EPF10K130EFC672-1X vs EPF10K130EFC672-2X 对比
详细并排对比 EPF10K130EFC672-1X 出自 Intel 和 EPF10K130EFC672-2X 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EPF10K130EFC672-1X | EPF10K130EFC672-2X |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | Obsolete | Obsolete |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $342.75 | $92.00 |
| Family | FLEX 10KE | — |
| Series | FLEX 10KE® | FLEX 10KE |
| Typical Gates | 130,000 | — |
| Logic Elements (LEs) | 6,656 | — |
| Total RAM Bits | 65,536 | 65536 |
| Logic Array Blocks (LABs) | 832 | — |
| User I/Os | 413 | — |
| Number of I/O Banks | 8 | — |
| Core Voltage | 2.5 V (2.375 V to 2.625 V) | — |
| Internal Operating Frequency | up to 333.33 MHz | — |
| Process Technology | 0.22 µm CMOS, SRAM-based | 0.22 μm CMOS SRAM |
| 封装 | 672-ball FBGA, 27x27 mm, 1.0 mm pitch | 672-FBGA (FineLine BGA, 27x27 mm) |
| Speed Grade | -1X | — |
| Operating Temperature (Commercial) | 0 °C to +70 °C | — |
| Configuration Mode | Passive Serial, JTAG, ByteBlaster | — |
| 安装类型 | Surface Mount (BGA) | Surface Mount (BGA) |
| Moisture Sensitivity Level | MSL 3 (per JEDEC J-STD-020) | — |
| RoHS 状态 | [DATA_NEEDED: RoHS compliance] | [DATA_NEEDED: RoHS compliance status] |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Number of Logic Elements (LEs) | — | 6656 |
| Number of Logic Array Blocks (LABs) | — | 832 |
| Number of User I/Os | — | 413 |
| Number of DLLs | — | 4 |
| Ball Pitch | — | 1.0 mm |
| Core Supply Voltage | — | 2.5 V (2.375 V to 2.625 V) |
| I/O Supply Voltage | — | 3.3 V (MultiVolt I/O supports 5.0 V, 3.3 V, 2.5 V) |
| 工作温度 | — | 0C to +70C (commercial) |
| Configuration Method | — | Serial configuration device, JTAG |
| Logic Family | — | CMOS, SRAM-based |