EP3SE260H780C2N vs EP3SE260F1152C2N 对比
详细并排对比 EP3SE260H780C2N 出自 Intel 和 EP3SE260F1152C2N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3SE260H780C2N | EP3SE260F1152C2N |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 最后采购期 | Obsolete |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $3,600.00 | $11,000.00 |
| Series | Stratix III E | Stratix III E |
| Logic Elements | 255,000 | — |
| LABs / CLBs | 10,200 | — |
| Total RAM Bits | 16,672,768 | — |
| User I/O Count | 488 | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count] | — |
| Core Voltage | 0.9 V | — |
| 封装 | 780-BGA FCBGA | — |
| 安装类型 | Surface Mount | Surface Mount |
| 工作温度范围 | Commercial (0C to +85C) | — |
| Speed Grade | C2 | — |
| MSL 等级 | 3 (168 hours) | [DATA_NEEDED: MSL rating] |
| Reflow Peak Time Max | 40 s | — |
| RoHS 状态 | [DATA_NEEDED: rohs status] | Compliant |
| Lead-Free | [DATA_NEEDED: lead-free] | — |
| Package Code | BGA | — |
| Terminal Form | Ball | — |
| Number of Terminals | 780 | — |
| Process Node | 40 nm | — |
| Family | — | FPGA - Field Programmable Gate Array |
| Number of Logic Elements | — | 255000 |
| Number of LABs/CLBs | — | 10200 |
| Total Memory Bits | — | 16672768 |
| Number of I/O | — | 744 |
| Voltage - Supply | — | 1.1 V |
| 工作温度 | — | [DATA_NEEDED: operating temperature grade] |
| 封装 / 外壳 | — | 1152-BBGA, FCBGA |
| Process Technology | — | 65 nm |
| Maximum Frequency | — | 600 MHz |
| Supplier Device Package | — | 1152-FCBGA |
| Lead Free | — | Yes (per EP3SE260F1152C2G comparison) |
| ECCN | — | [DATA_NEEDED: ECCN code] |
| Moisture Sensitivity | — | [DATA_NEEDED: MSL level] |