EP1K30FC256-3N vs EP1K30FI256-2N Comparison
Detailed side-by-side comparison of EP1K30FC256-3N by Intel and EP1K30FI256-2N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP1K30FC256-3N | EP1K30FI256-2N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | NRND | Obsolete |
| Family | ACEX 1K | ACEX-1K |
| Logic Elements / Cells | 17,288 logic elements (1,728 cells) | — |
| Typical Gates | 30,000 | 30,000 |
| Total RAM Bits | 24,576 | — |
| Number of LABs | 216 | 216 |
| User I/Os | 171 | — |
| Core Supply Voltage | 2.375 V to 2.625 V (nominal 2.5 V) | 2.5 V |
| Technology | 0.22 µm CMOS, SRAM configuration | — |
| Speed Grade | -3 | -2 |
| Propagation Delay (typ.) | 0.6 ns | — |
| Maximum Frequency | 200 MHz | — |
| Package | 256-ball FineLine BGA (FBGA-256) | 256-ball FineLine BGA (FBGA) |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0 °C to +70 °C (commercial) | — |
| Configuration | SRAM, serial/parallel, JTAG ISP (IEEE 1149.1) | — |
| Logic Elements (LEs) | — | 1,728 |
| Embedded RAM Bits | — | 24,576 |
| Maximum User I/O | — | 171 |
| Process Technology | — | 0.22 µm CMOS |
| Maximum Internal Frequency | — | 200 MHz |
| Operating Temperature Grade | — | Industrial |
| Programmable via | — | JTAG (IEEE 1149.1) |
| Memory Type | — | Dual-port Embedded Array Block (EAB) |