EP3SL340H1152C3N vs EP3SE110F1152C3N 对比

详细并排对比 EP3SL340H1152C3N 出自 Intel 和 EP3SE110F1152C3N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP3SE110F1152C3N EP3SE110F1152C3N - Stratix III E FPGA, 107.5K LE, FC-FBGA-1152 | Intel

EP3SE110F1152C3N - Stratix III E FPGA, 107.5K LE, FC-FBGA-1152 | Intel

EP3SE110F1152C3N ⚠ 最后一次采购

规格对比

参数 EP3SL340H1152C3N EP3SE110F1152C3N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 不推荐新设计 最后采购期
库存状态 有库存 有库存
单价(USD) $1,895.00 $1,560.00
Family Stratix III L Stratix III E
Logic Elements 337,500 —
User I/O Count 744 —
Number of LABs/CLBs 13,500 —
Total RAM Bits 18,822,144 8,936,448
Supply Voltage (Core) 1.1 V —
Process Node 65 nm —
工作温度 0C to +85C (Commercial) 0 °C to 85 °C (commercial)
封装 1152-BBGA, FCBGA —
安装类型 Surface Mount Surface Mount
Speed Grade 3 C3
Configuration Memory SRAM (volatile) —
引脚数 1152 —
RoHS 状态 Compliant —
Lead-Free Yes Yes (per Altera/Intel datasheet family convention)
Series — Stratix III
Logic Elements (LE) — 107,500
Logic Array Blocks (LABs) — 4,300
User I/Os — 744
Operating Frequency (max) — 500 MHz
Core Supply Voltage — 1.1 V nominal
I/O Supply Voltage — [DATA_NEEDED: I/O supply range]
Process Technology — 65 nm TSMC
Package Type — FC-FBGA-1152 (flip-chip BGA)
安装方式 — SMD/SMT (Tray)
DSP Blocks — Yes (embedded multipliers)
存储器类型 — M9K and M144K block RAM
External Memory Support — DDR/DDR2/DDR3 with read/write leveling
Boundary Scan — IEEE 1149.1 (JTAG)
RoHS — [DATA_NEEDED: RoHS status]

数据手册与资源

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