EP3SE260H780I4L vs EP3SE260H780C4L 对比
详细并排对比 EP3SE260H780I4L 出自 Intel 和 EP3SE260H780C4L 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3SE260H780I4L | EP3SE260H780C4L |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 最后采购期 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $1,395.00 | $1,190.00 |
| Family | Stratix III E (Enhanced) | Stratix III E |
| Logic Elements | 255,000 | 255,000 |
| Total Memory Bits | 16,672,640 | — |
| Number of LABs/CLBs | [DATA_NEEDED: LAB count] | — |
| User I/O Count | 488 | 488 |
| Core Voltage | 0.9 V | 0.9 V (nominal) |
| Process Technology | 65 nm | — |
| Package Type | 780-pin FC-HFBGA (flip-chip BGA) | — |
| 安装类型 | Surface Mount (flip-chip) | Surface Mount (flip-chip BGA) |
| Number of Transceivers | 24 (family-level maximum, per-pin count depends on variant) | — |
| Max Transceiver Data Rate | 6.375 Gbps (Stratix III E family spec) | — |
| Number of 18x18 Multipliers | [DATA_NEEDED: per-package multiplier count] | — |
| 工作温度 | Industrial, -40C to +85C | — |
| RoHS 状态 | Compliant (lead-free) | Compliant (lead-free per datasheet) |
| Configuration Mode | JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel | PS, FPP, JTAG with EPCS/EPCQ |
| Pin/Package | 780-BBGA, FCBGA (flip-chip) | — |
| LABs/CLBs | — | 10,200 |
| Total RAM Bits | — | 16,672,768 (16.7 Mbit) |
| 封装 | — | 780-ball FCBGA (HBGA 33x33 mm) |
| Speed Grade | — | C4 (middle/slow tier) |
| 工作结温 | — | 0C to +85C (commercial) |
| MSL 等级 | — | [DATA_NEEDED: MSL level] |
| Transceivers | — | Up to 24 multi-gigabit transceivers |
| Memory Interface | — | DDR3, DDR2, QDRII+, RLDRAM II controllers |