EP1S30F780C7AA vs EP1S30F780C8 对比

详细并排对比 EP1S30F780C7AA 出自 Intel 和 EP1S30F780C8 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP1S30F780C7AA EP1S30F780C7AA - Stratix 32K LE FPGA, 597 I/O, 780-FBGA | Intel

EP1S30F780C7AA - Stratix 32K LE FPGA, 597 I/O, 780-FBGA | Intel

EP1S30F780C7AA ⚠ 最后一次采购
Intel
EP1S30F780C8 EP1S30F780C8 - 32,470 LEs Stratix FPGA, 597 I/O, 780-FBGA | Intel

EP1S30F780C8 - 32,470 LEs Stratix FPGA, 597 I/O, 780-FBGA | Intel

EP1S30F780C8 ⚠ 最后一次采购

规格对比

参数 EP1S30F780C7AA EP1S30F780C8
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 最后采购期 最后采购期
库存状态 有库存 有库存
单价(USD) $142.00 $175.00
Family Stratix Stratix (EP1S)
Logic Elements 32,470 32,470
Total Memory Bits 3,317,184 —
Maximum User I/O 597 597
封装 780-ball FCBGA (FineLine BGA) 780-ball FC-FBGA (F780)
Speed Grade -7 C8 (Commercial, grade 8)
工作温度 0C to +85C (commercial) 0 °C to 85 °C (Commercial)
Core Voltage 1.5 V (VCCINT) —
I/O Standards Supported LVTTL, LVCMOS, LVDS, LVPECL, PCI, PCI-X —
DSP Blocks Embedded multiplier blocks (9x9, 18x18, 36x36) —
DSP Performance Up to 2.1 GMACS at -7 speed grade —
PLLs Multi-PLL architecture —
Configuration Modes Passive Serial, Fast Passive Parallel, JTAG PS, PPS, PPA, FPP, JTAG
Process Node 0.13 µm SRAM —
MSL 等级 3 (168 Hours) —
Packaging Tray —
Logic Family — CMOS
Process Technology — 130 nm
Core Supply Voltage — 1.5 V
Maximum Operating Frequency — 357.14 MHz
Package Size — 29 mm × 29 mm
Ball Pitch — 1.0 mm
安装方式 — Surface Mount (SMD)
Memory Interface Support — DDR, DDR2, QDR, ZBT SRAM
I/O Standards — LVDS, LVPECL, PCI, PCI-X, HSTL, SSTL
RoHS 状态 — Non-compliant (legacy SnPb ball finish)

数据手册与资源

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