EP3SE260F1517C4LN vs EP3SE260F1517C3 对比

详细并排对比 EP3SE260F1517C4LN 出自 Intel 和 EP3SE260F1517C3 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP3SE260F1517C4LN EP3SE260F1517C4LN - Stratix III E FPGA 255K LE, 1517-BGA | Intel

EP3SE260F1517C4LN - Stratix III E FPGA 255K LE, 1517-BGA | Intel

EP3SE260F1517C4LN ⚠ 最后一次采购

规格对比

参数 EP3SE260F1517C4LN EP3SE260F1517C3
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 最后采购期 有效
库存状态 有库存 有库存
单价(USD) $1,450.00 $10,800.00
Series Stratix III E Stratix III E
Family Stratix III E (Enhanced) —
Logic Elements 255,000 255,000
Number of LABs/CLBs 10,200 —
Total Memory Bits 16,672,768 (16.67 Mbit) —
Number of I/O 976 —
Number of Gates [DATA_NEEDED: gate count not published in web data] —
Voltage - Supply 0.9 V to 1.1 V core —
Operating Frequency 375 MHz to 450 MHz (per family) —
Process Technology 65 nm —
封装 / 外壳 1517-BBGA, FCBGA (FC-FBGA) —
安装类型 Surface Mount (flip-chip) Surface Mount (BGA)
工作温度 0C to +85C (commercial grade per 'C' suffix) —
湿敏等级(MSL) 3 (168 Hours) —
Packaging Tray —
Speed Grade C4 3
Lead-Free / Halogen-Free Yes (LN suffix) —
RoHS 状态 Compliant Compliant
Manufacturer — Intel (formerly Altera)
Logic Array Blocks (LABs) — 10,200
Embedded Memory — 16,672,768 bits (16.67 Mbit)
User I/Os — 976
DSP Blocks (18x18 multipliers) — 768
PLLs — 12
Core Voltage — 0.9 V
Process Node — 65 nm (TSMC)
封装 — 1517-BBGA, FCBGA (FineLine BGA)
Package Pitch — 1.0 mm
Operating Temperature Grade — Commercial (C suffix)
Configuration — SRAM-based, requires external configuration device

数据手册与资源

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