EP2SGX90EF1152I3N vs EP2SGX90EF1152I3 对比

详细并排对比 EP2SGX90EF1152I3N 出自 Altera 和 EP2SGX90EF1152I3 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP2SGX90EF1152I3 EP2SGX90EF1152I3 - 90,960 LEs, Stratix II GX FPGA | Intel

EP2SGX90EF1152I3 - 90,960 LEs, Stratix II GX FPGA | Intel

EP2SGX90EF1152I3 ⚠ 最后一次采购

规格对比

参数 EP2SGX90EF1152I3N EP2SGX90EF1152I3
品牌 Altera Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 不推荐新设计 最后采购期
库存状态 有库存 有库存
单价(USD) $1,320.00 $1,480.00
Family Stratix II GX —
Logic Elements (LEs) 90,960 —
Equivalent LEs / CLBs 90,960 —
Total RAM Bits 4,520,448 (4.5 Mbits) 4,520,448
Process Technology 90 nm 90 nm CMOS
Core Voltage 1.2 V —
Maximum Internal Frequency 816.9 MHz —
Operating Temperature Grade Industrial Industrial (-40C to +100C)
封装 1152-ball FC-FBGA —
Package Code BGA BGA
Package Shape Square Square
Terminal Form Ball Ball
Number of Terminals 1152 —
Transceivers Multi-gigabit serial transceivers (GX family) —
安装类型 Surface Mount Surface Mount
RoHS 状态 Compliant Compliant
Series — Stratix II GX
Logic Elements — 90,960
Adaptive Logic Modules (ALMs) — 558
Equivalent Logic Cells (CLBs) — 90,960
Maximum Operating Frequency — 622.08 MHz
Core Supply Voltage (VCCINT) — 1.2 V nominal (1.15 V to 1.25 V)
Package Type — 1152-ball FC-FBGA (flip-chip)
Terminal Pitch — [DATA_NEEDED: ball pitch]
Configuration Architecture — Enhanced Configuration (EPC) devices supported

数据手册与资源

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