EP3SL70F780C3 vs EP3SL50F780C3 对比

详细并排对比 EP3SL70F780C3 出自 Intel 和 EP3SL50F780C3 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EP3SL70F780C3 EP3SL50F780C3
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 不推荐新设计 最后采购期
库存状态 有库存 有库存
单价(USD) $780.00 $540.00
Series Stratix III L Stratix III
Family Stratix III Stratix III L (low-power)
Logic Elements (LE) 67,500 —
Embedded Memory (bits) 2,699,264 —
Logic Array Blocks (LABs) 2,700 1,900
User I/O Count 488 —
Number of I/O Banks [DATA_NEEDED: number of I/O banks] —
Number of Pins / Balls 780 —
封装 780-BBGA, FC-FBGA —
安装类型 Surface Mount —
Process Technology 65 nm —
Core Voltage (VCCINT) 1.1 V —
Maximum Internal Clock Frequency 500 MHz —
工作温度范围 0°C to 85°C (commercial) —
Speed Grade C3 3
Design Software Quartus II (last supported v13.1) —
RoHS 状态 [DATA_NEEDED: RoHS status] Compliant
Logic Elements — 47,500
Embedded Memory Bits — 2,184,192
User I/Os — 488
Package Type — 780-BBGA, FCBGA (FineLine)
Device Pin Count — 780
工作温度 — 0C to +85C (Commercial)
Supply Voltage (Core) — [DATA_NEEDED: VCCINT nominal value]
PLLs — 12
Global Clock Networks — 24
Process Node — 65 nm TSMC
Configuration Method — SRAM-based, supports Partial Reconfiguration
Lead-Free / Halogen-Free — Lead-Free (per package marking); Halogen-Free status unknown
湿敏等级(MSL) — MSL3 (per JEDEC J-STD-020, typical for large FBGA)

数据手册与资源

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