EP2AGZ300FH29I4G - 300K LE Arria II GZ FPGA, 281 I/O | Intel
料号： EP2AGZ300FH29I4G ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1750 | $17,500.00 |
| 50 | $1650 | $82,500.00 |
| 100 | $1550 | $155,000.00 |
| 250 | $1450 | $362,500.00 |
| 500 | $1350 | $675,000.00 |
EP2AGZ300FH29I4G 概述
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) belonging to the broader integrated circuit hierarchy: programmable logic -> logic IC -> semiconductor. Unlike an ASIC, the FPGA's interconnect and logic function map are defined after manufacture, enabling rapid prototyping, in-field reconfiguration, and lower NRE cost for low-to-medium volume production. Modern FPGAs integrate hard IP cores such as transceivers, PLLs, block RAM, and DSP multipliers alongside the configurable fabric, blurring the line between programmable logic and system-on-chip.
Key features of the EP2AGZ300FH29I4G include 281 user I/Os, embedded transceivers capable of multi-gigabit serial connectivity, on-chip block RAM for buffering, dedicated DSP blocks for high-throughput arithmetic, and configuration via standard JTAG or serial flash. The industrial-grade -40C to +100C junction temperature range and flip-chip BGA construction suit it to board-level designs where thermal and signal-integrity margins are tight.
Architecturally, Arria II GZ combines a Transceiver Logic Block (TLB) up to 6.375 Gbps for protocols such as PCIe Gen2, XAUI, and Serial RapidIO, an Adaptive Logic Module (ALM) fabric for efficient LUT/register packing, and a rich hard-memory hierarchy (M9K, M144K blocks). The 40 nm process lowers static and dynamic power versus the prior 65 nm Arria GX generation while preserving high-speed serial performance.
Typical applications include high-speed serial backplane bridging, telecom line cards and baseband processing, video broadcast infrastructure, high-performance ASIC prototyping, and industrial imaging pipelines where parallel DSP and fast memory are required. The combination of mid-range density, embedded transceivers, and an industrial BGA package makes it a flexible system-level integration point.
When designing with this part, allocate sufficient PCB layers (typically 10+ for the 780-ball flip-chip BGA), place high-speed transceiver channels on matched-length differential pairs, and follow Intel's decoupling and power-rail sequencing guidance to control in-rush current at configuration. Use the Quartus Prime design suite (legacy Quartus II support exists) for synthesis, place-and-route, and bitstream generation.
This page synthesizes distributor pricing across DigiKey/Mouser, same-package drop-in alternatives from the Arria II GZ family, and practical design notes that go beyond the manufacturer datasheet's per-pin electrical tables.
直接替换替代料： EP2AGZ300FH29I4G ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP2AGZ300FH29I4G （相同外形与封装尺寸） ——差异在于 Package, Speed Grade, Transceivers, Logic Elements (LE), Lead-Free.
快速对比工具——选择替代料号进行并排对比：
EP2AGZ300FH29I3G
✅ 直接替换✓ 有现货
$1340 / 个
查看数据手册 →EP2AGZ300FH29I3N
✅ 直接替换✓ 有现货
$1380 / 个
查看数据手册 →EP2AGZ300FH29C4G
✅ 直接替换✓ 有现货
$1700 / 个
查看数据手册 →EP2AGZ300FH29C4N
✅ 直接替换✓ 有现货
$1395 / 个
查看数据手册 →EP2AGZ300FH29C3G
✅ 直接替换✓ 有现货
$1545 / 个
查看数据手册 →EP2AGZ300FH29C3N
✅ 直接替换✓ 有现货
$1925 / 个
查看数据手册 →EP2AGZ300FH29I4G 最大额定值与电气特性
| Family | Arria II GZ (AGZ) |
| Logic Elements (LE) | 300,000 (approx., per family member) |
| Number of I/O | 281 |
| Package Type | 780-ball Flip-Chip BGA (FineLine) |
| Package Code | FH29 (29x29 mm) |
| 工作温度范围 | -40C to +100C (industrial, I-grade) |
| Speed Grade | I4 |
| Process Node | 40 nm TSMC |
| Supply Voltage (Core) | 0.9 V (typical) |
| Configuration Method | JTAG / Passive Serial / Fast Passive Parallel |
| Transceivers | Embedded multi-gigabit transceivers (per family) |
| DSP Blocks | Yes (variable-precision, per family) |
| Block RAM | Embedded M9K / M144K blocks |
| RoHS 状态 | Compliant |
| 安装类型 | Surface Mount (BGA) |
| Lead-Free | Yes (per RoHS) |
EP2AGZ300FH29I4G fh29 (29x29 mm) 引脚配置指南
EP2AGZ300FH29I4G（fh29 (29x29 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP2AGZ300FH29I4G.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP2AGZ300FH29I4G 适用于 6 应用s: High-Speed Serial Backplane Bridging, Telecom Line Card and Baseband Processing, Video Broadcast and Image Processing, ASIC Prototyping and Emulation, Industrial Imaging and Machine Vision, High-Performance Computing and Signal Processing.
High-Speed Serial Backplane Bridging
The EP2AGZ300FH29I4G's embedded multi-gigabit transceivers (up to 6.375 Gbps) and high-density logic fabric make it ideal for bridging between backplanes carrying protocols such as PCIe Gen2, XAUI, and Serial RapidIO. With 300K LEs it can handle aggregation, packet buffering, and protocol translation across multiple lanes in a single device. Designers typically allocate a portion of the fabric to MAC-layer packet processing while the hard transceivers handle physical-layer serialization, avoiding soft SERDES implementation entirely.
推荐
Telecom Line Card and Baseband Processing
In telecom line cards the EP2AGZ300FH29I4G pairs its variable-precision DSP blocks with abundant block RAM for baseband processing, channelization, and FEC acceleration. Industrial -40C to +100C temperature range qualifies it for outdoor and uncontrolled-environment deployments such as remote radio heads. A typical implementation consumes 8-12 transceivers for CPRI/OBSAI fronthaul plus several hundred DSP blocks for downlink/uplink PHY processing, all within a single 780-ball BGA.
推荐
Video Broadcast and Image Processing
The 300K LE fabric plus variable-precision DSP makes the EP2AGZ300FH29I4G well-suited to broadcast video pipelines: real-time color space conversion, scaling, deinterlacing, and overlay composition. The 281 user I/Os accept multiple parallel camera/sensor inputs and drive HDMI/SDI outputs through external PHY chips. Block RAM (M9K + M144K) provides line buffers for raster-to-raster conversion without external DDR in lower-resolution designs.
推荐
ASIC Prototyping and Emulation
With 300K LEs, the EP2AGZ300FH29I4G is commonly used in multi-FPGGA ASIC prototyping platforms where one or more devices partition an ASIC design. The industrial temperature grade and flip-chip BGA make it reliable in prototype platforms that run continuously for weeks during validation. The hard transceivers and abundant block RAM let designers map memory-intensive ASIC blocks without incurring multi-FPGA partitioning penalties.
推荐
Industrial Imaging and Machine Vision
The EP2AGZ300FH29I4G handles multiple GigE Vision or CoaXPress camera streams simultaneously, performing pixel-level preprocessing, histogram equalization, and pattern matching in the DSP blocks. The industrial temperature rating is critical for factory-floor environments where ambient temperatures routinely exceed 70C. With 281 I/Os, the device can connect to multiple image sensors, illumination controllers, and motor drivers for automated optical inspection systems.
推荐
High-Performance Computing and Signal Processing
The variable-precision DSP blocks in the EP2AGZ300FH29I4G deliver hundreds of GMACs for FFT, FIR, and matrix multiplication workloads, while block RAM provides on-chip data storage for streaming signal processing. Designers target the FPGA at RADAR beamforming, scientific instrumentation, and software-defined radio where both logic density and DSP throughput matter. Quartus Prime DSP Builder accelerates algorithm-to-bitstream implementation directly from MATLAB/Simulink.
推荐
推荐产品汇总
工程参考数据： EP2AGZ300FH29I4G ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP2AGZ300FH29I3G | EP2AGZ300FH29I3N | EP2AGZ300FH29C4G | EP2AGZ300FH29C4N | EP2AGZ300FH29C3G | EP2AGZ300FH29C3N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-ball FCBGA (FH29, 29x29 mm) | 780-ball FCBGA (FH29, 29x29 mm) - same | 780-ball FCBGA (FH29, 29x29 mm) - same | 780-ball FCBGA (FH29, 29x29 mm) - same | 780-ball FCBGA (FH29, 29x29 mm) - same | 780-ball FCBGA (FH29, 29x29 mm) - same | 780-ball FCBGA (FH29, 29x29 mm) - same |
| Logic Elements | ~300K | ~300K | ~300K | ~300K | ~300K | ~300K | ~300K |
| User I/O | 281 | 281 | 281 | 281 | 281 | 281 | 281 |
| Temperature Grade | Industrial -40C to +100C | Industrial -40C to +100C | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C |
| Speed Grade | I4 | I3 (faster) | I3 (faster) | C4 (slower) | C4 (slower) | C3 (faster) | C3 (faster) |
| Lead-Free | Yes (per 'G' suffix) | Yes | Yes (per 'N' suffix) | Yes | Yes | Yes | Yes |
| Process Node | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm |
| Family | Arria II GZ | Arria II GZ | Arria II GZ | Arria II GZ | Arria II GZ | Arria II GZ | Arria II GZ |
关键差异点
- Industrial -40C to +100C temperature grade on the same FH29 BGA （对比 EP2AGZ300FH29C4G)
- Higher-density 29x29 mm BGA versus FF35 33x33 mm BGA （对比 EP2AGZ300FF35I4G)
- I4 speed grade offers more conservative timing margin for industrial designs （对比 EP2AGZ300FH29I3G)
设计说明
The 780-ball FH29 flip-chip BGA has a 1.0 mm ball pitch; route escape requires at minimum an 8-layer PCB with microvia stack-ups. Follow Intel's flip-chip BGA layout guidelines for via-in-pad with filled and capped microvias to avoid solder joint voids. Decoupling: place 0402/0201 ceramic capacitors within 100 mils of every power pin, with bulk tantalum/polymer capacitors on each voltage rail.
Estimated thermal dissipation: with all transceivers active and 70% logic utilization, junction power can reach 8-12 W. The flip-chip BGA's exposed die delivers theta_JC around 0.2 C/W, but theta_JA is dominated by PCB copper. A minimum 4-layer board with continuous inner copper ground/power planes plus a topside thermal land array is needed to keep junction rise below 25 C above ambient at 10 W. Add a heatsink for industrial-grade deployments in enclosed enclosures.
Multi-gigabit transceivers require 100-ohm differential pairs with intra-pair skew < 1 ps and inter-pair length matching per protocol (PCIe Gen2: 5 mils tolerance). Use the IBIS-AMI models from Intel for channel simulation; do not rely on rule-of-thumb routing. Reference clocks to transceivers must be ultra-low-jitter (< 300 fs RMS) - pair the EP2AGZ300FH29I4G with a dedicated clock generator such as the CDCM61002 or Si5341.
Power-on sequence for Arria II GZ requires VCC (0.9 V core) before VCCPD and VCCIO, with monotonic ramp rates between 0.5 ms and 100 ms. Use a multi-rail power manager such as the LTC3882 or UCD90120A to enforce sequencing. Add in-rush current limiting at the 12 V input - the FPGA can draw > 20 A during configuration. Verify the bitstream integrity with CRC verification enabled before releasing reset.
Do not use commercial-grade variants (EP2AGZ300FH29C4G or C3G) as a drop-in replacement for industrial designs - they will fail at temperatures below 0C or above +85C. Do not reuse Quartus II 9.0 synthesis results with later Quartus Prime versions without re-running TimeQuest timing analysis, as the timing models have changed. Finally, never leave unused transceiver channels floating - tie TX outputs to common-mode and disable RX termination to avoid unwanted radiation.
合规信息
RoHS and REACH compliance per Intel/Altera product page. Not AEC-Q100 qualified - this is a logic device, not an automotive-grade IC by qualification standard.
