EP3SL200H780I4 vs EP3SL200H780I4N 对比

详细并排对比 EP3SL200H780I4 出自 Intel 和 EP3SL200H780I4N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP3SL200H780I4N EP3SL200H780I4N - Stratix III L FPGA 200K LE 780-HBGA | Intel

EP3SL200H780I4N - Stratix III L FPGA 200K LE 780-HBGA | Intel

EP3SL200H780I4N ⚠ 最后一次采购

规格对比

参数 EP3SL200H780I4 EP3SL200H780I4N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 不推荐新设计 最后采购期
库存状态 有库存 有库存
单价(USD) $6,255.75 $4,750.00
Series Stratix III L Stratix III L
Family Stratix III Stratix III (Logic-rich variant)
Logic Elements (LE) 200,000 —
Logic Array Blocks (LABs) 8000 8,000
Embedded Memory Bits 10,901,504 —
User I/O Count 488 —
DSP Multipliers (18x18) 384 —
Voltage - Core Supply 1.1 V —
Process Technology 65 nm CMOS 65 nm CMOS
Package Type 780-BBGA / FCBGA (FC-HFBGA) —
Package Dimensions 33 mm x 33 mm —
Speed Grade I4 (industrial) I4
工作结温 -40C to +100C (industrial) —
Configuration Memory SRAM-based, volatile —
RoHS 状态 Compliant Compliant
Design Tool Quartus II (legacy) / Quartus Prime —
Logic Elements — 200,000
Embedded Memory (bits) — 10,901,504
User I/Os — 488
Core Voltage — 1.1 V (0.86 V to 1.15 V range)
Fabric Frequency (typical) — 450 MHz
工作温度范围 — -40C to +100C (industrial)
封装 — 780-ball FCBGA (Flip-Chip BGA, FineLine)
安装类型 — Surface Mount (BGA)
Lead-Free — Yes (suffix N)

数据手册与资源

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