EP3SL50F780I3 vs EP3SL50F780I4 对比
详细并排对比 EP3SL50F780I3 出自 Intel 和 EP3SL50F780I4 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3SL50F780I3 | EP3SL50F780I4 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 不推荐新设计 | 最后采购期 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $632.63 | $580.00 |
| Series | Stratix III L | Stratix III L |
| Logic Elements | 47,500 | 47,500 |
| Logic Array Blocks (LABs) | 1,900 | — |
| User I/O Pins | 488 | — |
| Total Memory Bits | 2,106 Kbit (M9K + M144K) | — |
| Transceiver Channels | 16 (up to 3.75 Gbps) + 8 (up to 6.5 Gbps) | — |
| 封装 | 780-ball FC-FBGA (FineLine BGA), 1 mm pitch | 780-BBGA, FCBGA |
| Process Technology | 65 nm | — |
| Core Voltage | Selectable 1.1 V / 0.9 V | 0.9 V |
| Speed Grade | I3 (industrial, third-fastest bin) | I4 (fastest) |
| 工作温度 | -40C to +100C (industrial) | -40C to +100C (Industrial) |
| 安装类型 | Surface Mount | Surface Mount |
| RoHS 状态 | Compliant | Compliant |
| Lead Free | Yes | — |
| Vertical Migration | Drop-in to EP3SL70 in 780-FBGA package | — |
| Manufacturer | — | Intel (formerly Altera) |
| Process Node | — | 40 nm TSMC |
| Embedded Memory Bits | — | 2,184,192 |
| Embedded Memory Blocks | — | M20K blocks |
| DSP 18x18 Multipliers | — | 244 |
| User I/Os | — | 488 |
| PLLs | — | 8 |
| Global Clock Networks | — | 28 |
| Configuration Method | — | Serial, parallel, or JTAG |
| Memory Interfaces | — | DDR3, QDRII+, RLDRAM II |
| Hard IP | — | PCIe Gen2 hard IP blocks |