EPF10K200EBC600-2 vs EPF10K200EBC600-3 对比
详细并排对比 EPF10K200EBC600-2 出自 Intel 和 EPF10K200EBC600-3 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Intel
EPF10K200EBC600-3 - 200K Gate FLEX 10KE FPGA, 600-BGA | Intel / Altera
EPF10K200EBC600-3 Obsolete规格对比
| 参数 | EPF10K200EBC600-2 | EPF10K200EBC600-3 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | Obsolete | Obsolete |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $198.00 | $575.00 |
| Series | FLEX-10KE | FLEX-10KE |
| Logic Family | CMOS (SRAM-based) | — |
| Process Technology | 0.30 µm CMOS | 0.22 micrometer SRAM |
| Typical Gate Count | 200,000 gates | — |
| Logic Elements (LEs) | 9984 | — |
| Logic Array Blocks (LABs) | 1248 | 1248 |
| Embedded Memory (EAB) | 98304 bits (96 Kbits) | — |
| Maximum User I/O | 470 pins | 470 |
| Propagation Delay | 0.4 ns | — |
| 电源电压 | 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O) | — |
| I/O Standards | LVTTL, LVCMOS, PCI, GTL+ | — |
| Package Type | 600-ball BGA (BGA-600) | — |
| Package Dimensions | 45 × 45 mm | — |
| Ball Pitch | 1.27 mm | — |
| Package Height | 1.1 mm max | — |
| 工作温度 | 0°C to +70°C (Commercial) | 0C to +70C (commercial) |
| 安装类型 | Surface Mount | Surface Mount |
| Configuration Method | JTAG (IEEE 1149.1), EPC2 serial PROM | — |
| Part Status | Obsolete | — |
| RoHS 状态 | unknown | [DATA_NEEDED: RoHS compliance status] |
| Family | — | FLEX 10KE |
| System Gates | — | 200,000 |
| Logic Elements / Cells | — | 9,984 |
| Embedded Memory (EABs) | — | 24,576 bits |
| Number of PLLs | — | 4 |
| Core Voltage | — | 2.5 V (2.375 V to 2.625 V) |
| Speed Grade | — | -3 (commercial) |
| 封装 | — | 600-ball FineLine BGA, 45 x 45 mm |
| JTAG Support | — | Yes (IEEE 1149.1 boundary-scan) |