EP3SE50F484I4L vs EP3SE50F484I4N 对比

详细并排对比 EP3SE50F484I4L 出自 Intel 和 EP3SE50F484I4N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP3SE50F484I4L EP3SE50F484I4L - Stratix III E FPGA, 47.5K LE, 484-FBGA | Intel

EP3SE50F484I4L - Stratix III E FPGA, 47.5K LE, 484-FBGA | Intel

EP3SE50F484I4L ⚠ 最后一次采购

规格对比

参数 EP3SE50F484I4L EP3SE50F484I4N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 最后采购期 不推荐新设计
库存状态 有库存 有库存
单价(USD) $1,290.00 $998.00
Family Stratix III E —
Logic Elements (LE) 47,500 47,500
Logic Array Blocks (LABs) 1,900 1,900
Adaptive Logic Modules (ALMs) [DATA_NEEDED: ALM count] 19,000
Embedded Memory 5,760 Kbit (5.625 Mbit) —
Embedded Multipliers (18x18) 384 384
Maximum User I/O 296 —
Maximum Core Clock 717 MHz (per third-party listing) —
Speed Grade 4 (slowest) I4
工作温度范围 Industrial (I): -40C to +100C junction —
Process Node 40 nm CMOS —
封装 484-ball FCBGA (FBGA-484) 484-ball FC-FBGA (F484)
安装类型 Surface Mount (BGA) —
电源电压 Multiple rails: core 0.9V, I/O 1.2V-3.3V (per Stratix III handbook) —
Configuration Method Quartus II / EPCS serial / parallel —
Lead-Free (Pb-free) Yes (L suffix) —
RoHS 状态 Compliant —
MSL 等级 MSL3 (per JEDEC J-STD-020, typical for FBGA-484) —
Device Family — Stratix III E
Embedded Memory (TriMatrix) — 2,136 Kbits
User I/Os — 296
I/O Banks — 12
PLLs — 8
Global Clock Networks — 16
Maximum User I/O Frequency — 800 MHz (per DigChip datasheet summary)
Process Technology — 65 nm CMOS
Core Voltage — 1.1 V
工作温度 — 0 C to +85 C (Industrial)
Lead-Free / RoHS — Lead-free (per ampheo listing)

数据手册与资源

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