EP3SE260H780I4L vs EP3SE260H780C4L 비교
다음의 상세 나란히 비교: EP3SE260H780I4L 제조: Intel 및 EP3SE260H780C4L 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | EP3SE260H780I4L | EP3SE260H780C4L |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 최종 구매 | NRND |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $1,395.00 | $1,190.00 |
| Family | Stratix III E (Enhanced) | Stratix III E |
| Logic Elements | 255,000 | 255,000 |
| Total Memory Bits | 16,672,640 | — |
| Number of LABs/CLBs | [DATA_NEEDED: LAB count] | — |
| User I/O Count | 488 | 488 |
| Core Voltage | 0.9 V | 0.9 V (nominal) |
| Process Technology | 65 nm | — |
| Package Type | 780-pin FC-HFBGA (flip-chip BGA) | — |
| 실장 유형 | Surface Mount (flip-chip) | Surface Mount (flip-chip BGA) |
| Number of Transceivers | 24 (family-level maximum, per-pin count depends on variant) | — |
| Max Transceiver Data Rate | 6.375 Gbps (Stratix III E family spec) | — |
| Number of 18x18 Multipliers | [DATA_NEEDED: per-package multiplier count] | — |
| 동작 온도 | Industrial, -40C to +85C | — |
| RoHS 상태 | Compliant (lead-free) | Compliant (lead-free per datasheet) |
| Configuration Mode | JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel | PS, FPP, JTAG with EPCS/EPCQ |
| Pin/Package | 780-BBGA, FCBGA (flip-chip) | — |
| LABs/CLBs | — | 10,200 |
| Total RAM Bits | — | 16,672,768 (16.7 Mbit) |
| 패키지 | — | 780-ball FCBGA (HBGA 33x33 mm) |
| Speed Grade | — | C4 (middle/slow tier) |
| 동작 접합 온도 | — | 0C to +85C (commercial) |
| MSL 레벨 | — | [DATA_NEEDED: MSL level] |
| Transceivers | — | Up to 24 multi-gigabit transceivers |
| Memory Interface | — | DDR3, DDR2, QDRII+, RLDRAM II controllers |