-friendly firmware staging, providing a turnkey wireless node for lighting, home automation, and sensor mesh applications. An 802.15.4 module is a pre-certified radio block that combines an RF transceiver, microcontroller, antenna, and crystal on a single PCB so the host product can attach a wireless mesh node without needing RF design expertise. Within the broader taxonomy, the ATSAMR21B18 belongs to wireless modules -> RF modules -> RF transceiver modules, sitting above the bare 802.15.4 transceiver IC layer. Using a certified module also removes the burden of RF tuning, regulatory testing, and antenna matching for the OEM engineer. Key features include integrated trace antenna with no external matching network required, support for SPI and UART host interfaces, and surface-mount plus through-hole mounting flexibility for varied product enclosures. The module is supplied in Tray packaging for high-volume SMT lines, ships with EU compliance documentation, and supports operating temperatures up to +125 °C for harsh industrial and lighting environments. Typical RX current is 11.8 mA and typical TX current is 13.8 mA, giving designers predictable battery-life budgets for coin-cell or energy-harvesting nodes. Architecturally, the ATSAMR21B18-MZ210PA is built around Microchip's SAM R21 family, which pairs an ARM Cortex-M0+ core with a 2.4 GHz IEEE 802.15.4 radio and SAM D21-compatible peripherals. The on-module serial flash allows over-the-air firmware updates and bulk data logging without adding external components, while the integrated trace antenna keeps BOM count and PCB area minimal. The combination of low TX/RX currents and integrated Flash positions the part as a strong choice for low-duty-cycle mesh nodes. Typical applications include Zigbee and IEEE 802.15.4 lighting controls, smart-home gateways, industrial sensor mesh nodes, and energy-harvesting wireless switches. Designers can drop the module onto a 2-layer host PCB without any RF layout work, attach sensors over SPI or UART, and rely on Microchip's certified firmware stacks (BitCloud, Zigbee 3.0, Thread via SoftDevice partners) to accelerate time-to-market. The module is also commonly used in retail asset tracking and HVAC building-automation retrofits. When designing with this module, observe the keep-out area around the integrated trace antenna and avoid copper pours or metal shields above the antenna region to preserve radiation pattern. Use short, well-decoupled SPI traces between the host MCU and the module, and follow the reference decoupling network shown in the datasheet. Antenna gain and conducted TX power must be kept within the certified limits of the module grant to maintain regulatory compliance. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, helping sourcing engineers and firmware developers evaluate the ATSAMR21B18-MZ210PA against modern Zigbee and Thread module families.
ATSAMR21B18-MZ210PAT - 2.4GHz 802.15.4 Zigbee Module | Microchip
The Microchip Technology ATSAMR21B18-MZ210PAT is a 2.4 GHz 802.15.4 / Zigbee-compliant RF transceiver module with an integrated PCB trace antenna, integrating the ATSAMR21E18 SoC together with a serial data flash in a compact 19.7 mm x 16.3 mm surface-mount package rated for operation up to 125 °C. An 802.15.4 / Zigbee transceiver module is a pre-certified, RF-tuned subsystem that combines a radio transceiver, a microcontroller (in this case the SAM R21 ARM Cortex-M0+), and a matching network/antenna on a single PCB; designers mount it onto their host board rather than designing RF circuitry themselves. Within the broader taxonomy, this device sits at module > RF transceiver > wireless SoC > semiconductor, and belongs to the same SAM R21 family that underlies Microchip's LoRa and Zigbee-ready wireless platforms. Key features of the ATSAMR21B18-MZ210PAT include 802.15.4 PHY-level compliance for Zigbee 3.0 and Thread (via the underlying SAM R21E18 stack), 2.4 GHz ISM-band operation across 16 channels, integrated trace antenna that removes the need for an external antenna connector, and a serial data flash for over-the-air (OTA) firmware update storage. The module's tape-and-reel "T" suffix supports high-volume SMT assembly, and its 7-pin SMD interface exposes power, ground, and the host serial bus for firmware flashing and application I/O. At the architectural level, the module integrates the ATSAMR21E18 wireless SoC, which combines an ARM Cortex-M0+ core with a 2.4 GHz IEEE 802.15.4 radio and a MAC accelerator. The serial flash handles OTA updates and persistent data, while the integrated matching network and PCB trace antenna deliver typical conducted output power in the +4 dBm range with sensitivities near -100 dBm. Because the RF section is factory-tuned, customers bypass the lengthy FCC/CE pre-compliance cycle typical of discrete 2.4 GHz designs. Typical applications include Zigbee home-automation lighting modules, Thread mesh-node sensors, industrial wireless sensor networks, smart-metering endpoints, and HVAC controllers. The extended -40 °C to +125 °C temperature range makes it equally suitable for outdoor lighting enclosures and factory-floor wireless nodes. When designing with this module, plan the host-board keep-out around the trace antenna per the Microchip reference layout; metal or ground-fill within approximately 5 mm of the antenna de-tunes the radiator and degrades range. Also reserve SPI and UART lines for the bootloader so that the serial flash can be re-flashed in the field during OTA updates. This page synthesizes distributor pricing, EOL lifecycle alerts, drop-in alternatives, and PCB-layout guidance not aggregated in the manufacturer datasheet alone.
ATSAMR21G18-MR210UA - 2.4GHz Zigbee/802.15.4 Wireless Module | Microchip
The Microchip Technology ATSAMR21G18-MR210UA is a 20mm × 19mm surface-mount wireless System-in-Package (SiP) module that integrates an ATSAMR21G18A microcontroller with a 2.4GHz IEEE 802.15.4 transceiver, a serial flash memory, and a hardware crypto-authentication device. Built around an ARM Cortex-M0+ core running up to 48MHz, it delivers 256KB Flash and 32KB SRAM in a regulatory-certified module intended for rapid Zigbee and Thread product development. An IEEE 802.15.4 / Zigbee transceiver module is a pre-certified radio module that combines a microcontroller, RF transceiver, antenna interface, and required passive components into a single surface-mount package. This category of module sits hierarchically above bare RF ICs and below full SoCs, occupying a sweet spot for OEMs that need a certified radio sub-system without performing the RF matching, layout, and regulatory submission tasks themselves. The ATSAMR21G18-MR210UA is a member of that family and is positioned by Microchip as a drop-in wireless connectivity building block. Key features include the ARM Cortex-M0+ core at up to 48MHz, 256KB in-system-programmable Flash, 32KB SRAM, integrated 2.4GHz IEEE 802.15.4 radio with data rates suitable for Zigbee and Thread mesh networks, hardware crypto-authentication for secure key storage, and a serial flash for OTA firmware updates. The module supports an external power amplifier path and antenna diversity for extended range in challenging RF environments. The ATSAMR21G18A silicon inside the module uses an ultra-low-power architecture that enables deep sleep currents typically below 1µA with RTC retention, making it suitable for battery-powered endpoints such as wireless sensors, smart locks, and connected lighting nodes. The integrated radio supports IEEE 802.15.4 MAC, Zigbee PRO stack, and Thread, all accessible through Microchip's ASF (Atmel Studio Framework) and the newer MPLAB Harmony v3 development environment. Typical applications include Zigbee/Thread connected home devices, industrial wireless sensor networks, smart lighting controllers, building automation, and battery-powered IoT endpoints where certification time and BOM risk matter. Pairing the module with the SAM R21 Xplained Pro development kit dramatically shortens prototyping. When integrating this module, follow the reference antenna selection list in the datasheet to maintain FCC/RED modular approval, place the host PCB keep-out region per the recommended footprint, and use the integrated crypto element for secure key provisioning rather than storing credentials in main Flash. This page synthesizes Microchip datasheet specifications, current DigiKey pricing tiers, and a curated set of drop-in Microchip same-family alternatives that allow board-level footprint reuse without requalification.
ATSAMR21G18-MR210UAT - 2.4GHz Zigbee Module, 256KB Flash | Microchip
The Microchip Technology ATSAMR21G18-MR210UAT is a 2.4 GHz IEEE 802.15.4 compliant wireless module integrating an ATSAMR21G18A system-in-package (SiP) with on-module serial flash and a Microchip crypto-authentication device. Housed in a 42-pin surface-mount module footprint measuring 19 mm × 20 mm, the ATSAMR21G18-MR210UAT provides a U.FL antenna connector and supports up to 250 kbit/s over-the-air data rate with a +4 dBm typical transmit power for Zigbee and Thread mesh networks. An IEEE 802.15.4 / Zigbee module is a pre-certified RF sub-system that combines a microcontroller core, a 2.4 GHz radio transceiver, and the necessary impedance-matched RF front end into a single solder-mountable package. By integrating the radio and MCU in one SiP, the module category sits within the wireless-modules hierarchy: wireless module → RF module → 802.15.4 module → Zigbee module → wireless connectivity IC. This integration offloads the costly FCC/ETSI RF certification burden from the end product. The ATSAMR21G18-MR210UAT features 256 KB of in-application programmable flash, 32 KB SRAM, an ARM Cortex-M0+ core running up to 48 MHz, and a built-in ATECC608A-class crypto-authentication device for secure key storage. Its integrated 2.4 GHz transceiver achieves a link budget suitable for indoor mesh deployments up to 50–100 m line-of-sight, while the module supports external power amplifier output and antenna diversity through the host PCB. Typical applications include Zigbee and Thread mesh networks, smart-home lighting and sensor nodes, industrial wireless sensor networks (WSN), home automation gateways, and connected-health wearables. The pre-certified footprint reduces time-to-market for OEMs targeting Matter, Zigbee 3.0, or proprietary 802.15.4 stacks using the Atmel/Microchip ASF or Harmony 3 framework. The U.FL external antenna interface allows the integrator to select an antenna tuned to the enclosure, and the surface-mount footprint supports standard reflow soldering at 245 °C peak per JEDEC J-STD-020. Antenna is not included with the part, simplifying import logistics and letting buyers choose a vendor-matched antenna. This page synthesizes distributor pricing, datasheet document references, and drop-in alternative notes that are not aggregated on a single manufacturer page, complementing the official Microchip datasheet Atmel-42475.
AW-CU570 - Tri-Radio Wi-Fi 6 + BLE 5.3 + 802.15.4 Wireless MCU LGA
The AzureWave AW-CU570 is a highly integrated, low-power tri-radio Wireless MCU module based on the NXP RW612 SoC, combining Wi-Fi 6 (IEEE 802.11 a/b/g/n/ac/ax), Bluetooth Low Energy 5.2, and 802.15.4 (Thread/Zigbee) radios in a single surface-mount LGA package. It operates from a single 3.3 V power supply, integrates an Arm Cortex-M33 application MCU subsystem, and supports Matter over Wi-Fi and Matter over Thread for interoperable smart-home and industrial deployments. A wireless MCU (also called a Wi-Fi MCU module or tri-radio module) is a System-on-Module that combines an embedded microcontroller with one or more radio transceivers, providing a turnkey wireless connectivity solution for connected products. The product hierarchy places the AW-CU570 as: tri-radio module -> wireless MCU module -> IoT module -> embedded wireless subsystem. This integration eliminates the need to separately source and certify a discrete MCU plus a Wi-Fi/BLE combo chipset, simplifying FCC/ETSI/CE RF compliance and reducing BOM and time-to-market. Key features include dual-band 2.4/5/6 GHz Wi-Fi 6 (802.11ax) with WPA3 security, Bluetooth LE 5.2 with LE Audio, 802.15.4 for Thread/Zigbee/Matter, an on-board PCB antenna option plus RF pin for external antenna, and Matter-ready application-layer interoperability. The module exposes SDIO/UART/USB/SPI/I2C host interfaces, multiple GPIO, and integrated flash + RAM sufficient for typical IoT firmware stacks. Designed for tight integration and security, the AW-CU570 includes hardware crypto acceleration and secure boot. Architecturally, the AW-CU570 leverages the NXP RW612 silicon, which uses a Cortex-M33 core for application processing and dedicated radio subsystems. By integrating the matching RF front-end, balun, and crystal into a pre-certified LGA module, AzureWave eliminates the most common sources of Wi-Fi/BLE RF failures (mismatch, harmonics, EMI re-radiation) and allows the host PCB to be designed with minimal RF expertise. Typical applications include connected smart-home appliances (Matter-over-Wi-Fi lighting, locks, thermostats), enterprise and industrial IoT gateways, smart energy metering, asset tracking and smart accessories, and Matter-over-Thread border routers. The single-rail 3.3 V supply and small footprint also suit battery-powered wearables. When designing in this module, follow AzureWave's reference design for the host PCB keep-out area around the antenna, honor the module's thermal and supply-rail decoupling guidelines, and ensure the chosen regulatory domain (FCC/IC/CE/TELEC/MIC) is supported on the part variant ordered. The module is pre-certified only as a component - the final product still requires an unintentional-radiator / SAR / host-integrator review. This page synthesizes distributor pricing, drop-in module alternative sourcing, and practical host-PCB design notes that go beyond the AzureWave datasheet summary, helping hardware engineers evaluate the AW-CU570 against alternative tri-radio modules.
AW-HM677 - 802.11ah Wi-Fi HaLow Module 43.3Mbps | AzureWave
The AzureWave AW-HM677 is a fully integrated IEEE 802.11ah Wi-Fi HaLow RF transceiver module operating in the sub-1 GHz license-exempt bands (850-950 MHz), supporting data rates up to 43.3 Mbps with world-first 256-QAM modulation at 8 MHz bandwidth, in an LGA form factor based on the Morse Micro MM8108 radio SoC. Wi-Fi HaLow is the IEEE 802.11ah wireless standard designed specifically for the Internet of Things (IoT). Unlike conventional 2.4 GHz and 5 GHz Wi-Fi, HaLow operates below 1 GHz, where radio propagation attenuates far less through walls, vegetation, and over distance. In the wireless network hierarchy, 802.11ah sits alongside 802.11n/ac/ax as a member of the Wi-Fi family, trading bandwidth for roughly ten times the range and dramatically lower power consumption - making it a long-range, low-power alternative to LoRa, Sigfox, and Zigbee for IP-based connectivity. Key features of the AW-HM677 include compliance with IEEE 802.11ah, PHY data rates up to 43.3 Mbps, support for 1, 2, 4, and 8 MHz channel bandwidths, and integration of the radio, PHY, and MAC functions in a single surface-mount module. The underlying Morse Micro MM8108 silicon provides improved range and power efficiency over the earlier MM6108 generation, with up to 1 km range capability and support for high densities of connected IoT devices. Technically, the module integrates the MM8108 802.11ah radio with front-end circuitry, crystal, and RF matching on a certified LGA substrate, so designers avoid the RF layout, tuning, and regulatory-approval burden of a discrete chip design. The AW-HM677 carries FCC certification (FCC ID 2A74O-737B5B, authorized 902.5-927.5 MHz) and Japan MIC certification, substantially reducing end-product regulatory cost for North American and Japanese deployments. Typical applications include smart city infrastructure, industrial IoT sensors and controllers, video surveillance links, smart agriculture, building automation, and access-point or gateway designs such as the Morse Micro HaLowLink 2, which uses the AW-HM677 as its 802.11ah radio alongside a MediaTek MT7621 CPU. Design consideration: because the sub-1 GHz band regulations differ by region (transmit power is limited to 14 dBm in the EU including the UK and 16 dBm in Japan on hosts using this radio), firmware must enforce region-specific power tables, and antenna selection directly governs achievable link budget. This page synthesizes datasheet data, FCC certification records, gateway reference designs, and module-family comparisons not consolidated in the manufacturer datasheet alone.
AX200NGW - Wi-Fi 6 2x2 2.4Gbps M.2 2230 Module | Intel
The Intel AX200NGW is a Wi-Fi 6 (IEEE 802.11ax) wireless adapter module delivering peak data rates up to 2.4 Gbps, 2x2 MU-MIMO with 160 MHz channel width, and integrated Bluetooth 5.2 connectivity, packaged as an M.2 2230 (E-key) form-factor module. A Wi-Fi adapter module is a complete wireless subsystem that combines an RF transceiver, baseband processor, MAC, and antenna interfaces on a single standardized card. Within the networking hierarchy, the AX200NGW sits in the wireless module family: RF transceiver -> wireless network adapter -> Wi-Fi/Bluetooth combo module -> client connectivity subsystem. Its M.2 2230 footprint follows the NGFF (Next Generation Form Factor) standard used across laptops, desktop motherboards, and embedded systems. Key features include support for UL and DL OFDMA (Orthogonal Frequency-Division Multiple Access) and 1024QAM modulation, which Intel states deliver nearly 40% higher peak data rates and up to 4x network capacity versus prior-generation 802.11ac adapters. Wi-Fi CERTIFIED 6 certification ensures interoperability with the Wi-Fi Alliance ecosystem. Dual-band operation covers the 2.4 GHz and 5 GHz ISM bands. Architecturally, the AX200 attaches via a PCI Express (PCIe) host interface for Wi-Fi data traffic and a separate USB interface for the Bluetooth 5.2 radio. The 2x2 antenna configuration uses two U.FL/MHF4 antenna connectors, enabling spatial-stream multiplexing and beamforming with compatible access points. Typical applications include desktop PC Wi-Fi upgrades via PCIe adapter kits, laptop Wi-Fi replacement (M.2 Key E or Key A/E slots), industrial gateways, and IoT edge devices requiring Wi-Fi 6 air-interface efficiency. OFDMA and target wake time features also reduce latency and battery drain in densely deployed networks. Design consideration: verify host compatibility - some platforms (notably certain 6th-generation Intel CPU laptops) have BIOS-level lockouts, and AMD platforms require driver support but generally work on recent kernels. Confirm CNVio versus standard PCIe distinction: AX200 is standard PCIe, unlike the CNVio2-based AX201. This page synthesizes verified datasheet data, distributor sourcing information, drop-in alternatives, and practical compatibility notes not found in the Intel module brief alone.
AX210NGW - Wi-Fi 6E 2x2 + BT 5.3 M.2 Module | Intel
The Intel AX210NGW is a Wi-Fi 6E (802.11ax) 2x2 MIMO wireless module with integrated Bluetooth 5.3, delivered on an M.2 2230 form factor with an E-key edge connector. It supports tri-band operation on 2.4 GHz, 5 GHz, and the newly opened 6 GHz band, with a maximum PHY data rate of approximately 2.4 Gbps at 160 MHz channel width. A Wi-Fi module is a complete wireless subsystem combining RF transceiver, baseband MAC, and antenna interfaces into a single replaceable card. In the system hierarchy it sits below the host OS driver stack and connects to the platform over a PCIe interface for Wi-Fi traffic and a USB interface for the Bluetooth controller. Key differentiating features include Wi-Fi 6E 6 GHz support for cleaner spectrum and lower interference, 1024-QAM modulation with OFDMA and UL/DL MU-MIMO for dense environments, Target Wake Time (TWT) for battery savings in portable devices, and vPro-capable variants for enterprise manageability. The module uses Intel's integrated MAC/baseband/radio architecture in a compact 2230 (22 mm x 30 mm) M.2 card, requiring only a standard M.2 Key A or Key E slot with PCIe and USB routing. It is RoHS compliant and manufactured by Intel Corporation. Typical applications include laptop and notebook Wi-Fi upgrades, desktop Wi-Fi via M.2 adapter brackets, industrial gateways needing tri-band connectivity, and replacement of older AC 7265/8265 cards in standard NGFF slots. Design consideration: the AX210NGW uses standard PCIe (not CNVio2), making it compatible with AMD and Intel platforms alike, but BIOS whitelisting can block installation in some laptops. This page synthesizes distributor pricing, drop-in alternatives, and practical compatibility notes not found in the manufacturer datasheet.
BCM84758AKFSBLG - 40G Ethernet Transceiver | Broadcom
The Broadcom BCM84758AKFSBLG is a high-speed Ethernet transceiver IC designed for 40G networking applications, housed in a Broadcom proprietary surface-mount package optimized for high-density line-card and switch-fabric layouts. It is part of the Broadcom BCM84758 family and is specified for telecom and datacom infrastructure where robust SERDES links are required. An Ethernet transceiver is a mixed-signal integrated circuit that combines a physical coding sublayer (PCS), physical medium attachment (PMA), and analog front-end to serialize, deserialize, and condition multi-gigabit data streams between a Media Access Controller (MAC) and an optical or copper physical medium. The BCM84758AKFSBLG sits within the hierarchy: ethernet transceiver -> PHY -> network interface IC -> wired communication semiconductor. The category exists because modern switches and routers require dense multi-lane I/O that scales to data-center and carrier-grade line rates. Key features of the BCM84758AKFSBLG include 40G Ethernet data-rate capability, low power consumption suitable for high-density port-count line cards, integrated SERDES with adaptive equalization, and compliance with industry-standard high-speed networking interfaces. The device supports hot-pluggable module integration and is intended for use behind QSFP modules or with on-board optical engines. Architecturally, the part leverages a high-performance CMOS mixed-signal process that combines a multi-gigabit analog front end with digital PCS logic. Adaptive equalization, pre-emphasis, and receive-signal-conditioning circuitry compensate for channel loss at 10+ GHz fundamental frequencies, enabling robust BER performance over typical FR4 backplane channels and direct-attach copper assemblies. Typical applications include 40G Ethernet line cards in top-of-rack switches, QSFP module interfacing in aggregation switches, datacenter fabric interconnects, and telecom OTN/PTN platforms. Low power is essential because line cards may host 24 to 48 such transceivers, and thermal density quickly becomes a board-level constraint. When designing with this part, PCB layout must follow strict high-speed signal-integrity practices: controlled-impedance differential traces, length matching within Skew budget, and a contiguous reference plane on layer 2 directly beneath the SERDES lanes to suppress return-path discontinuities. [DATA_NEEDED: detailed key specs to be confirmed against the manufacturer datasheet PDF]. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet to help sourcing engineers and PCB hardware designers quickly evaluate the BCM84758AKFSBLG for their 40G networking builds.
BLE112-A-V1 - Bluetooth 4.0 BLE Module w/ Chip Antenna | Silicon Labs
The Silicon Labs BLE112-A-V1 is a Class 2 Bluetooth 4.0 low energy single-mode module with an integrated chip antenna, targeting low-power sensors and accessories. It integrates the Bluetooth radio, a microcontroller (based on the TI CC2540), the full BLE software stack, profiles, and customer application space, so no external processor is needed. The module operates from 2.0V to 3.6V and can be powered directly from a standard 3V coin cell or a pair of AAA batteries; in its lowest-power sleep mode it consumes only 400nA and wakes in a few hundred microseconds. A Bluetooth low energy (BLE) module is a type of short-range RF transceiver module in the wireless connectivity family: module -> Bluetooth Low Energy transceiver -> 2.4GHz ISM-band radio -> RF & wireless component. Single-mode BLE devices (Bluetooth Smart) communicate only with BLE-capable devices, offering the lowest possible power consumption compared to dual-mode parts. Key features include full Bluetooth v4.0 single-mode compliance, an integrated chip antenna that eliminates RF layout work, flexible hardware interfaces (SPI and UART) for connecting sensors, user interfaces, or displays directly to the module, and an integrated 8051-based MCU with 18 interrupt sources across six interrupt groups running the Bluegiga (now Silicon Labs) Bluetooth stack. Technically, the module builds on the CC2540 system-on-chip, which combines a 2.4GHz RF transceiver with an industry-standard enhanced 8051 MCU. The Bluegiga firmware implements the complete BLE stack and profiles such as GATT, GAP, and vendor-specific profiles, exposing a simple serial interface for host-less designs. Receiver sensitivity is specified at -85dBm at 0.1% BER, adequate for Class 2 (~10 m line-of-sight) links typical of sensor and accessory designs. Typical applications include battery-powered sensor nodes, fitness and medical accessories, proximity tags, and cable-replacement serial links (UART bridges), where coin-cell life measured in months or years is a hard requirement. Design consideration: keep a keep-out area under the chip antenna free of copper and adjacent RF-absorbing materials, and budget the 2.0V-3.6V supply range so a 3V coin cell remains usable near end of discharge. This page synthesizes distributor pricing, lifecycle status, family replacement options, and practical design notes not found in the manufacturer datasheet.
BLE112-A-V1C - BLE 4.0 Module with U.FL Antenna | Silicon Labs
The Silicon Labs BLE112-A-V1C is a Class 2 Bluetooth Smart (Bluetooth v4.0 single mode) module with a U.FL antenna connector, operating in the 2.4 GHz ISM band at data rates up to 2 Mbps from a 2 V to 3.6 V supply on a 32-pin SMD module footprint. It is the external-antenna variant of the Bluegiga BLE112 family, targeted at low-power sensors and wireless accessories. A Bluetooth Low Energy module is a complete wireless subsystem that integrates a BLE radio, a microcontroller, an antenna or antenna connector, and a certified protocol stack into a single surface-mount package. Within the wireless hierarchy, it sits below full Bluetooth systems and above bare radio chips, allowing designers to add BLE connectivity without developing RF layout, antenna matching, or regulatory certification themselves. Key features include Bluetooth v4.0 single-mode compliance, support for both master and slave roles with 4 or more simultaneous connections in master mode, and an integrated Bluetooth Low Energy stack covering GAP, GATT, L2CAP, SMP, and BLE profiles. The fully integrated approach combines radio, microcontroller, and software stack in one certified module, dramatically reducing development effort. Technically, the module integrates the BLE radio transceiver with an on-board microcontroller running the Bluegiga Bluetooth Smart software, so host processors can communicate over a simple interface or the application can run entirely on-module. The U.FL connector permits an external antenna for optimized range and enclosure flexibility, distinguishing the -V1C variant from the chip-antenna BLE112-A-V1. Typical applications include battery-powered sensor nodes, proximity beacons, fitness and health accessories, and industrial wireless monitoring where a Class 2 link with an externally optimized antenna is preferred. The 2 V to 3.6 V supply range allows direct operation from a coin-cell battery. Design consideration: the U.FL variant requires a mating antenna assembly (U.FL to SMA pigtail plus antenna) in the bill of materials, and the 50-ohm transmission line to the connector should follow controlled-impedance layout practice on the host PCB. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
BLE112-E-V1 - Bluetooth 4.0 BLE Module U.FL | Silicon Labs
The Silicon Labs BLE112-E-V1 is a Bluetooth v4.0 single-mode Bluetooth Low Energy (BLE) transceiver module operating in the 2.4 GHz ISM band, offering 2 Mbps over-the-air data rate, -91 dBm receiver sensitivity, and a supply voltage range of 2.0 V to 3.6 V. The E-version variant features a U.FL RF connector for an external antenna, in a surface-mount module package, and is classified as a Bluetooth Class 2 device. A Bluetooth Low Energy module is an integrated wireless subsystem that combines a 2.4 GHz radio transceiver, a microcontroller, an antenna feed, and a complete BLE software stack on a pre-certified printed circuit assembly. Within the wireless connectivity hierarchy, it sits below full custom radio designs (lower integration effort) and above bare wireless MCUs (higher ease of use), making BLE modules the fastest route to adding short-range, ultra-low-power connectivity to a product. Key features of the BLE112-E-V1 include full Bluetooth 4.0 single-mode compliance, an integrated radio, microcontroller and software stack in one package, an 18-source interrupt controller, and support for power modes 1 and 2 in which the sleep timer keeps running to minimize average current draw. The module is targeted specifically at low-power sensors and accessories where battery life, not throughput, is the primary design constraint. Technically, the module is built around the CC2540 Bluetooth SoC, which pairs an industry-standard 8051 core with a 2.4 GHz RF transceiver. Peripheral peripherals can choose between two alternate I/O pin locations for layout flexibility, and an ultra-low-power sleep timer uses an external 32.768 kHz crystal oscillator. Receiver sensitivity of -91 dBm provides practical indoor range for a Class 2 device, while the 2 Mbps PHY minimizes radio-on time. Typical applications include battery-powered sensor nodes and beacons, wireless health and fitness accessories, smart-home sensor peripherals, and RS232-over-BLE cable replacement links in industrial equipment. When designing with the BLE112-E-V1, plan the power budget around sleep modes and remember that the E variant requires an external antenna connected via the U.FL receptacle; the -A variant integrates the antenna on the PCB instead. Supply rails must stay within 2.0 V to 3.6 V, ideally from a primary lithium or single Li-Ion cell. This page synthesizes verified distributor pricing, drop-in same-family alternatives, and practical design guidance not consolidated in the manufacturer datasheet.
BLE113-A-M256K - Bluetooth 4.0 BLE Module 256K Flash | Silicon Labs
The Silicon Labs BLE113-A-M256K is a Bluetooth Smart (Bluetooth v4.0 low energy) transceiver module operating at 2.4 GHz with an integrated chip antenna, 256 KB flash memory, a supply range of 2.0 V to 3.6 V, 2 Mbps over-the-air data rate, and -93 dBm receiver sensitivity. It is a fully integrated Bluetooth Smart solution combining the radio, a microcontroller, and the Bluetooth software stack in a single surface-mount module. A Bluetooth Low Energy (BLE) module is a complete wireless subsystem within the broader hierarchy of RF transceiver modules and short-range wireless communication devices. Whereas a bare radio chip requires the designer to integrate a microcontroller, antenna matching network, and protocol stack, a BLE module such as the BLE113 integrates all features required for a Bluetooth smart application: the Bluetooth radio, antenna, MCU, and certified stack, reducing time to market and RF design risk. Key features include the 256 KB flash variant (versus 128 KB on BLE113-A-V1), which is significant for over-the-air (OTA) firmware updates and extensive BGScript applications, integrated chip antenna eliminating external RF matching design, and low power operation targeted at small sensors and accessories. Serial interfaces include ISP, PWM, SPI, and UART, allowing flexible host connectivity or fully standalone operation via BGSCRIPT. Technically, the module is built around the Texas Instruments CC2541 utilized IC and belongs to the Bluegiga BLE113 family acquired by Silicon Labs. The -93 dBm sensitivity supports reliable connections at Class 2 power levels on the 2.4 GHz ISM band, and the integrated antenna means the RF performance is pre-certified, saving regulatory test cost. Typical applications include low-power sensors and accessories, battery-powered health and fitness devices, beacons, smart home endpoints, and industrial wireless sensor nodes where a compact, certified BLE link is required. A key design consideration is supply voltage: the module accepts only 2.0 V to 3.6 V, so a single CR2032 coin cell or a regulated LiPo rail works well, but 5 V systems require an LDO. Allow antenna keep-out clearance on the PCB around the chip antenna region. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
BLE113-A-V1 - Bluetooth 4.0 BLE Module, 2V-3.6V | Silicon Labs
The Silicon Labs BLE113-A-V1 is a Bluetooth Smart (Bluetooth 4.0 low energy) transceiver module operating in the 2.4 GHz ISM band from a 2.0 V to 3.6 V supply, with a receive sensitivity of -93 dBm and an integrated chip antenna in a compact 28-pad surface-mount castellated package. Originally developed by Bluegiga Technologies, later acquired by Silicon Labs, it targets small, low-power sensors and accessories. A Bluetooth Low Energy (BLE) module is a complete short-range wireless subsystem that integrates the 2.4 GHz radio transceiver, a microcontroller, the BLE software stack, and an antenna into a single certified unit. Within the connectivity hierarchy (module -> BLE radio -> 2.4 GHz transceiver -> RF IC -> semiconductor), modules eliminate the RF design, regulatory certification, and stack porting work otherwise required of a discrete chip design. Key features of the BLE113 include a fully integrated Bluetooth radio, microcontroller, and GATT-based software stack; the ability to host the end-user application on-module via the BGSCRIPT scripting language or BLE API, so no external MCU is needed in size- or price-constrained devices; serial interfaces including UART, SPI, PWM, and ISP for system integration; and very low power consumption for battery-powered designs (active-mode current is roughly 6 mA per Silicon Labs community measurements on comparable firmware). Architecturally, the module is built around the Texas Instruments CC2541 BLE system-on-chip running the Bluegiga iWRAP-based Bluetooth Smart stack. The GATT profile server and client, security manager, and OTA-capable firmware structure are all resident on-module, exposing a simple UART API or BGSCRIPT environment to the host. Typical applications include battery-powered IoT sensors, fitness and health accessories, smart tags and beacons, and industrial wireless sensor nodes - anywhere a certified Bluetooth Smart link must be added without RF expertise. The integrated chip antenna keeps the BOM minimal and removes antenna tuning from the design cycle. A key design consideration: the BLE113-A-V1 variant contains only 128 kB of flash. If you plan over-the-air firmware updates or a large BGSCRIPT application, the pin-compatible BLE113-A-M256K with 256 kB flash is the better choice within the same footprint. This page synthesizes distributor pricing, drop-in alternatives, practical design notes, and migration guidance from Silicon Labs application note AN1036 - information not consolidated in the manufacturer datasheet alone.
BLE113-A-V1C - Bluetooth 4.0 Smart Module, 2V-3.6V | Silicon Labs
The Silicon Labs BLE113-A-V1C is a Bluetooth Smart (Bluetooth v4.0 low energy) Class 2 module targeted at small, low-power sensors and accessories, operating from a 2V to 3.6V supply with 2Mbps over-the-air data rate on a 36-pin SMD land pattern with an integrated chip antenna. A Bluetooth Smart module is a complete wireless subsystem that integrates the 2.4GHz Bluetooth radio, a microcontroller, the BLE software stack, and GATT-based profiles into a single certified unit. Within the system hierarchy, it sits between a discrete BLE chipset design (radio IC plus external host MCU plus software) and a full system-on-chip; modules such as the BLE113 fall into the broader categories of RF module, transceiver module, and wireless connectivity IC. Key features include full integration of radio, MCU (8051-based, running the Bluegiga Bluetooth Smart stack), and antenna, which removes RF layout effort and regulatory certification burden. Supply operation from 2V to 3.6V allows direct powering from a 3V coin cell. The module can host end-user applications via BGScript or the BGAPI serial protocol, meaning many designs need no external microcontroller at all - a significant saving in size, BOM cost, and power. Architecturally, the BLE113 combines a Bluetooth radio with an integrated MCU executing the Bluetooth low energy protocol stack and GATT profiles. The V1C variant carries the standard flash configuration of the BLE113 family (128kB flash; the A-M256K variant offers 256kB for OTA updates and larger BGScript applications). Typical applications include battery-powered sensor nodes, proximity and iBeacon-style beacons, wearable accessories, smart-home devices, and small medical/health peripherals where compact size and low average current dominate. Design consideration: because the V1C uses an internal chip antenna, keep clearance around the antenna area per the Bluegiga layout guidelines; the A-V1 variant (external antenna connection) is the choice when metal or enclosure constraints demand an external antenna. This page synthesizes distributor pricing, drop-in family alternatives, and practical design guidance not found in the manufacturer datasheet.
BLED112-V1 - Bluetooth 4.0 BLE USB Dongle | Silicon Labs
The Silicon Labs BLED112-V1 is a single-mode Bluetooth Low Energy (Bluetooth 4.0) USB dongle operating in the 2.402 GHz to 2.48 GHz ISM band at 1 Mbps, with -91 dBm receiver sensitivity and approximately 30 m range, housed in a USB Type-A dongle form factor powered from a 3.6 V to 5.5 V USB supply. A BLE USB dongle is a complete wireless connectivity module that integrates the Bluetooth radio, a microcontroller running the BLE protocol stack, and an antenna into a USB stick. In the connectivity hierarchy it sits at the module level: Bluetooth 4.0 single-mode device (BLE only), implemented as a network co-processor controlled by an external host over USB. Unlike standard Bluetooth dongles that rely on the operating system Bluetooth stack, the BLED112 exposes the full BLE controller and GAP/GATT functionality to the application. Key features include full BLE 4.0 single-mode operation, the Bluegiga BGAPI serial protocol that lets any external host (PC, MCU, LabVIEW) control the stack over USB, the BGScript scripting language for standalone operation, and the Bluegiga Profile Toolkit for rapid custom GATT profile prototyping. The integrated antenna removes RF design effort, and -91 dBm sensitivity supports robust links up to roughly 30 m in line-of-sight conditions. Architecturally, the BLED112 embeds Silicon Labs (Bluegiga) BLE silicon with on-board flash running the Bluetooth stack, so the host only needs to send BGAPI commands over the USB CDC interface. This bypasses the limitations of native Windows, macOS, and Linux BLE stacks, giving applications full control over GATT communication and BLE advertisements - a key reason it is widely used in test fixtures and instrumentation. Typical applications include adding BLE connectivity to PCs and embedded hosts for sensor data acquisition, BLE development and profiling with two dongles, LabVIEW-based BLE test systems, and robotics and IoT gateway links. Design consideration: because the part is end-of-life, plan a migration path early; the BGAPI protocol is shared across the Silicon Labs BLE module family, which eases firmware-level porting even though a mechanical USB-dongle drop-in is scarce. This page synthesizes distributor availability data, BGAPI ecosystem information, drop-in replacement analysis, and practical design notes not found together in the manufacturer datasheet.
BLED112-V1C - Bluetooth 4.0 Low Energy USB Dongle | Silicon Labs
The Silicon Labs BLED112-V1C is a Bluetooth v4.0 Low Energy (BLE) USB dongle transceiver module operating in the 2.402 GHz to 2.48 GHz band with integrated antenna, -91 dBm receiver sensitivity, and up to 30 m range, powered from a 3.6 V to 5.5 V supply over USB. A BLE dongle is a finished, fully certified Bluetooth Low Energy radio unit in a USB stick form factor. Unlike bare RF modules that require antenna design and regulatory testing, a dongle integrates the radio, microcontroller, BLE stack, and antenna, and plugs directly into a host USB port. In the connectivity hierarchy it sits under: Bluetooth module -> short-range wireless transceiver -> RF transceiver finished unit -> wireless communication device. Key features include Bluetooth v4.0 single-mode low energy operation at 1 Mbps, a UART serial interface alongside native USB, support for the Bluegiga BGAPI binary protocol and BGScript scripting, and R&TTE Directive (1999/5/EC) conformity with Anatel certification (06875-18-03402) for Brazil. These attributes allow hosts without native BLE to gain BLE connectivity with zero RF design effort. Architecturally, the BLED112 combines an integrated Bluetooth radio, microcontroller, and pre-flashed software stack. Application logic can run on-board using the Bluegiga Profile Toolkit and BGScript, or the host can drive the module over BGAPI, offloading the entire BLE stack from the host CPU. This makes it a favorite in PC-based instrumentation and test setups. Typical applications include adding BLE to lab equipment and data loggers, Linux, Android, and Windows host connectivity for BLE sensors, BLE profile prototyping using two dongles, and industrial wireless configuration tools. The 30 m range and integrated trace antenna suit desktop and benchtop use. Design consideration: because the dongle is a finished USB unit, the main integration risk is host driver and BGAPI software compatibility rather than RF layout; plan software migration early since the family is nearing end-of-life. This page synthesizes distributor pricing, same-brand drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
BLUENRG-M0A - BLE v4.2 Module, -85dBm, 2.4GHz | STMicroelectronics
The STMicroelectronics BLUENRG-M0A is a very low-power Bluetooth Low Energy (BLE) v4.2 network processor module built around the BlueNRG-MS SoC, housed in an integrated surface-mount chip antenna package. The module operates across the 2.4 GHz to 2.4835 GHz ISM band and delivers up to +8 dBm transmit power with -85 dBm receiver sensitivity, providing robust link margins for typical IoT indoor and outdoor deployments. It supports Bluetooth SIG end-product certification with pre-certifications across major world regions, dramatically reducing time-to-market for connected products. A Bluetooth Low Energy (BLE) module is a self-contained radio subsystem that integrates the transceiver IC, crystal, antenna, and matching network into a single surface-mount unit, allowing designers to add wireless connectivity without RF layout expertise. Within the connectivity hierarchy, BLE sits below Wi-Fi in data rate (typically 1 Mbps) but offers much lower power consumption (peak currents in the single-digit milliamp range), making it the preferred choice for coin-cell and energy-harvesting IoT devices. The BLE module category itself bridges wireless transceiver ICs and complete wireless modules. Key specifications include 20 mA peak transmit current, ultra-low sleep current, SPI host interface (up to 8 MHz), and an integrated 32 MHz crystal. The module supports master and slave roles simultaneously and operates from -40 °C to +85 °C. According to the BlueNRG-M0 modules flyer, the BLUENRG-M0A is pin-compatible with the BLUENRG-M0L ceramic antenna variant, enabling designers to migrate between antenna types on the same PCB footprint. The BlueNRG-MS die inside the module uses a Cortex-M0 core architecture with embedded Bluetooth protocol stack, offloading all link-layer and host-stack processing from the external host MCU. This network-processor approach minimizes host-side firmware complexity while preserving full BLE v4.2 feature coverage, including LE Privacy 1.2, LE Data Length Extension, and up to eight simultaneous connections. Typical applications include wearable fitness bands, BLE beacons (iBeacon and Eddystone), industrial sensor nodes, smart home bridges, medical monitoring patches, and remote control units. The combination of pre-certified module-level compliance and ultra-low power makes it particularly suitable for battery-powered products targeting FCC, CE, IC, TELEC, and KCC regulatory domains. When designing with the BLUENRG-M0A, route the host SPI bus with short traces and 50 Ω-controlled impedance where possible, and place at least 5 mm of clearance around the chip antenna area to avoid ground-plane detuning. Decoupling VDDL with a 100 nF ceramic capacitor placed within 3 mm of the pin ensures stable operation across load transients. This page synthesizes distributor pricing, drop-in compatible alternatives across the BlueNRG module family, and practical RF design notes not found in the standalone datasheet - including a parameter-by-parameter comparison against the M0L, M2SA, and M2SP variants.
BLUENRG-M0L - Bluetooth v4.2 LE Module 2.4GHz | STMicroelectronics
The STMicroelectronics BLUENRG-M0L is a Bluetooth v4.2 compliant, very low-power network processor module that operates in the 2.4 GHz to 2.4835 GHz ISM band. It is a surface-mount integrated chip antenna module that combines an embedded Bluetooth low-energy protocol stack with master/slave role support and simultaneous multiple-role operation, enabling concurrent sensor and hub functions on the same module. A Bluetooth Low Energy (BLE) module is a certified sub-system that bundles the radio transceiver, baseband, protocol firmware, and often an integrated antenna into a single reflow-solderable package. Within the wireless connectivity hierarchy, BLE modules sit below bare SoCs and above discrete 2.4 GHz radios: they trade flexibility for faster time-to-market because the wireless regulatory certification and stack integration are already completed by the module vendor. The BlueNRG-M0 family targets ultra-low-power IoT nodes where battery life, footprint and BOM count matter more than raw compute. Key features include Bluetooth v4.2 master/slave support, multi-role operation, an integrated chip antenna, surface-mount packaging in an 11-SMD module form factor, and an output power of 6 dBm. The BLUENRG-M0L variant differs from the BLUENRG-M0 in its regulatory certifications and is built around the BlueNRG-MS silicon. Sensitivity is rated at -85 dBm, receive current is 16.36 mA, and transmit current is 13.25 mA to 27.35 mA depending on output power setting. Architecturally, the BLUENRG-M0L is built around a low-power Cortex-M0 core running ST's embedded Bluetooth low-energy stack. The integrated chip antenna, RF matching network, crystals, and passive components are pre-tuned inside the module, so the host MCU only communicates with it over a UART/SPI host interface. This removes the need for 50-ohm RF layout expertise and saves several weeks of PCB iteration. Typical applications include BLE sensor nodes, beacons, smart-home hubs, fitness and medical wearables, industrial telemetry, and remote controls. The -40C to +85C operating range makes it usable in outdoor and industrial deployments. Because the regulatory certification is pre-done, designers can skip the FCC/CE/IC RF certification cycle and ship products faster. When designing with the BLUENRG-M0L, leave the antenna keep-out area clear of copper on all PCB layers and avoid placing metal components or shields above the antenna. Provide a stable 1.7 V to 3.6 V supply and place a 1 uF decoupling capacitor close to the module's VDD pin. The host MCU must drive the module via the documented ACI (Application Command Interface) over SPI or UART; firmware updates go through the bootloader. This page synthesizes distributor pricing, package-level drop-in variants, and practical design notes for fast time-to-market BLE designs that go beyond what the ST datasheet flyer alone provides.
BM71BLES1FC2-0004AA - BLE 5.0 Module, 9x11.5mm | Microchip
The Microchip Technology BM71BLES1FC2-0004AA is a fully certified Bluetooth 5.0 Low Energy (BLE) transceiver module operating in the 2.4 GHz ISM band, housed in a shielded 16-SMD surface-mount package measuring 9 x 11.5 x 2.1 mm with an integrated chip antenna. The module supports industrial operating temperature range of -40C to +85C. A Bluetooth Low Energy (BLE) module is a type of short-range RF module that integrates a Bluetooth radio, baseband controller, and protocol stack into a single shielded unit. Within the wireless hierarchy, it sits between discrete RF transceiver chips and fully qualified end products, allowing OEMs to skip costly Bluetooth SIG qualification and RF tuning. BLE, also called Bluetooth Smart, is the low-power variant of the Bluetooth 802.15.1 standard optimized for battery-powered devices. Key features of the BM71 family include Bluetooth 5.0 compliance delivering up to 2.5x throughput improvement over Bluetooth 4.1 based designs, more secure connections, an on-board chip antenna requiring no external RF matching, and full shielding for coexistence with other radios. The embedded firmware implements the complete BLE stack, so the host MCU only needs a simple UART interface. Technically, the BM71 uses Microchip's certified radio with an embedded protocol stack, offloading advertising, connection management, GATT services, and security pairing from the host processor. Configuration is performed via simple ASCII or transparent UART commands, reducing firmware complexity and certification burden. Typical applications include IoT sensor nodes, smart home devices, battery-powered beacons, industrial wireless sensors, and connected medical accessories, where the module's low power sleep modes and small 9 x 11.5 mm footprint fit space- and energy-constrained designs. Design consideration: keep the module antenna region clear of ground planes and metal per Microchip's layout guidelines, and power the module from a clean 3.3V rail with local decoupling. This page synthesizes distributor availability, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
BM71BLES1FC2-0B02AA - BLE 5.0 Module 9x11.5mm | Microchip
The Microchip Technology BM71BLES1FC2-0B02AA is a fully certified Bluetooth 5.0 Low Energy (BLE) transceiver module operating in the 2.4 GHz ISM band, housed in a shielded 9 x 11.5 x 2.1 mm surface-mount package with an integrated chip antenna and -90 dBm receiver sensitivity. A Bluetooth Low Energy module is a complete wireless subsystem that integrates a BLE radio, baseband, protocol stack, and antenna into a single certified unit. In the system hierarchy it sits above discrete RF ICs (which require external stack development and RF design) and below complete host systems, functioning as a serial-to-BLE bridge that frees the host MCU from managing the Bluetooth software stack, timing-critical RF firmware, and regulatory certification. Key features of the BM71BLES1FC2-0B02AA include Bluetooth Core 5.0 compliance with up to 2.5x throughput improvement over earlier BM70-generation silicon, a completely integrated Bluetooth software stack with configuration via simple ASCII commands over UART, a shielded enclosure for EMI reduction, and an integrated chip antenna on a regulatory-certified variant. Supply voltage spans 1.9 V to 3.6 V, suiting single-cell lithium and 3.3 V logic designs, and the module is rated for industrial temperature environments. Architecturally, the BM71 embeds Microchip's BLE silicon with flash memory for stack and application script storage. The certified, shielded, antenna-integrated construction means the RF matching network, crystal, and antenna have been tuned by Microchip, removing the most error-prone portion of a wireless design. Developers interact with the module as a wireline replacement: UART data in, BLE data out. Typical applications include smart-home sensors and actuators, battery-powered IoT beacons, industrial wireless configuration and diagnostic links, and connected health accessories. The industrial temperature rating and shielded package also suit networked lighting controls and commercial building automation. A key design consideration is layout: although the antenna is integrated, keep at least the datasheet-recommended keep-out area free of copper and plastics above the antenna region to preserve the certified radiation pattern and sensitivity. This page synthesizes distributor pricing (as of 2026-10-19), drop-in family alternatives, design notes, and long-tail selection guidance not found in the manufacturer datasheet.