射频模块
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WNFQ-291BEI - Wi-Fi 7 Tri-Band M.2 Module | SparkLAN
The SparkLAN WNFQ-291BEI is a Qualcomm-based Wi-Fi 7 wireless module in an M.2 2230 E-key form factor, supporting tri-band 2.4 GHz, 5 GHz, and 6 GHz operation with 2x2 MU-MIMO and up to 320 MHz channel bandwidth. The WNFQ-291BEI(BT) configuration combines PCIe Wi-Fi and USB Bluetooth connectivity in one module. A wireless module is a compact radio subsystem that integrates an RF transceiver, baseband processing, antenna interfaces, and host connectivity into a standardized package. The WNFQ-291BEI belongs to the Wi-Fi module hierarchy and is intended for embedded systems requiring modern wireless networking without designing a complete RF front end from discrete components. Its M.2 2230 E-key format supports platforms that already provide an M.2 adapter. Key capabilities include IEEE 802.11be, ax, ac, a, b, g, and n protocol support, dual-band dual-concurrent operation, 2x2 spatial streams, and concurrent use of 2.4 GHz with either 5 GHz or 6 GHz. The verified product information also identifies 4096-QAM support and compatibility with Windows, with Linux support described as forthcoming in the cited source. Technically, the module combines a Qualcomm-based wireless platform with PCIe connectivity for Wi-Fi and USB connectivity for Bluetooth in the WNFQ-291BEI(BT) version. DBDC operation allows the host system to manage multiple wireless links concurrently, which is useful for gateways, industrial controllers, and connected equipment. The available data does not state the module's exact insertion power, temperature range, regulatory approvals, antenna connector details, or supported country list. Typical applications include industrial IoT gateways, Wi-Fi 7 access points, embedded computers, robotics platforms, test equipment, and connected building systems. Because the module is supplied as an M.2 module rather than a bare IC, host firmware, operating-system support, antenna design, and regulatory integration remain part of the product qualification process. For design-in, verify the host M.2 connector's PCIe and USB routing, confirm the host driver and OS support, and validate antennas for each required frequency band. This page combines the verified SparkLAN product data with practical module-integration considerations; unavailable electrical and mechanical details are marked explicitly rather than inferred.
WS2118-00 - BLE4.2 + Sigfox Multi-Protocol Module | Jorjin
The Jorjin WS2118-00 is a multi-protocol RF transceiver module that integrates an STMicroelectronics BlueNRG-1 BLE 4.2 radio and an ST S2-LP sub-1GHz transceiver on a single surface-mount LCC-36 module with U.FL antenna connector. It supports both Bluetooth Low Energy 4.2 (2.4 GHz) and Sigfox sub-1GHz operation across the 868 MHz to 923 MHz ISM bands, enabling dual-radio IoT node designs on one PCB footprint. The module exposes an integrated balun, reset, watchdog, and on-module temperature sensor for compact, low-BOM host designs. A multi-protocol RF transceiver module is a small surface-mount assembly that combines one or more radio ICs, matching networks, crystal references, and (typically) an antenna interface into a single certified-or-module-level-tested building block. By integrating the BlueNRG-1 and S2-LP radios, the WS2118-00 belongs to the hierarchy: RF transceiver module -> wireless connectivity module -> IoT building block -> embedded electronic component, and lets designers skip discrete RF matching and regulatory pre-compliance work. Key features include BLE 4.2 stack support on the BlueNRG-1 core, Sigfox RC1/RC2/RC3/RC4 zone coverage on the S2-LP core, integrated balun for both radios, an internal temperature sensor, hardware watchdog, and a reset pin accessible to the host MCU. The module operates from a single 3.3 V supply rail typical for IoT nodes and exposes UART/SPI host interfaces for firmware flashing and command-mode control. At the architecture level, the BlueNRG-1 (ARM Cortex-M0 + BLE 4.2 radio) handles BLE link-layer and upper-stack duties, while the S2-LP provides long-range, ultra-low-power sub-1GHz Sigfox connectivity. The two radios share the host bus but use separate RF chains, which simplifies antenna design via the single U.FL port and supports coexistence through firmware timing on the host controller. Typical applications include Sigfox+BLE asset trackers, IoT sensor nodes that need both BLE provisioning and long-range Sigfox uplink, smart-metering endpoints, and industrial wireless telemetry. The dual-radio combination is particularly attractive for devices that need smartphone-based commissioning plus wide-area network uplink. When designing with this module, plan antenna placement carefully: the U.FL connector requires a 50 ohm trace or external antenna, and regulatory certification is the integrator's responsibility for the final host product. Decoupling capacitors near the host-side supply pins are recommended. This page synthesizes distributor stock, pricing tiers, drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet.
WSM-BL241-ADA-008 - BLE 5.0 Module, nRF52832, 3.5dBm | Murata
The Murata WSM-BL241-ADA-008 is a Bluetooth 5.0 Low Energy transceiver module integrating the Nordic nRF52832 SoC, RF front-end, and crystal in a compact surface-mount package. It operates in the 2.4 GHz ISM band with up to 3.5 dBm transmit output power and -93 dBm receive sensitivity at 1 Mbps, delivering reliable short-range wireless connectivity for IoT and embedded products. The module supports supply voltages from 1.7 V to 3.6 V and is qualified for integrated trace antenna designs. A Bluetooth Low Energy (BLE) module is a self-contained wireless subsystem that bundles a radio transceiver, baseband controller, and host microcontroller (or co-processor interface) into a pre-certified RF package. BLE modules occupy the same hierarchy as Wi-Fi and 802.15.4 modules under the broader wireless connectivity umbrella, enabling engineers to add mobile/cloud-linked wireless control without redesigning the RF chain. The nRF52832 inside this Murata module is an ARM Cortex-M4 SoC, placing the module in the wireless MCU category alongside ESP32 and STM32WB devices. Key features include 64 KB RAM and 512 KB flash on the integrated ARM Cortex-M4 core, BLE 5.0 long-range and 2 Mbps PHY support, and a regulated 1.7-3.6 V supply range that allows direct connection to coin cells or Li-ion batteries. The module exposes an integrated trace antenna and is pre-tested for FCC/IC modular approval, which significantly reduces end-product certification cost. According to Murata's product documentation, the WSM-BL241-ADA-008 is mechanically and pin-compatible with the MBN52832 family footprint. Typical applications include BLE beacons and proximity tags, fitness and wearable sensors, industrial sensor nodes, smart-home lighting and HVAC controls, and asset-tracking devices that need reliable battery-powered radio links. The module is also a strong fit for medical peripherals and remote controls where the integrated stack and pre-certified RF reduce firmware burden. When designing with this module, allocate the antenna keep-out zone per Murata's reference layout and observe the 1.7-3.6 V supply limit; adding a 10 uF bulk plus 0.1 uF bypass capacitor near VDD is recommended. For pin-compatible upgrades within the family, review the Murata MBN52832 platform documentation, which shares the same nRF52832 silicon and module footprint. This page synthesizes distributor pricing, same-brand Murata alternatives, and design considerations specific to the WSM-BL241-ADA-008 that go beyond the standard datasheet, helping engineers evaluate the module for battery-powered BLE designs.
WSM-BL241-ADA-008DK - BLE 5 Dev Kit for nRF52832 | Murata
The Murata WSM-BL241-ADA-008DK is an evaluation and application development kit for the MBN52832 Bluetooth Low Energy module, featuring an integrated Nordic nRF52832 SoC with ARM Cortex-M4 core, 64 KB RAM, and 512 KB flash. The kit operates in the 2.4 GHz ISM band, supports Bluetooth 5.x (BLE) protocol, and is delivered as a ready-to-use development board with onboard U.FL connector for RF measurements and trace antenna option. A Bluetooth Low Energy development kit is a hardware platform that allows engineers to prototype, evaluate, and certify wireless products without designing RF circuitry from scratch. Within the broader taxonomy, BLE dev kits fall under RF & Wireless > RF Modules, which themselves sit inside RF & Wireless connectivity solutions used in IoT, industrial sensors, and consumer electronics. The "DK" suffix on this part number indicates a developer-kit variant (versus the bare module WSM-BL241-ADA-008), and the underlying MBN52832 module combines a 2.4 GHz transceiver, ARM Cortex-M4 CPU, flash memory, and a high-speed clock into a compact surface-mount package. Key features of this kit include Bluetooth v5.0 protocol compatibility, support for NFC tag interface (per Murata's MBN52832 product line documentation), 2.4 GHz frequency operation, an integrated PCB trace antenna with optional U.FL connector for conducted RF testing, and full Nordic nRF52 Software Development Kit (SDK) compatibility. The kit ships with all necessary firmware and documentation to begin application development immediately, eliminating weeks of RF layout work for the developer. Technically, the kit's underlying MBN52832 module integrates the Nordic nRF52832 silicon, an ARM Cortex-M4F processor with FPU, 512 KB flash and 64 KB RAM, a 2.4 GHz radio supporting BLE 5.x features (2 Mbps PHY, LE Coded PHY, advertising extensions), and onboard DC-DC and LDO regulators. The dev board exposes GPIO headers, USB interface for power/programming, and the U.FL antenna path so engineers can run radiated or conducted RF tests per their target country's regulatory requirements. Typical applications include BLE sensor nodes for industrial IoT, beacons for retail/asset tracking, wearables for health monitoring, smart-home devices (locks, lights, thermostats), and HID peripherals such as wireless mice/keyboards. The kit is also used as a reference design baseline for FCC/ETSI/CE pre-compliance RF testing. When designing with this kit, engineers should note that the U.FL connector provides a 50-ohm controlled-impedance microstrip path (per Mouser specifications) that must be maintained if RF conducted measurements are required. The kit is intended for evaluation only - it is not a deployable module; production designs use the bare MBN52832 module instead.
WSSFM10R1 - Wisol Sigfox RCZ1 Module 13x15mm | Sub-1GHz LPWAN
The Wisol WSSFM10R1 is a miniaturized Sigfox-only mode RF module measuring 13.0 x 15.0 x 2.21 mm, designed for RCZ1 (Europe, Middle East, Africa) plus RCZ6 (India) and RCZ7 (Russia) regional Sigfox operation. It integrates an on-board MCU and an integrated RF transceiver, exposes UART for external host communication, and uses a TCXO for tight frequency tolerance across operational bands. The module ships in a 31-pin SMD land-grid footprint rated for tape-and-reel packaging and is targeted at sub-1 GHz ultra-narrow-band IoT links where Sigfox is the chosen LPWAN. A Sigfox module is a pre-certified sub-GHz radio plus protocol-stack module that abstracts the physical and MAC layers of the Sigfox LPWAN so the host MCU only needs to issue AT commands over UART. Sigfox modules sit below the application MCU and above the bare RF transceiver in the connectivity hierarchy (Sigfox module -> sub-GHz LPWAN module -> wireless module -> IoT connectivity IC -> semiconductor). They are favored for asset tracking, smart sensors, smart buttons, and metering endpoints because the radio is pre-tuned and the protocol stack is pre-licensed. Key features of the WSSFM10R1 include Sigfox-only protocol operation, integrated TCXO for frequency stability, UART command interface, 31-pin SMD land-grid package, and pin-to-pin compatibility across the RCZ1/RCZ2/RCZ3/RCZ4 Wisol Sigfox family per the manufacturer datasheet. The module is built around an OnSemi AX-Sigfox transceiver implementation, which simplifies customer designs by eliminating the discrete RF matching network normally required for Sigfox CE compliance. The architecture pairs an OnSemi Sigfox modem SoC with a TCXO reference, antenna RF chain, and power-tree filtering, all routed to the host through a UART bridge. Module firmware exposes the AT command set; GPIO2 and GPIO3 are reserved as "Not connected" on RCZ2/RCZ4-compatible variants and unused on RCZ1 SKUs. Typical applications include Sigfox asset tracking, animal tracking tags, smart metering endpoints, smart city sensors, push-button remote controls, and healthcare wearables. The Wisol WSSFM10R1 is well-suited whenever a low-data-rate, ultra-low-power uplink is required and the deployment region falls inside the RCZ1, RCZ6, or RCZ7 Sigfox coverage zones. When designing in this part, mount the module on a PCB with a 50-ohm controlled-impedance antenna trace to the chip antenna or external antenna connector, keep the TCXO area clear of thermal gradients, and confirm regional Sigfox zone membership (RCZ1) before committing the BOM. The WSSFM10R1 is also distinguished from the WSSFM10R1AT AT-command variant by its firmware image - both share the same 31-pin SMD footprint. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
WSSFM10R1AT - Sigfox RCZ1 868MHz AT-Command RF Module | WISOL/SeongJi
The WISOL/SeongJi WSSFM10R1AT is a compact Sigfox RCZ1-compliant, AT-command-controlled sub-1 GHz RF transceiver module measuring 13.0 mm x 15.0 mm x 2.21 mm in a 31-pin SMD package. It is designed for Europe/ETSI 868 MHz Sigfox Monarch zones and uses an external antenna connection to deliver ultra-low-power bidirectional uplink/downlink communication on the Sigfox public 0G network. A Sigfox module is a pre-certified radio module that implements the proprietary Sigfox Low-Power Wide-Area Network (LPWAN) protocol stack, which sits above the physical sub-1 GHz layer (typically 868 MHz in Europe) and below the application firmware. Within the broader taxonomy, Sigfox belongs to LPWAN -> Low-Power Wide-Area Networking -> Wireless Connectivity -> RF & Wireless modules -> Semiconductor assemblies. By embedding the full Sigfox protocol stack and offering AT-command control, the WSSFM10R1AT lets product firmware treat the radio as a black-box modem rather than re-implementing the physical and MAC layers on a bare transceiver. Key features of the WSSFM10R1AT include: Sigfox RCZ1 zone compliance (ETSI EN 300 220), an integrated 31-pin SMD form factor, AT-command interface for UART-driven control, and an ultra-low-power sleep mode suited to coin-cell and battery-operated IoT endpoints. The module operates from a single 3.3 V supply typical of low-power IoT sensor nodes, and integrates the matching network, SAW filter, and crystal reference, simplifying host PCB design. Pin 1 marking and 31-pin SMD pad pattern enable surface-mount assembly on standard reflow profiles. The architecture combines a sub-1 GHz RF transceiver core with an on-board microcontroller running the Sigfox protocol stack. The host MCU communicates with the module over UART using AT commands, transparently handling Sigfox frame formation, sequence-number generation, and ETSI duty-cycle compliance. This offloads a significant firmware burden from the host, allowing the application processor to focus on sensing, local processing, and power management rather than radio protocol details. Typical applications include wireless battery field monitoring, smart parking sensors, asset tracking, environmental monitoring (temperature, humidity, air quality), smart agriculture soil/livestock sensors, and industrial IoT endpoints requiring multi-year battery operation. The RCZ1 zone targets Europe, the Middle East, and parts of Africa where Sigfox 868 MHz infrastructure is deployed. When designing with this module, observe the antenna placement guidelines from the manufacturer: keep the antenna radiating element clear of ground planes and battery metals, and route the host UART lines away from noisy switching power traces to avoid coupling into the receiver. Pay attention to host-side flow-control handshaking during long Sigfox frame transmissions. This page synthesizes distributor pricing across DigiKey, Mouser, Avnet, JLCPCB, and Octopart, plus drop-in same-package alternatives and practical RF layout notes that are not aggregated in any single manufacturer datasheet.
WSSFM10R4AT - Sigfox RC4 RF Module, 1GHz, 31-Pin SMD | Wisol
The Wisol WSSFM10R4AT is a Sigfox-certified sub-1 GHz RF transceiver module designed for operation in the Sigfox RC4 (Regional Configuration 4) zone, which covers Latin America and parts of Asia-Pacific. Built around the S2-LP sub-1 GHz transceiver IC and an integrated STM32 microcontroller, the module delivers long-range, ultra-narrowband connectivity in a compact 13x20 mm surface-mount package with a 31-pin SMD land pattern, supplied on tape and reel for high-volume SMT assembly. A Sigfox RC4 RF module is a pre-certified radio module that operates on the 920-923 MHz band with Sigfox-defined duty-cycle and ETSI/FCC-style emission profiles. The module abstracts the radio PHY and regional regulatory requirements, allowing embedded developers to focus on application logic rather than RF design, antenna matching, or protocol certification. Sigfox modules sit within the broader category of low-power wide-area network (LPWAN) wireless modules, alongside LoRaWAN and NB-IoT modules, but offer a managed operator-supplied network service. Key features of the WSSFM10R4AT include Sigfox RC4 zone certification, an integrated S2-LP sub-1 GHz transceiver with ETSI EN 300 220 compliance, UART and SPI host interfaces, low-power standby modes suitable for battery-powered IoT deployments, and an onboard STM32 MCU for application-level firmware execution. The module supports the bidirectional Sigfox protocol and is pre-loaded with the Sigfox modem library. Typical applications include battery-powered IoT sensor nodes, asset tracking and fleet management devices, smart agriculture soil moisture and livestock monitors, smart city infrastructure (parking sensors, environmental monitors), industrial telemetry and remote meter reading, and wireless alarm systems. The 13x20 mm footprint is significantly smaller than the prior WSSFM10P module generation, enabling compact end-product designs. When designing with this module, ensure the host microcontroller issues AT commands (or runs the Sigfox modem library) over UART at the supported baud rates, and provide adequate clearance around the antenna area to preserve the Sigfox RC4 RF performance budget. Keep module supply voltage within the datasheet range and observe solder-profile recommendations for the 31-pin SMD land pattern during SMT assembly.
WSSFM11R2DAT - Sigfox RC2/RCZ4 Dual-Mode Sub-1GHz Module | WISOL
The WISOL WSSFM11R2DAT is a Sigfox-certified dual-mode RF transceiver module supporting RC2 and RCZ4 regional zones, housed in a 31-pad QFN-style surface-mount package measuring 13 mm x 20.2 mm x 1.1 mm. The module integrates a Sub-1GHz RF transceiver, embedded microcontroller, and matching network in a PBA (Printed Board Assembly) form factor that drops directly onto a host PCB. A Sigfox module is a pre-certified, ultra-narrowband (UNB) wireless connectivity module that allows IoT devices to transmit small messages (typically 12 bytes uplink, 8 bytes downlink) over the Sigfox global low-power wide-area network (LPWAN). Sigfox modules fit into the broader hierarchy of IoT connectivity modules: RF module > Sub-1GHz module > Sigfox module > LPWAN module > wireless module > IoT component. They are used when battery-powered devices must run for years on a single cell while sending periodic sensor data over licensed-and-free sub-GHz spectrum. Key features include dual-region RC2 (Americas/Asia) + RCZ4 (Japan/Korea compatible) coverage in a single hardware SKU, integrated antenna matching, low standby current for multi-year battery operation, and an SPI/UART host interface for microcontroller integration. The module requires only a 3.3 V supply, a few passives, and an antenna trace or chip antenna. Technically, the WSSFM11R2DAT is built around a dedicated Sigfox protocol stack firmware running on an embedded low-power MCU, paired with a Sub-1GHz RF front-end tuned for the 902–928 MHz (RC2) and 920–928 MHz (RCZ4) bands. This dual-mode approach lets one BOM serve devices shipped into multiple geographic markets, eliminating separate regional SKUs. Typical applications include battery-powered IoT asset trackers, smart-meter AMR (automatic meter reading) modules, environmental sensors, agricultural monitoring nodes, and industrial predictive-maintenance telemetry. When designing with this module, observe the Sigfox reference antenna layout from the datasheet and follow the host MCU's SPI timing for command sequencing; failure to honor timing margins causes join/provisioning failure on first power-up. This page synthesizes verified distributor pricing, drop-in Sigfox-module alternatives, and practical RF/antenna design notes beyond the manufacturer datasheet.
Wio-WM6108 - Wi-Fi HaLow 902-928MHz mini-PCIe Module | Seeed Studio
The Seeed Studio Wio-WM6108 is a Wi-Fi HaLow (IEEE 802.11ah) mini-PCIe module powered by the Quectel FGH100M-H, operating in the 902-928 MHz sub-1 GHz band with up to 1 km coverage in a standard Mini-PCIe (SPI interface) form factor measuring 30x50 mm. Wi-Fi HaLow is the IEEE 802.11ah wireless standard designed specifically for the Internet of Things. Unlike conventional 2.4 GHz or 5 GHz Wi-Fi, it uses sub-1 GHz spectrum to deliver dramatically longer range (up to approximately 1 km), superior wall and obstacle penetration, and ultra-low power consumption. Within the wireless connectivity hierarchy, Wi-Fi HaLow sits alongside LoRa and other sub-GHz technologies but offers native IP networking and higher throughput, making it a member of the broader family of low-power wide-area (LPWA) IoT radio solutions. Key features of the Wio-WM6108 include long-range sub-1 GHz connectivity at 902-928 MHz, support for the latest WPA3 security standard, FCC certification for US sales, and the industry-standard Mini-PCIe form factor that allows drop-in integration into gateways, single-board computers, and industrial embedded platforms. The module connects over SPI, simplifying driver integration with Linux-based hosts such as the Raspberry Pi, where OpenWrt and Morse Micro driver stacks are commonly used. At its core sits the Quectel FGH100M-H module, which is built on the Morse Micro MM6108 Wi-Fi HaLow SoC - one of the first platforms to earn Wi-Fi CERTIFIED HaLow status and a platform in volume production with mature software support. Typical applications include smart home hubs and sensors, industrial automation and monitoring, environmental monitoring networks, and long-range IoT backhaul such as OpenMANET mesh nodes for off-grid communications and search-and-rescue operations. For design-in, verify host SPI driver and firmware availability (Morse mm6108 driver and FGH100M-H firmware images) before layout, and place the module to allow an efficient antenna installation for maximum sub-GHz range. This page synthesizes distributor listings, manufacturer documentation, and practical integration notes not found in a single datasheet.
Wio-WM6180 - Wi-Fi HaLow 802.11ah 902-928MHz Module | Seeed
The Seeed Technology Co., Ltd Wio-WM6180 is a Wi-Fi HaLow (IEEE 802.11ah) mini-PCIe wireless module operating in the 902-928 MHz sub-1 GHz band, built around the Quectel FGH100M-H module with Morse Micro MM6108 silicon, and delivered as a compact add-on card priced around $14.90 (as of 2025-2026 distributor listings). Wi-Fi HaLow is the sub-1 GHz flavor of the Wi-Fi standard defined by IEEE 802.11ah. Unlike conventional 2.4 GHz/5 GHz Wi-Fi, HaLow trades raw bandwidth for long range (hundreds of meters to kilometers), superior wall and foliage penetration, and very low power draw, positioning it in the connectivity hierarchy above proprietary sub-GHz links like LoRa but below Wi-Fi 6 in throughput. It is designed for the IoT access layer of modern wireless network stacks. Key features of the Wio-WM6180 include operation in the 902-928 MHz North American/Australian ISM spectrum, compliance with IEEE 802.11ah, support for 1/2/4/8 MHz channel widths (per the underlying Quectel FGH100M family), WPA3 security, and the industry-standard mini-PCIe form factor with a U.FL (IPEX) antenna connector. The 27 dBm-class output power of the FGH100M-H contributes to its extended coverage. Architecturally, the module integrates the Morse Micro MM6108 Wi-Fi HaLow SoC with RF front-end and filtering, exposing the interface over mini-PCIe so a host such as a Raspberry Pi, x86 SBC, or Seeed XIAO carrier can enumerate and drive it. Because the radio is a true 802.11ah implementation, it interworks with standard HaLow access points and gateways rather than proprietary protocols. Typical applications include smart-home hubs and sensors, long-range IoT backhaul, surveillance camera links, and industrial telemetry where a single HaLow gateway aggregates many low-power nodes over sub-GHz links. Design consideration: the 902-928 MHz SKU does not cover the EU 863-868 MHz band; European deployments must use the alternate Quectel FGH100MAAMD SKU or another EU-certified module. An external ~900 MHz antenna is required. This page synthesizes distributor pricing, ecosystem compatibility notes, and regional-spectrum caveats not found in a single manufacturer listing.
XB3-24Z8PT-J - XBee 3 2.4GHz Zigbee 3.0 TH Module | Digi
The Digi XB3-24Z8PT-J is a Digi XBee 3 series 802.15.4 Zigbee 3.0 transceiver module operating at 2.4 GHz with an integrated PCB trace antenna in a through-hole mounting form factor. The module is built around the Silicon Labs EFR32MG SoC and supports a serial data rate up to 1 Mbps with a 250 kbps RF data rate, while operating from a single 2.1 V to 3.6 V supply. It uses the same TH (through-hole) footprint as legacy XBee S2C modules, providing a true drop-in upgrade path. A wireless transceiver module is a pre-certified, surface-mount or through-hole assembly that integrates an RF transceiver IC, matching network, antenna, and sometimes an onboard microcontroller. These modules live in the broader category of RF & Wireless components, sit below wireless modules, and above bare RF transceiver ICs. They simplify wireless product certification because the radio has already been tested against regional regulatory standards (FCC, IC, ETSI, etc.), allowing end products to inherit the modular certification. Key features include receiver sensitivity of -103 dBm, an integrated PCB antenna, UART/SPI/I2C host interfaces, ADC and PWM I/O, and Zigbee 3.0 mesh protocol support with Digi's MicroPython programmability. The module's transmit output power is approximately +8 dBm (regular XBee 3, not the PRO variant) and the RF data rate is 250 kbps. The through-hole pin layout allows simple socketed or soldered mounting on 2 mm-pitch through-hole pads. Technically, the module combines the EFR32MG ARM Cortex-M4 SoC with an integrated 2.4 GHz radio, an RF front-end with balun, a PCB trace antenna, and onboard LDO regulators supporting the 2.1 V to 3.6 V input range. Digi provides a unified XBee API mode and AT command set across the XBee 3 family, so firmware written for an XBee 3 SMT module will migrate directly to the TH version with no host-side changes. Typical applications include industrial IoT sensor mesh networks, building automation (HVAC, lighting, occupancy), smart energy metering, asset tracking, and wireless remote-control links where Zigbee mesh topology adds self-healing multi-node coverage. The form factor is favorable: the same TH footprint across XBee generations allows customers to upgrade from older XBee S2C modules without PCB rework. When designing with this module, pay attention to antenna keep-out: do not place copper, ground planes, or plastic with high dielectric loss within the PCB antenna's keep-out area, as it will detune and degrade the link budget. Also confirm that the host MCU supplies 3.3 V logic on UART lines, because the module's GPIO is not 5 V tolerant. This page synthesizes distributor pricing, drop-in XBee 3 alternatives, and practical design notes not found in the manufacturer datasheet alone.
XB3-24Z8UM - XBee 3 PRO Zigbee 3.0 Micro U.FL MMT Module | Digi
The Digi XB3-24Z8UM is a Digi XBee 3 PRO Zigbee 3.0 surface-mount RF transceiver module operating in the 2.4 GHz ISM band with a U.FL antenna connector (antenna not included) and MMT (Micro Mount) form factor. Built on the Silicon Labs EFR32MG SoC, it delivers up to 8 dBm (PRO) transmit power and supports the IEEE 802.15.4 / Zigbee 3.0 protocol stack at over-the-air RF data rates up to 250 kbps with serial interface rates up to 1 Mbps. An RF module (radio-frequency module) is a small PCB sub-assembly that integrates a wireless transceiver IC, matching network, crystal, and antenna interface into a single, EMC-compliant package. RF modules sit in the wireless connectivity hierarchy below discrete transceivers and above raw silicon ICs, abstracting RF design complexity so that MCU-based host boards can add wireless capability with a simple UART/SPI/I2C interface. The XB3-24Z8UM belongs to the XBee 3 PRO family, which adds extended RF link budget (PRO = higher TX power, lower RX sensitivity threshold) for longer-range mesh deployments. Key features of the XB3-24Z8UM include 8 dBm (PRO) TX power, 2.4 GHz worldwide ISM band operation, Zigbee 3.0 mesh networking support, and a wide -40C to +85C industrial operating temperature range. The module integrates a Silicon Labs EFR32MG SoC with on-board microcontroller, eliminating the need for an external host MCU in many edge-IoT designs. UART, SPI, and I2C host interfaces are exposed through the 34-pin MMT land pattern. The U.FL RF connector enables use of an external antenna selected for the deployment enclosure. Typical applications include building automation nodes, smart lighting controllers, smart energy metering, digital health peripherals, industrial sensor mesh networks, and any IoT device requiring certified multi-vendor Zigbee 3.0 interoperability. The XBee 3 platform is supported by Digi's XCTU configuration tool and Digi Remote Manager cloud integration, simplifying provisioning and OTA firmware updates. When designing with this module, note that antenna selection is critical - although the U.FL connector is present, RF performance depends entirely on the chosen external antenna, its placement, and ground plane clearance. Allow at least 5 mm of keep-out under the antenna feed trace, follow the MMT footprint exactly, and avoid placing the module near large metal planes that detune the antenna.
XB3-24Z8UM-J - XBee 3 Zigbee 3.0 Module, 2.4 GHz, U.FL Antenna | Digi
The Digi International XB3-24Z8UM-J is a compact surface-mount XBee 3 Zigbee 3.0 transceiver module operating in the 2.4 GHz ISM band, housed in a 34-pin SMD Micro form factor with a U.FL antenna connector (antenna not included). It integrates the Silicon Labs EFR32MG SoC and supports 802.15.4 with a native RF data rate of 250 Kbps and a serial interface rate up to 1 Mbps. The module accepts a 2.1 V to 3.6 V supply, draws sub-microamp sleep currents, and provides UART, SPI, and I2C host interfaces for flexible integration into micro-controlled or hostless designs. A Zigbee module is a pre-certified, drop-in radio subsystem that bundles an RF transceiver IC, crystal, matching network, and PCB antenna or U.FL connector onto a single castellated PCB. XBee modules sit in the broader category of embedded wireless modules, above discrete RF transceivers and below complete IoT gateways. They are widely used to add Zigbee, Thread, or Bluetooth connectivity to a host MCU without requiring the designer to handle RF layout, FCC certification, or mesh protocol stacks. The XBee 3 family specifically combines Zigbee 3.0 with Bluetooth Low Energy (BLE) for provisioning and supports MicroPython for on-module scripting. Key features of the XB3-24Z8UM-J include an integrated Silicon Labs EFR32MG SoC, DSSS spread-spectrum modulation for robust 2.4 GHz operation, an operating temperature range that supports industrial deployment, and an ultra-low sleep current that suits battery-powered wireless sensor nodes. The U.FL antenna variant allows designers to attach an external antenna for enclosures where an on-module chip antenna would suffer detuning. The Micro form factor keeps the module footprint roughly 13 mm × 19 mm, enabling dense IoT endpoint designs. From an architectural standpoint, the XB3-24Z8UM-J separates the radio domain (EFR32MG SoC + RF frontend + shield can) from the host domain (UART/SPI/I2C). The on-board ARM Cortex-M4F core runs the Zigbee 3.0 stack and optional MicroPython, while the host MCU exchanges AT commands or API frames. This split keeps the host firmware simple and shields the application processor from real-time RF stack management. Typical applications include Zigbee wireless sensor networks for smart buildings, industrial telemetry, smart lighting and home automation, asset tracking, and battery-powered remote controls. The combination of low sleep current, mesh networking, and MicroPython programmability suits edge-deployed sensor nodes with infrequent wake cycles. For projects requiring an external antenna placement (for example, inside a metal enclosure), the U.FL variant is the correct choice; for exposed-product designs, the chip-antenna variant (XB3-24Z8CM-J) may be preferred. When designing with the XB3-24Z8UM-J, ensure the host board provides a stable 3.3 V rail capable of peak transmit current bursts (about 130 mA typical) and that the U.FL antenna cable is kept short and away from noise sources. The castellated edge pads require clean solder paste printing and a reflow profile compatible with the integrated shield can; hand-soldering the module is not recommended. Always confirm regional Zigbee channel selection against local regulations (Wi-Fi coexistence considerations in the 2.4 GHz band). This page synthesizes distributor pricing, drop-in XBee 3 family alternatives, and practical design notes not found in the manufacturer datasheet alone. Use the comparison table and selection guide below to choose between the U.FL, chip antenna, PRO, and non-PRO variants.
ZK-WLE7000E5 - 8.647Gbps 5GHz WiFi 7 Module
The Zukaka ZK-WLE7000E5 is a single-band 5GHz WiFi 7 wireless module based on the Qualcomm QCN6224, QCN6274, or QCN9274 Waikiki radio solution. It supports 4T4R 4×4 MU-MIMO, four spatial streams, and a maximum data rate of 8.647Gbps in a miniPCIe module using PCIe 3.0. The module is designed for systems requiring high throughput, broad 5GHz coverage, and modern WiFi 7 features including 4096-QAM and OFDMA. A WiFi 7 module is a wireless-network interface that connects an embedded computer or industrial controller to a 5GHz WiFi network. In the product hierarchy, it is a wireless module, a network interface, and an embedded communications component rather than a standalone consumer router. ZK-WLE7000E5 integrates the radio, RF front end, host interface, antenna connections, and supporting firmware into one miniPCIe assembly. The module provides up to 18dBm output per chain and supports four RF antenna connections. Its operating voltage is 3.3V, while maximum power consumption is stated as 8.5W. Commercial configurations use QCN6224 or QCN6274, and the industrial configuration uses QCN9274. The available system memory is 2Mbit serial-bus EEPROM. Operating-mode support includes access-point and station roles, allowing backhaul and client connectivity functions in suitable equipment. The verified design data identifies support for WiFi 7, 802.11a/ax/be, PCIe 3.0, and Linux or Android driver support from mainline kernel version 5.4.213 upward. Bluetooth and Windows support are listed as unavailable. These details make the module suitable for embedded Linux systems that need a high-bandwidth 5GHz link, while also requiring careful host, antenna, power, and thermal integration. Typical applications include enterprise wireless access points, industrial routers, cybersecurity appliances, transportation equipment, small-business networking products, and embedded backhaul systems. OFDMA and 4096-QAM can improve efficiency in dense or multi-client environments, but actual throughput depends on radio conditions, antenna implementation, host driver, channel bandwidth, and the connected WiFi 7 infrastructure. Designers should provide the specified 3.3V supply, preserve the PCIe 3.0 interface requirements, connect all four antenna paths correctly, and plan thermal dissipation for the maximum stated 8.5W power consumption. The verified material does not provide a complete public pinout, regulatory approvals, or detailed environmental limits, so those values require confirmation from the current manufacturer documentation before production release. This page consolidates the verified WLE7000E5 family specifications, cross-reference information, application guidance, and practical integration notes. It distinguishes the ZK-WLE7000E5 ordering code from the Compex family references while presenting the module as a pin-compatible alternative identified by the supplied cross-reference data.
ZM5101A-CME3R - Z-Wave 500 SiP Module, Sub-GHz, 8051 MCU | Silicon Labs
The Silicon Labs ZM5101A-CME3R is a fully integrated Z-Wave 500 Series Wireless System-in-Package (SiP) module that combines a sub-GHz RF transceiver and an 8051 microcontroller core into a compact 8 mm x 8 mm x 1.2 mm surface-mount module. Operating in the 865.2 MHz to 926.3 MHz sub-GHz band with regional support for 868 MHz (Europe), 908 MHz (United States), and 921 MHz (Japan / Asia) Z-Wave channels, the ZM5101A-CME3R delivers a maximum output power of 6 dBm and receive sensitivity of -94.3 dBm at 100 kbps, enabling reliable mesh networking across typical home-control distances. A Z-Wave module is a self-contained wireless transceiver-plus-MCU module certified for the Z-Wave mesh protocol, used for low-power sub-GHz communication in smart-home and IoT devices. Z-Wave modules belong to the broader family of sub-GHz transceiver modules (ISM < 1 GHz), which sit within RF & wireless connectivity ICs in the broader semiconductor hierarchy. The ZM5101A-CME3R is a SiP (System-in-Package) - i.e. several silicon dies integrated into a single sealed surface-mount package, reducing PCB footprint and EMC compliance burden for the OEM. It belongs to the Silicon Labs ZM5101 family of Z-Wave 500 modules, paired with the ZM5202 PCB-module variant. Key features include 128 kB of embedded Flash, 16 kB SRAM, two UARTs up to 230.4 kbps, two SPI interfaces up to 8 MHz, a 4-channel 12/8-bit rail-to-rail ADC with selectable VDD/internal/external reference, a hardware AES-128 security engine, a 1000-step dimmer control block, automatic response/retransmission, CRC check, and power-on/power-off reset plus software reset. The SiP integrates matching network, crystal, and decoupling, so the host board only needs supply bypass and antenna. Operating supply voltage is 2.3 V to 3.6 V (typical 3.3 V), and the receive current is approximately 32 mA. The ZM5101A-CME3R uses an optimized 8051 core paired with the Sigma Designs (now Silicon Labs) Z-Wave 500 series MAC/PHY. This enables deterministic mesh routing, low-latency acknowledgements, and Z-Wave Plus certification compatibility for gateways, sensors, locks, lighting and HVAC nodes. The integrated hardware AES-128 engine accelerates encrypted Z-Wave frames, freeing the 8051 core for application logic. Typical applications include Z-Wave smart-home gateways, door locks, lighting dimmers, energy meters, HVAC controls, PIR/motion sensors, water-leak sensors, smoke detectors, and AV control remotes. The compact SiP and pre-certified RF section dramatically shorten time-to-Z-Wave-Plus-certification versus discrete transceivers. When designing with this SiP, observe the supply decoupling guidance in the manufacturer datasheet (input and output caps as close as possible to the supply pads), respect the antenna keep-out zone, and ensure the host MCU handles Z-Wave Plus provisioning. The device requires Z-Wave Plus certification for retail products - it is not pin-compatible with non-Z-Wave sub-GHz parts. This page synthesizes distributor pricing, drop-in alternatives and Z-Wave ecosystem notes not found in the manufacturer datasheet alone.
ZM5202 - Z-Wave 500 Wireless Module | Silicon Labs
The Silicon Labs ZM5202 is a fully integrated Z-Wave wireless module combining the SD3502 SoC - which integrates an 8-bit 8051 microcontroller core and a Z-Wave RF transceiver - with a crystal oscillator, SAW filter, and passive RF components in a single compact surface-mount module. It supports Z-Wave sub-1 GHz operation at 908/908.42/916 MHz regional bands with output power up to approximately 4 dBm and receiver sensitivity around -93 dBm. A Z-Wave module is a fully certified, ready-to-integrate wireless subsystem that encapsulates the radio, modulation/demodulation hardware, and the Z-Wave network protocol stack into a single hardware block, dramatically reducing the engineering effort required to add Z-Wave mesh connectivity to products such as thermostats, lighting controls, door locks, and USB sticks. Key features of the ZM5202 include up to 32 GPIO pins, flash and RAM resources sufficient for host-side or single-MCU Z-Wave node firmware, an integrated crystal providing the precise frequency reference required by Z-Wave channelization, and full backwards compatibility with the ZM3102 and ZM4102 modules in terms of GPIO pinout and PCB land pattern. Its module-level regulatory qualification lets customers skip FCC/ETSI RF certification work for the radio portion of their end product. Architecturally, the SD3502 SoC at the heart of the ZM5202 pairs an 8-bit 8051-class CPU with the Z-Wave PHY/MAC radio, so applications can either run the Z-Wave stack natively on the module or offload host connectivity through a UART-style interface. The integrated SAW filter provides strong out-of-band rejection, complementing the Z-Wave protocol's frequency-shift-keyed robustness against in-band interferers. Typical applications include smart-home thermostats, lighting dimmers and switches, door locks, USB stick Z-Wave gateways, and battery-powered wireless sensor nodes. The integrated crystal and SAW filter, combined with regulatory pre-certification, allow designers to focus on application firmware rather than RF matching. When designing with the ZM5202, observe that legacy status: Silicon Labs recommends ZGM130S for new designs. Engineers still specifying the ZM5202 should follow the reference antenna layout and decoupling guidance in the datasheet to preserve the pre-certified RF performance. This page consolidates distributor pricing, drop-in compatible alternatives within the Z-Wave 500-series lineup, and practical design notes that go beyond the manufacturer datasheet to help engineers evaluate end-of-life risk and pin-compatible replacements.
ZM5304Ax-CME3 - Z-Wave 908MHz Transceiver Module | Silicon Labs
The Silicon Labs ZM5304Ax-CME3 is a fully self-contained Z-Wave transceiver module operating in the 908 MHz ISM band, built around the Sigma Designs SD3503 Z-Wave 500-series modem IC and integrating a built-in antenna for surface-mount PCB integration. The module delivers up to +4 dBm transmit output power and -103 dBm receiver sensitivity, enabling robust wireless mesh links in Z-Wave home-control and monitoring networks. The device operates from a single 2.3 V to 3.6 V supply rail and exposes a serial interface to the host through a 12-pin surface-mount land pattern. The "Ax" suffix identifies the 908 MHz US/Canada/ANZ regional variant. A Z-Wave transceiver module is a pre-certified wireless subsystem that bundles an RF transceiver, a network protocol stack, and a built-in antenna into a single reflow-compatible component. Within the broader taxonomy, the ZM5304 sits as a sub-module category in the RF module family, itself a branch of RF & wireless components for short-range personal-area networking and home-area sub-GHz mesh networking. Modules of this class remove the burden of RF matching, antenna tuning, and regulatory pre-compliance testing from the OEM designer. Key features include on-board Z-Wave 500-series protocol stack handling MAC/PHY and mesh routing, FCC modular approval under part 15 limits plus pre-scanned CE conformance, deep-sleep current below 50 uA for battery-powered nodes, and a built-in chip antenna that supports a 30-50 m typical in-home range. The exposed pads align with the industry-standard ZM5304 footprint, enabling drop-in upgrade paths from prior Z-Wave 300/400-series modules without board rework. The ZM5304Ax-CME3 architecture pairs the SD3503 modem SoC with an internal PA, LNA, TCXO and PCB antenna; the modem runs the Z-Wave protocol library via firmware loaded from an external host or optional on-module flash. Internal mesh routing handles up to 232 hops, supporting large multi-story smart-home installations. Typical applications include Z-Wave smart-home gateways, door/window sensors, smart lighting dimmers, smart locks, and water-leak detectors. The compact surface-mount form factor also serves battery-powered HVAC thermostats and energy-harvesting switch nodes. When designing with the ZM5304Ax-CME3, observe the keep-out zone underneath and around the chip antenna; place no copper, traces, or ground plane within 5 mm of the antenna pad to avoid detuning. Use a 4-layer or 2-layer board with a continuous ground reference and follow Sigma Designs reference layout AN-2014-007 for best RF yield. This page synthesizes distributor pricing, drop-in alternative sourcing, and practical RF layout guidance not found on the manufacturer product page, helping engineers accelerate Z-Wave node design and second-source qualification.