ATSAMA5D26B-CN vs ATSAMA5D26B-CNR 对比
详细并排对比 ATSAMA5D26B-CN 出自 Microchip Technology 和 ATSAMA5D26B-CNR 出自 Microchip Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Microchip Technology
ATSAMA5D26B-CN - ARM Cortex-A5 MPU 500MHz | Microchip | 289-LFBGA
ATSAMA5D26B-CN ✓ 量产中Microchip Technology
ATSAMA5D26B-CNR - 500MHz Cortex-A5 MPU, 289-LFBGA | Microchip
ATSAMA5D26B-CNR ✓ 量产中规格对比
| 参数 | ATSAMA5D26B-CN | ATSAMA5D26B-CNR |
|---|---|---|
| 品牌 | Microchip Technology | Microchip Technology |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $13.05 | $9.10 |
| Core Architecture | ARM Cortex-A5 (Armv7-A) | Arm Cortex-A5 (Armv7-A) with NEON and FPU |
| Number of Cores | 1 | — |
| 最大时钟频率 | 500 MHz | — |
| L1 Instruction Cache | 32 kbyte | — |
| L1 Data Cache | 32 kbyte | — |
| L2 Cache | 128 kbyte (configurable as SRAM) | — |
| Memory Management Unit | Yes (MMU) | — |
| NEON Media Processing Engine | Yes | — |
| Arm TrustZone | Yes | — |
| ETM/ETB Support | Yes | — |
| DDR Memory Interface | DDR2, DDR3L, LPDDR2, LPDDR3 | — |
| Flash Memory Interface | QSPI, e.MMC | — |
| Backup Mode Current | 5 uA | — |
| Security Features | Secure boot, AES, SHA, TRNG, tamper pins | — |
| Peripheral Interfaces | I2C, SPI, USART, UART, QSPI, CAN, HSIC, SMC | — |
| Embedded Audio Subsystem | Yes | — |
| 封装 | 289-LFBGA (14x14 mm) | 289-LFBGA (14x14x1.4 mm) |
| Ball Pitch | 0.8 mm | 0.8 mm |
| 工作温度范围 | -40C to +85C (industrial, -CN grade) | — |
| 安装类型 | Surface Mount | Surface Mount (BGA) |
| MSL 等级 | [DATA_NEEDED: MSL level] | 3 |
| RoHS 状态 | Compliant | Compliant |
| Maximum Core Frequency | — | 500 MHz |
| Core Count | — | 1 |
| Internal SRAM | — | 128 KB |
| External Memory Support | — | DDR2/DDR3L/LPDDR2/LPDDR3, QSPI, e.MMC, NAND |
| Graphics Controller | — | 2D LCD controller, up to 2048x2048 |
| Ethernet | — | 2x EMAC with IEEE 1588 (10/100 Mbps) |
| USB | — | USB 2.0 High-Speed Host and Device |
| Serial Interfaces | — | 6x FLEXCOM (USART/SPI/TWI), 2x CAN-FD |
| Audio | — | Embedded audio subsystem (SSC, I2S) |
| Security | — | Crypto accelerator, secure boot, tamper detection, TRNG |
| 工作温度 | — | -40C to +85C (Industrial) |