EPM2210GF324C5N vs EPM2210GF324C4N Comparison
Detailed side-by-side comparison of EPM2210GF324C5N by Intel and EPM2210GF324C4N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPM2210GF324C5N | EPM2210GF324C4N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Family | MAX II G | MAX II |
| Series | MAX II | — |
| Logic Elements | 2210 | 2,210 |
| Equivalent Macrocells | 1700 | 1,700 |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits |
| Maximum User I/O | 212 | — |
| Pin-to-Pin Delay (tPD) | 11.2 ns | — |
| Propagation Delay | 11.2 ns (max) | — |
| Technology | Flash CMOS, 6-layer metal | — |
| Core Voltage | 3.3 V / 2.5 V (internal) | — |
| I/O Standards | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V (MultiVolt) | — |
| Package | 324-ball FineLine BGA (FBGA-324), 19 x 19 mm, 1.0 mm pitch | 324-ball FineLine BGA (GF324) |
| Operating Temperature | 0 °C to +85 °C (commercial) | — |
| Mounting Type | Surface Mount | — |
| Programmability | In-system (JTAG / IEEE 1532), non-volatile | — |
| Lead Free | Yes | — |
| RoHS Status | Compliant | Compliant |
| MSL Level | 3 | — |
| Device Type | — | CPLD (Complex Programmable Logic Device) |
| User I/Os (max) | — | 272 |
| Supply Voltage - Core (VCCINT) | — | 1.8 V |
| MultiVolt I/O Support | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V |
| Maximum Internal Frequency | — | 247.5 MHz |
| Pin-to-Pin Logic Delay (tPD) | — | 7.0 ns (C4 speed grade) |
| Process Technology | — | 0.18 µm 6-layer-metal flash |
| Programming Interface | — | IEEE 1149.1 JTAG (ISP) |
| Operating Temperature (commercial) | — | 0 °C to +85 °C |