EP3SE260H780C3 vs EP3SE260H780I4N 对比

详细并排对比 EP3SE260H780C3 出自 Intel 和 EP3SE260H780I4N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP3SE260H780I4N EP3SE260H780I4N - Stratix III E FPGA, 255K LE, 780-FCBGA | Intel

EP3SE260H780I4N - Stratix III E FPGA, 255K LE, 780-FCBGA | Intel

EP3SE260H780I4N ⚠ 最后一次采购

规格对比

参数 EP3SE260H780C3 EP3SE260H780I4N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 最后采购期
库存状态 有库存 有库存
单价(USD) $1,180.00 $2,150.00
Device Family Stratix III Enhanced (Stratix III E) —
Series EP3SE —
Logic Elements 255,000 255,000
Logic Array Blocks (LABs) 10200 10,200
Embedded Memory 16,672,768 bits (16.67 Mbit) —
User I/Os 488 488
Operating Voltage (Core) 0.9 V —
Operating Voltage (Auxiliary) 1.1 V —
Process Technology 65 nm CMOS 65 nm
Speed Grade C3 —
工作温度 Commercial, 0C to +85C -40C to +100C (Industrial)
Maximum Core Frequency 500 MHz —
封装 780-ball FCBGA (HBGA), flip-chip 780-pin FC-HFBGA (FCBGA)
安装类型 Surface Mount (BGA) —
湿敏等级(MSL) 3 (168 hours) —
Packaging Type Tray —
Configuration Memory Support Fast passive parallel, JTAG, Active Serial —
RoHS 状态 Compliant (per product listings) Compliant
Family — Stratix III Enhanced (Stratix III E)
Embedded Memory Bits — 16,672,768 bits
Core Voltage — 1.1 V
Maximum Operating Frequency — 450 MHz
Package Dimensions — 33 mm x 33 mm
Ball Pitch — [DATA_NEEDED: BGA ball pitch in mm]
Configuration Modes — AS, PS, JTAG, FPP
Boundary Scan — IEEE Std. 1149.1 (JTAG)
Lead-Free — Yes
Moisture Sensitivity Level — [DATA_NEEDED: MSL rating]

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