H5AN8G6NAFR-PBC vs H5AN8G6NDJR 对比
详细并排对比 H5AN8G6NAFR-PBC 出自 SK hynix 和 H5AN8G6NDJR 出自 SK hynix。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | H5AN8G6NAFR-PBC | H5AN8G6NDJR |
|---|---|---|
| 品牌 | SK hynix | SK hynix |
| 分类 | Memory ICs | Memory ICs |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $3.55 | $35.00 |
| 存储器类型 | DDR4 SDRAM | DDR4 SDRAM |
| Density | 8 Gbit | 8 Gb |
| 存储组织 | 512M x 16 | 512M x 16 |
| VDD Supply Voltage | 1.20 V +/- 0.06 V | — |
| VDDQ Supply Voltage | 1.20 V +/- 0.06 V | — |
| VPP Supply Voltage | 2.5 V +0.25/-0.125 V | — |
| 接口类型 | DDR4 (parallel, double data rate) | — |
| Speed Bins Supported | DDR4-1600 / 1866 / 2133 / 2400 (datasheet speed bin tables) | — |
| Refresh | Auto / Self Refresh | — |
| DLL | DLL ON mode for speed bin operation | — |
| Clock | Differential clock (CK/CK#) | — |
| 封装 | TFBGA-96 (rectangular) | 96-ball FBGA (13mm x 7.5mm) |
| Number of Terminals | 96 | 96 |
| 安装类型 | Surface Mount | — |
| 工作温度 | [DATA_NEEDED: operating temperature range] | — |
| RoHS 状态 | Compliant (Lead-Free & Halogen-Free) | — |
| Composition | CMOS | — |
| 数据速率 | — | 3200 Mbps (DDR4-3200) |
| 电源电压 | — | 1.2 V |
| Maximum Supply Voltage (Vsup) | — | 1.26 V |
| Maximum Operating Temperature | — | 85 °C |
| Burst Length | — | 8 (BL8), 4 (BC4) |
| CAS 延迟 | — | 22 cycles (at 3200 Mbps) |
| Access Mode | — | Multi Bank Page Burst |
| JESD-30 Code | — | R-PBGA-B96 |
| RoHS | — | Compliant |
| 特性 | — | Auto self-refresh, auto precharge, asynchronous reset, data mask, dynamic ODT, ZQ calibration, CRC, write leveling |