EP2AGX45DF25I3G vs EP2AGX125DF25I3G 对比
详细并排对比 EP2AGX45DF25I3G 出自 Intel 和 EP2AGX125DF25I3G 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Intel
EP2AGX125DF25I3G - 118K LE Arria II GX FPGA, 3.75Gbps, FC-FBGA | Intel
EP2AGX125DF25I3G ⚠ 最后一次采购规格对比
| 参数 | EP2AGX45DF25I3G | EP2AGX125DF25I3G |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 最后采购期 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $370.00 | $895.00 |
| Family | Arria II GX | — |
| Logic Elements (LE) | 42,959 | — |
| Adaptive Logic Modules (ALM) | 17,715 | — |
| Embedded Memory Bits | 3,517,440 bits | — |
| Embedded Memory M9K Blocks | [DATA_NEEDED: M9K block count] | — |
| DSP Blocks (18x18 multipliers) | [DATA_NEEDED: DSP block count] | — |
| Maximum User I/O Pins | 252 | — |
| Transceiver Channels | [DATA_NEEDED: MGT channel count] | — |
| Maximum Transceiver Data Rate | 6.375 Gbps | — |
| 封装 | 572-ball FCBGA (HBGA) | 572-BGA, FCBGA (Flip-Chip FineLine BGA) |
| Package Dimensions | 25 mm x 25 mm | — |
| 工作温度范围 | -40C to +100C (Industrial) | — |
| Speed Grade | I3 | — |
| Process Node | 40 nm | — |
| Supply Voltage (Core) | [DATA_NEEDED: VCCINT] | — |
| Hard IP for PCIe | PCIe Gen1/Gen2 endpoints and root ports | — |
| 安装类型 | Surface Mount (BGA) | Surface Mount |
| MSL 等级 | 3 | [DATA_NEEDED: MSL Level] |
| RoHS 状态 | Compliant | Compliant |
| Lead-Free | Yes | — |
| Series | — | Arria II GX |
| Logic Elements | — | 118,143 |
| Embedded Memory | — | 8,315,904 bits |
| Number of I/O | — | 260 |
| Core Voltage | — | 0.9 V |
| Process Technology | — | 40 nm |
| Maximum Operating Frequency | — | 500 MHz |
| Transceivers | — | Up to 12 (3.75 Gbps per channel) |
| 工作温度 | — | -40C to +100C (Industrial) |
| 电源电压 | — | 0.9 V core |
| DSP Blocks | — | 18x18 multipliers |