EPM2210GF324C5N vs EPM2210GF324C4N Vergleich
Detaillierter Direktvergleich von EPM2210GF324C5N von Intel und EPM2210GF324C4N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPM2210GF324C5N | EPM2210GF324C4N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $17,90 | $25,60 |
| Family | MAX II G | MAX II |
| Series | MAX II | — |
| Logic Elements | 2210 | 2,210 |
| Equivalent Macrocells | 1700 | 1,700 |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits |
| Maximum User I/O | 212 | — |
| Pin-to-Pin Delay (tPD) | 11.2 ns | — |
| Propagation Delay | 11.2 ns (max) | — |
| Technology | Flash CMOS, 6-layer metal | — |
| Core Voltage | 3.3 V / 2.5 V (internal) | — |
| I/O Standards | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V (MultiVolt) | — |
| Gehäuse | 324-ball FineLine BGA (FBGA-324), 19 x 19 mm, 1.0 mm pitch | 324-ball FineLine BGA (GF324) |
| Betriebstemperatur | 0 °C to +85 °C (commercial) | — |
| Montageart | Surface Mount | — |
| Programmability | In-system (JTAG / IEEE 1532), non-volatile | — |
| Lead Free | Yes | — |
| RoHS-Status | Compliant | Compliant |
| MSL-Level | 3 | — |
| Device Type | — | CPLD (Complex Programmable Logic Device) |
| User I/Os (max) | — | 272 |
| Supply Voltage - Core (VCCINT) | — | 1.8 V |
| MultiVolt I/O Support | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V |
| Maximum Internal Frequency | — | 247.5 MHz |
| Pin-to-Pin Logic Delay (tPD) | — | 7.0 ns (C4 speed grade) |
| Process Technology | — | 0.18 µm 6-layer-metal flash |
| Programming Interface | — | IEEE 1149.1 JTAG (ISP) |
| Operating Temperature (commercial) | — | 0 °C to +85 °C |