10AX090R2F40E2SG vs 10AX115R3F40E2SG 비교
다음의 상세 나란히 비교: 10AX090R2F40E2SG 제조: Intel 및 10AX115R3F40E2SG 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | 10AX090R2F40E2SG | 10AX115R3F40E2SG |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $4,750.00 | $4,925.00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 900000 | — |
| LABs/CLBs | 339620 | — |
| Total RAM Bits | 59234304 | — |
| User I/O Count | 342 | — |
| Package Type | 1517-BBGA, FCBGA | — |
| Package Code | F40 (approx. 40mm FCBGA) | — |
| Speed Grade | 2 (R2 -2 transceiver rating) | -2 |
| Temperature Grade | E2 (Extended: -40C to +100C junction) | E2 (0C to +100C) |
| Lead-Free / RoHS | Yes (SG suffix) | — |
| Transceivers | Up to 14.1 Gbps (Arria 10 GX feature) | — |
| DSP Blocks | Variable-precision, hardened floating-point capable | 1,518 (variable-precision, hard FP) |
| Process Node | TSMC 20nm | — |
| 실장 유형 | Surface Mount (FCBGA ball grid) | Surface Mount (Flip-Chip BGA) |
| MSL 레벨 | 3 (168 Hours) | — |
| Packaging | Tray | — |
| Logic Elements (LE) | — | 1,150,000 |
| Adaptive Logic Modules (ALM) | — | 427,200 |
| Embedded Memory | — | 68,857,856 bits (8,557 Kbit) |
| M20K Memory Blocks | — | 2,738 |
| Maximum User I/O | — | 342 |
| Transceiver Channels | — | 24 (up to 14.1 Gbps) |
| Hard Memory Controllers | — | DDR4/DDR3/QDR IV |
| Hard PCIe Gen3 IP Cores | — | 2 |
| Process Technology | — | TSMC 20 nm |
| 패키지 | — | 1517-ball FCBGA (F40), 1.0 mm pitch |
| Configuration Memory | — | Embedded (no external flash required for typical use) |
| RoHS 상태 | — | Compliant |