EPF10K130EFC672-1X vs EPF10K130EFC672-2X Comparison
Detailed side-by-side comparison of EPF10K130EFC672-1X by Intel and EPF10K130EFC672-2X by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPF10K130EFC672-1X | EPF10K130EFC672-2X |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $342.75 | $92.00 |
| Family | FLEX 10KE | โ |
| Series | FLEX 10KEยฎ | FLEX 10KE |
| Typical Gates | 130,000 | โ |
| Logic Elements (LEs) | 6,656 | โ |
| Total RAM Bits | 65,536 | 65536 |
| Logic Array Blocks (LABs) | 832 | โ |
| User I/Os | 413 | โ |
| Number of I/O Banks | 8 | โ |
| Core Voltage | 2.5 V (2.375 V to 2.625 V) | โ |
| Internal Operating Frequency | up to 333.33 MHz | โ |
| Process Technology | 0.22 ยตm CMOS, SRAM-based | 0.22 ฮผm CMOS SRAM |
| Package | 672-ball FBGA, 27x27 mm, 1.0 mm pitch | 672-FBGA (FineLine BGA, 27x27 mm) |
| Speed Grade | -1X | โ |
| Operating Temperature (Commercial) | 0 ยฐC to +70 ยฐC | โ |
| Configuration Mode | Passive Serial, JTAG, ByteBlaster | โ |
| Mounting Type | Surface Mount (BGA) | Surface Mount (BGA) |
| Moisture Sensitivity Level | MSL 3 (per JEDEC J-STD-020) | โ |
| RoHS Status | [DATA_NEEDED: RoHS compliance] | [DATA_NEEDED: RoHS compliance status] |
| Lead-Free | [DATA_NEEDED: lead-free status] | โ |
| Number of Logic Elements (LEs) | โ | 6656 |
| Number of Logic Array Blocks (LABs) | โ | 832 |
| Number of User I/Os | โ | 413 |
| Number of DLLs | โ | 4 |
| Ball Pitch | โ | 1.0 mm |
| Core Supply Voltage | โ | 2.5 V (2.375 V to 2.625 V) |
| I/O Supply Voltage | โ | 3.3 V (MultiVolt I/O supports 5.0 V, 3.3 V, 2.5 V) |
| Operating Temperature | โ | 0C to +70C (commercial) |
| Configuration Method | โ | Serial configuration device, JTAG |
| Logic Family | โ | CMOS, SRAM-based |