6EDL04N03PRXUMA1 vs 6EDL04N02PRXUMA1 对比

详细并排对比 6EDL04N03PRXUMA1 出自 Infineon 和 6EDL04N02PRXUMA1 出自 Infineon。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Infineon
6EDL04N03PRXUMA1 6EDL04N03PRXUMA1 - 3-Phase Gate Driver, 25V/0.24A | Infineon

6EDL04N03PRXUMA1 - 3-Phase Gate Driver, 25V/0.24A | Infineon

6EDL04N03PRXUMA1 ✓ 量产中
Infineon
6EDL04N02PRXUMA1 6EDL04N02PRXUMA1 - 200V 3-Phase Gate Driver IC | Infineon

6EDL04N02PRXUMA1 - 200V 3-Phase Gate Driver IC | Infineon

6EDL04N02PRXUMA1 ✓ 量产中

规格对比

参数 6EDL04N03PRXUMA1 6EDL04N02PRXUMA1
品牌 Infineon Infineon
分类 Power MOSFET Drivers Power MOSFET Drivers
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $1.85 $2.32
Driver Type Three-phase gate driver (6-channel half-bridge) —
Number of Drivers 6 —
输出配置 Non-inverting half-bridge —
Supply Voltage (VDD) 10 V to 25 V —
Logic Supply Voltage (VSS) 3.3 V / 5 V —
Output Current (Source) 0.24 A —
Output Current (Sink) 0.375 A —
上升时间 60 ns (typical at 1 nF load) —
下降时间 26 ns (typical at 1 nF load) —
Bootstrap Diode Integrated (3 channels) Integrated (BSD) on all 3 high-side drivers
Over-Current Protection Yes (adjustable threshold via ITRIP) Yes (single-shunt, ITRIP/CIN pin)
Fault Output Yes (open-drain) —
使能引脚 Yes (EN, active-high) —
Propagation Delay [DATA_NEEDED: propagation delay] —
工作温度 -40 C to +125 C —
封装 PG-TSSOP-25 PG-TSSOP-28 (28-pin, 4.40 mm width, exposed pad)
安装类型 Surface Mount Surface Mount
MSL 等级 3 MSL3 (per JEDEC J-STD-020, [DATA_NEEDED: confirm level])
RoHS 状态 Compliant Compliant
Blocking Voltage 200 V / 600 V family —
Product Type — 3-Phase Gate Driver IC
Driver Configuration — Half-bridge (3 high-side + 3 low-side)
Maximum Blocking Voltage — +180 V (VS referenced to GND for high side)
Rated Supply Voltage (VCC) — 200 V class (operating range 10 V to 20 V on VCC)
Source Current (typ.) — 0.375 A
Sink Current (typ.) — 0.75 A
Enable Pin (EN) — Yes (active-high)
Fault Output (nFAULT) — Yes (active-low, open-drain)
Input Logic Compatibility — CMOS / LSTTL, 3.3 V and 5 V
Interlocking / Anti-shoot-through — Yes (built-in per phase pair)
Process Technology — Thin-film SOI (Silicon-On-Insulator)
工作温度范围 — -40 °C to +125 °C
Maximum Junction Temperature — +150 °C
Target Switches — MOSFETs up to 180 V, IGBTs up to 180 V

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