EP3SL50F484I3N vs EP3SL50F484I4LG 对比

详细并排对比 EP3SL50F484I3N 出自 Intel 和 EP3SL50F484I4LG 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP3SL50F484I3N EP3SL50F484I3N - 47.5K LE Stratix III L FPGA 484-FBGA | Intel

EP3SL50F484I3N - 47.5K LE Stratix III L FPGA 484-FBGA | Intel

EP3SL50F484I3N ⚠ 最后一次采购

规格对比

参数 EP3SL50F484I3N EP3SL50F484I4LG
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 最后采购期 不推荐新设计
库存状态 有库存 有库存
单价(USD) $552.30 $945.00
Family Stratix III L Stratix III L
Logic Elements 47,500 47,500
Logic Array Blocks (LABs) 1,900 —
Embedded Memory 2,184,192 bits (2.1 Mbit) 2,184,192 bits (273 KB)
Embedded 18x18 Multipliers 218 —
Maximum User I/O 296 —
Process Technology 65 nm CMOS —
Core Voltage 0.9 V / 1.1 V —
Maximum Core Frequency 500 MHz —
封装 484-ball FBGA (FC-FBGA, 23x23 mm, 1.0 mm pitch) 484-Ball FCBGA (FBGA)
工作结温 -40C to +100C (Industrial) —
安装类型 Surface Mount (SMT) Surface Mount
Lead-Free / RoHS Lead Free / Compliant —
MSL 等级 [DATA_NEEDED: MSL level per JEDEC J-STD-020] —
Programming Tool Quartus II (legacy) —
Series — EP3SL50
User I/Os — 296
工作温度 — -40C to +100C (Industrial)
Speed Grade — I4 (fast)
电源电压 — 0.85 V / 1.1 V / 1.2 V / 2.5 V / 3.3 V (multi-rail)
Process Node — 40 nm
RoHS 状态 — Compliant
Lead-Free — Yes
Total I/O Banks — [DATA_NEEDED: I/O bank count]
DSP Blocks — [DATA_NEEDED: DSP block count]
Transceivers — [DATA_NEEDED: transceiver channel count]
Configuration Memory — SRAM-based
Configuration Interface — JTAG / Passive Serial / Fast Passive Parallel

数据手册与资源

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