10AX090R2F40E2SG vs 10AX115R3F40E2SG 对比
详细并排对比 10AX090R2F40E2SG 出自 Intel 和 10AX115R3F40E2SG 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | 10AX090R2F40E2SG | 10AX115R3F40E2SG |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $4,750.00 | $4,925.00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 900000 | — |
| LABs/CLBs | 339620 | — |
| Total RAM Bits | 59234304 | — |
| User I/O Count | 342 | — |
| Package Type | 1517-BBGA, FCBGA | — |
| Package Code | F40 (approx. 40mm FCBGA) | — |
| Speed Grade | 2 (R2 -2 transceiver rating) | -2 |
| Temperature Grade | E2 (Extended: -40C to +100C junction) | E2 (0C to +100C) |
| Lead-Free / RoHS | Yes (SG suffix) | — |
| Transceivers | Up to 14.1 Gbps (Arria 10 GX feature) | — |
| DSP Blocks | Variable-precision, hardened floating-point capable | 1,518 (variable-precision, hard FP) |
| Process Node | TSMC 20nm | — |
| 安装类型 | Surface Mount (FCBGA ball grid) | Surface Mount (Flip-Chip BGA) |
| MSL 等级 | 3 (168 Hours) | — |
| Packaging | Tray | — |
| Logic Elements (LE) | — | 1,150,000 |
| Adaptive Logic Modules (ALM) | — | 427,200 |
| Embedded Memory | — | 68,857,856 bits (8,557 Kbit) |
| M20K Memory Blocks | — | 2,738 |
| Maximum User I/O | — | 342 |
| Transceiver Channels | — | 24 (up to 14.1 Gbps) |
| Hard Memory Controllers | — | DDR4/DDR3/QDR IV |
| Hard PCIe Gen3 IP Cores | — | 2 |
| Process Technology | — | TSMC 20 nm |
| 封装 | — | 1517-ball FCBGA (F40), 1.0 mm pitch |
| Configuration Memory | — | Embedded (no external flash required for typical use) |
| RoHS 状态 | — | Compliant |