EPM570GF256C5N vs EPM570ZF256C7N 对比

详细并排对比 EPM570GF256C5N 出自 Intel 和 EPM570ZF256C7N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EPM570GF256C5N EPM570ZF256C7N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $17.95 $17.85
Device Family MAX II —
Logic Elements 570 —
Macrocells 440 —
Maximum User I/Os 212 —
Pin-to-Pin Delay (tPD) 5.4 ns —
Maximum Frequency (fMAX) 304 MHz —
User Flash Memory (UFM) 8 Kbits —
Operating Voltage (VCCINT) 3.3 V —
I/O Voltage Support (VCCIO) 1.5 V / 1.8 V / 2.5 V / 3.3 V —
封装 256-ball FineLine BGA (17 x 17 mm, 1.0 mm pitch) —
Process Technology 0.18 µm Flash-based CMOS 0.18 µm flash-based CMOS
Configuration Method Non-volatile, instant-on (Flash) —
Programming Interface JTAG (IEEE 1149.1) / ISP JTAG (IEEE 1149.1)
工作温度 -40 °C to +125 °C (Industrial) —
Lead-Free / RoHS Yes (Lead-free finish) —
Series — MAX II
Programmable Type — In System Programmable
Macro Cells — 440
Logic Elements (LE) — 440
Embedded Flash Memory — 8 Kbit
Pin-to-Pin Logic Delay (tPD) — 9 ns
Maximum Operating Frequency — 201 MHz (internal)
Maximum User I/O Pins — 160
Supply Voltage - Internal (VCCINT) — 1.71 V to 1.89 V
I/O Bank Voltages — 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt)
Supplier Device Package — 256-MBGA (11x11 mm)
Package Type Code — 256-FBGA / 256-TFBGA
Ball Pitch — 1.0 mm
工作温度范围 — 0 °C to +85 °C (commercial, suffix 'C')
安装类型 — Surface Mount
RoHS 状态 — Compliant
Lead-Free Status — Lead free

数据手册与资源

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