EPF10K200EBC600-2 vs EPF10K200EBC600-3 비교
다음의 상세 나란히 비교: EPF10K200EBC600-2 제조: Intel 및 EPF10K200EBC600-3 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
Intel
EPF10K200EBC600-3 - 200K Gate FLEX 10KE FPGA, 600-BGA | Intel / Altera
EPF10K200EBC600-3 Obsolete사양 비교
| 파라미터 | EPF10K200EBC600-2 | EPF10K200EBC600-3 |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | Obsolete | Obsolete |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $198.00 | $575.00 |
| Series | FLEX-10KE | FLEX-10KE |
| Logic Family | CMOS (SRAM-based) | — |
| Process Technology | 0.30 µm CMOS | 0.22 micrometer SRAM |
| Typical Gate Count | 200,000 gates | — |
| Logic Elements (LEs) | 9984 | — |
| Logic Array Blocks (LABs) | 1248 | 1248 |
| Embedded Memory (EAB) | 98304 bits (96 Kbits) | — |
| Maximum User I/O | 470 pins | 470 |
| Propagation Delay | 0.4 ns | — |
| 공급 전압 | 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O) | — |
| I/O Standards | LVTTL, LVCMOS, PCI, GTL+ | — |
| Package Type | 600-ball BGA (BGA-600) | — |
| Package Dimensions | 45 × 45 mm | — |
| Ball Pitch | 1.27 mm | — |
| Package Height | 1.1 mm max | — |
| 동작 온도 | 0°C to +70°C (Commercial) | 0C to +70C (commercial) |
| 실장 유형 | Surface Mount | Surface Mount |
| Configuration Method | JTAG (IEEE 1149.1), EPC2 serial PROM | — |
| Part Status | Obsolete | — |
| RoHS 상태 | unknown | [DATA_NEEDED: RoHS compliance status] |
| Family | — | FLEX 10KE |
| System Gates | — | 200,000 |
| Logic Elements / Cells | — | 9,984 |
| Embedded Memory (EABs) | — | 24,576 bits |
| Number of PLLs | — | 4 |
| Core Voltage | — | 2.5 V (2.375 V to 2.625 V) |
| Speed Grade | — | -3 (commercial) |
| 패키지 | — | 600-ball FineLine BGA, 45 x 45 mm |
| JTAG Support | — | Yes (IEEE 1149.1 boundary-scan) |