ATSAMA5D26B-CN vs ATSAMA5D26B-CNR 비교
다음의 상세 나란히 비교: ATSAMA5D26B-CN 제조: Microchip Technology 및 ATSAMA5D26B-CNR 제조: Microchip Technology. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
Microchip Technology
ATSAMA5D26B-CN - ARM Cortex-A5 MPU 500MHz | Microchip | 289-LFBGA
ATSAMA5D26B-CN ✓ 활성Microchip Technology
ATSAMA5D26B-CNR - 500MHz Cortex-A5 MPU, 289-LFBGA | Microchip
ATSAMA5D26B-CNR ✓ 활성사양 비교
| 파라미터 | ATSAMA5D26B-CN | ATSAMA5D26B-CNR |
|---|---|---|
| 브랜드 | Microchip Technology | Microchip Technology |
| 카테고리 | Microcontrollers | Microcontrollers |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $13.05 | $9.10 |
| Core Architecture | ARM Cortex-A5 (Armv7-A) | Arm Cortex-A5 (Armv7-A) with NEON and FPU |
| Number of Cores | 1 | — |
| 최대 클록 주파수 | 500 MHz | — |
| L1 Instruction Cache | 32 kbyte | — |
| L1 Data Cache | 32 kbyte | — |
| L2 Cache | 128 kbyte (configurable as SRAM) | — |
| Memory Management Unit | Yes (MMU) | — |
| NEON Media Processing Engine | Yes | — |
| Arm TrustZone | Yes | — |
| ETM/ETB Support | Yes | — |
| DDR Memory Interface | DDR2, DDR3L, LPDDR2, LPDDR3 | — |
| Flash Memory Interface | QSPI, e.MMC | — |
| Backup Mode Current | 5 uA | — |
| Security Features | Secure boot, AES, SHA, TRNG, tamper pins | — |
| Peripheral Interfaces | I2C, SPI, USART, UART, QSPI, CAN, HSIC, SMC | — |
| Embedded Audio Subsystem | Yes | — |
| 패키지 | 289-LFBGA (14x14 mm) | 289-LFBGA (14x14x1.4 mm) |
| Ball Pitch | 0.8 mm | 0.8 mm |
| 동작 온도 범위 | -40C to +85C (industrial, -CN grade) | — |
| 실장 유형 | Surface Mount | Surface Mount (BGA) |
| MSL 레벨 | [DATA_NEEDED: MSL level] | 3 |
| RoHS 상태 | Compliant | Compliant |
| Maximum Core Frequency | — | 500 MHz |
| Core Count | — | 1 |
| Internal SRAM | — | 128 KB |
| External Memory Support | — | DDR2/DDR3L/LPDDR2/LPDDR3, QSPI, e.MMC, NAND |
| Graphics Controller | — | 2D LCD controller, up to 2048x2048 |
| Ethernet | — | 2x EMAC with IEEE 1588 (10/100 Mbps) |
| USB | — | USB 2.0 High-Speed Host and Device |
| Serial Interfaces | — | 6x FLEXCOM (USART/SPI/TWI), 2x CAN-FD |
| Audio | — | Embedded audio subsystem (SSC, I2S) |
| Security | — | Crypto accelerator, secure boot, tamper detection, TRNG |
| 동작 온도 | — | -40C to +85C (Industrial) |