H5AN8G6NCJR-XXC vs H5AN8G6NDJR 对比

详细并排对比 H5AN8G6NCJR-xxC 出自 SK hynix 和 H5AN8G6NDJR 出自 SK hynix。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

SK hynix
H5AN8G6NCJR-xxC H5AN8G6NCJR-xxC - 8Gb DDR4 SDRAM 2666Mbps | SK Hynix

H5AN8G6NCJR-xxC - 8Gb DDR4 SDRAM 2666Mbps | SK Hynix

H5AN8G6NCJR-xxC ✓ 量产中
SK hynix
H5AN8G6NDJR H5AN8G6NDJR - 8Gb DDR4-3200 SDRAM | SK hynix

H5AN8G6NDJR - 8Gb DDR4-3200 SDRAM | SK hynix

H5AN8G6NDJR ✓ 量产中

规格对比

参数 H5AN8G6NCJR-xxC H5AN8G6NDJR
品牌 SK hynix SK hynix
分类 Memory ICs Memory ICs
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $6.50 $35.00
存储器类型 DDR4 SDRAM DDR4 SDRAM
Density 8 Gb 8 Gb
存储组织 512M x 16 512M x 16
数据速率 2666 Mbps (VKC speed grade) 3200 Mbps (DDR4-3200)
Supply Voltage (VDD) 1.2 V —
VPP Supply 2.5 V —
Operating Temperature (TC) 0°C to 95°C —
封装 96-ball FBGA 96-ball FBGA (13mm x 7.5mm)
Number of Banks 8 —
Burst Length 8, 4 (with burst chop) 8 (BL8), 4 (BC4)
On-Die Termination (ODT) Supported —
Self-Refresh Temperature-compensated (TCSR) —
RoHS Compliant Compliant
Lead-Free Yes —
安装类型 Surface Mount —
电源电压 — 1.2 V
Number of Terminals — 96
Maximum Supply Voltage (Vsup) — 1.26 V
Maximum Operating Temperature — 85 °C
CAS 延迟 — 22 cycles (at 3200 Mbps)
Access Mode — Multi Bank Page Burst
JESD-30 Code — R-PBGA-B96
特性 — Auto self-refresh, auto precharge, asynchronous reset, data mask, dynamic ODT, ZQ calibration, CRC, write leveling

数据手册与资源

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