EPM2210GF324C5N vs EPM2210GF324C4N 对比

详细并排对比 EPM2210GF324C5N 出自 Intel 和 EPM2210GF324C4N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EPM2210GF324C4N EPM2210GF324C4N - 2210 LE MAX II CPLD 324-FBGA | Intel

EPM2210GF324C4N - 2210 LE MAX II CPLD 324-FBGA | Intel

EPM2210GF324C4N ✓ 量产中

规格对比

参数 EPM2210GF324C5N EPM2210GF324C4N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $17.90 $25.60
Family MAX II G MAX II
Series MAX II —
Logic Elements 2210 2,210
Equivalent Macrocells 1700 1,700
User Flash Memory (UFM) 8 Kbits 8 Kbits
Maximum User I/O 212 —
Pin-to-Pin Delay (tPD) 11.2 ns —
Propagation Delay 11.2 ns (max) —
Technology Flash CMOS, 6-layer metal —
Core Voltage 3.3 V / 2.5 V (internal) —
I/O Standards 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V (MultiVolt) —
封装 324-ball FineLine BGA (FBGA-324), 19 x 19 mm, 1.0 mm pitch 324-ball FineLine BGA (GF324)
工作温度 0 °C to +85 °C (commercial) —
安装类型 Surface Mount —
Programmability In-system (JTAG / IEEE 1532), non-volatile —
Lead Free Yes —
RoHS 状态 Compliant Compliant
MSL 等级 3 —
Device Type — CPLD (Complex Programmable Logic Device)
User I/Os (max) — 272
Supply Voltage - Core (VCCINT) — 1.8 V
MultiVolt I/O Support — 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V
Maximum Internal Frequency — 247.5 MHz
Pin-to-Pin Logic Delay (tPD) — 7.0 ns (C4 speed grade)
Process Technology — 0.18 µm 6-layer-metal flash
Programming Interface — IEEE 1149.1 JTAG (ISP)
Operating Temperature (commercial) — 0 °C to +85 °C

数据手册与资源

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