10M08DAF484I7P vs 10M08DAF484C8G 对比

详细并排对比 10M08DAF484I7P 出自 Intel 和 10M08DAF484C8G 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
10M08DAF484C8G 10M08DAF484C8G - MAX 10 FPGA, 8K LEs, 484-FBGA | Intel

10M08DAF484C8G - MAX 10 FPGA, 8K LEs, 484-FBGA | Intel

10M08DAF484C8G ✓ 量产中

规格对比

参数 10M08DAF484I7P 10M08DAF484C8G
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $22.10 $27.65
Family MAX 10 MAX 10
Logic Elements (LE) 8,000 8000
Embedded Memory 378 Kbits (46,080 M9K bits) 387,072 bits (378 Kbits)
User I/O Count 250 —
封装 484-ball FBGA (F484) 484-ball FBGA (FineLine BGA)
Pitch 1.0 mm —
Core Voltage 1.0 V 1.2 V
Speed Grade -7 -C8
工作温度 -40 C to +100 C (Industrial) —
On-chip Configuration Flash Yes, dual-boot —
Embedded ADC 12-bit, 1 Msps, 16 channels —
DSP Blocks Yes (24 x 18-bit multipliers) Yes
PLLs 4 2
Maximum LVDS Channels [DATA_NEEDED: per-bank LVDS channel count] —
User Flash 8 Kbits (non-volatile) 1,540 Kbits
RoHS 状态 Compliant Compliant
安装类型 Surface Mount (BGA) —
MSL 等级 [DATA_NEEDED: moisture sensitivity level] —
Maximum User I/O — 250
ADC — 8-channel, 12-bit
Process Technology — 55 nm
I/O Bank Voltage — 1.2 V to 3.3 V
工作结温 — -40 C to +100 C (industrial)
Configuration — Internal flash, dual-configuration, RSU support

数据手册与资源

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