EP3SL200F1517I3N vs EP3SL200F1517I4LN 对比

详细并排对比 EP3SL200F1517I3N 出自 Intel 和 EP3SL200F1517I4LN 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EP3SL200F1517I3N EP3SL200F1517I4LN
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 Obsolete 不推荐新设计
库存状态 有库存 有库存
单价(USD) $1,620.00 $6,300.00
Family Stratix III L Stratix III L
Logic Elements 200,000 200,000
Number of LABs 8000 —
Total Memory Bits 10,901,504 —
User I/Os 976 —
Number of Logic Cells 200000 —
Process Technology 65 nm 65 nm TSMC low-power
Core Voltage 1.1 V —
Maximum Internal Frequency 500 MHz —
Number of Transceivers [DATA_NEEDED: number of transceivers] —
封装 1517-BBGA, FCBGA (FC-FBGA) 1517-BBGA, FCBGA
安装类型 Surface Mount (BGA) Surface Mount (BGA)
工作温度 -40C to +100C (Industrial) -40C to +100C (Industrial)
Supplier Device Package 1517-FBGA —
RoHS 状态 Compliant Compliant
Configuration Memory SRAM-based —
Number of 18x18 Multipliers 384 —
Embedded Memory Bits — 10,901,504
Logic Array Blocks (LABs) — 8,000
User I/O Pins — 976
Lead-Free — Yes
MSL 等级 — [DATA_NEEDED: MSL moisture sensitivity level]
Supply Voltage Core — [DATA_NEEDED: VCC core voltage]
Transceiver Data Rate (max) — [DATA_NEEDED: max transceiver rate]
DSP Blocks (18x18 multipliers) — 384
DSP Performance — 288 GMACS
Configuration Method — Passive Parallel / Active Serial / JTAG
Ball Pitch — 1.0 mm
Package Dimensions — 40 mm x 40 mm

数据手册与资源

浏览全部产品 创建 BOM 获取报价