EP3SE260H780C2N vs EP3SE260F1152C2N 比較
詳細な並列比較: EP3SE260H780C2N メーカー: Intel および EP3SE260F1152C2N メーカー: Intel。主要仕様、電気的特性、パッケージ、ライフサイクルステータス、価格、在庫状況を比較して、設計要件に最適な部品を判断してください。
仕様比較
| パラメータ | EP3SE260H780C2N | EP3SE260F1152C2N |
|---|---|---|
| ブランド | Intel | Intel |
| カテゴリ | FPGA & CPLD | FPGA & CPLD |
| ライフサイクル状態 | ラストバイ | Obsolete |
| 在庫状況 | In Stock | In Stock |
| 単価（USD） | $3,600.00 | $11,000.00 |
| Series | Stratix III E | Stratix III E |
| Logic Elements | 255,000 | — |
| LABs / CLBs | 10,200 | — |
| Total RAM Bits | 16,672,768 | — |
| User I/O Count | 488 | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count] | — |
| Core Voltage | 0.9 V | — |
| パッケージ | 780-BGA FCBGA | — |
| 実装タイプ | Surface Mount | Surface Mount |
| 動作温度範囲 | Commercial (0C to +85C) | — |
| Speed Grade | C2 | — |
| MSLレベル | 3 (168 hours) | [DATA_NEEDED: MSL rating] |
| Reflow Peak Time Max | 40 s | — |
| RoHS ステータス | [DATA_NEEDED: rohs status] | Compliant |
| Lead-Free | [DATA_NEEDED: lead-free] | — |
| Package Code | BGA | — |
| Terminal Form | Ball | — |
| Number of Terminals | 780 | — |
| Process Node | 40 nm | — |
| Family | — | FPGA - Field Programmable Gate Array |
| Number of Logic Elements | — | 255000 |
| Number of LABs/CLBs | — | 10200 |
| Total Memory Bits | — | 16672768 |
| Number of I/O | — | 744 |
| Voltage - Supply | — | 1.1 V |
| 動作温度 | — | [DATA_NEEDED: operating temperature grade] |
| パッケージ / ケース | — | 1152-BBGA, FCBGA |
| Process Technology | — | 65 nm |
| Maximum Frequency | — | 600 MHz |
| Supplier Device Package | — | 1152-FCBGA |
| Lead Free | — | Yes (per EP3SE260F1152C2G comparison) |
| ECCN | — | [DATA_NEEDED: ECCN code] |
| Moisture Sensitivity | — | [DATA_NEEDED: MSL level] |