EP1K30FC256-3N vs EP1K30FI256-2N 对比
详细并排对比 EP1K30FC256-3N 出自 Intel 和 EP1K30FI256-2N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP1K30FC256-3N | EP1K30FI256-2N |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 不推荐新设计 | Obsolete |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $17.50 | $18.40 |
| Family | ACEX 1K | ACEX-1K |
| Logic Elements / Cells | 17,288 logic elements (1,728 cells) | — |
| Typical Gates | 30,000 | 30,000 |
| Total RAM Bits | 24,576 | — |
| Number of LABs | 216 | 216 |
| User I/Os | 171 | — |
| Core Supply Voltage | 2.375 V to 2.625 V (nominal 2.5 V) | 2.5 V |
| Technology | 0.22 µm CMOS, SRAM configuration | — |
| Speed Grade | -3 | -2 |
| Propagation Delay (typ.) | 0.6 ns | — |
| Maximum Frequency | 200 MHz | — |
| 封装 | 256-ball FineLine BGA (FBGA-256) | 256-ball FineLine BGA (FBGA) |
| 安装类型 | Surface Mount | Surface Mount |
| 工作温度 | 0 °C to +70 °C (commercial) | — |
| Configuration | SRAM, serial/parallel, JTAG ISP (IEEE 1149.1) | — |
| Logic Elements (LEs) | — | 1,728 |
| Embedded RAM Bits | — | 24,576 |
| Maximum User I/O | — | 171 |
| Process Technology | — | 0.22 µm CMOS |
| Maximum Internal Frequency | — | 200 MHz |
| Operating Temperature Grade | — | Industrial |
| Programmable via | — | JTAG (IEEE 1149.1) |
| 存储器类型 | — | Dual-port Embedded Array Block (EAB) |