H5AN8G6NDJR vs MT40A512M16TB-062E:R 对比

详细并排对比 H5AN8G6NDJR 出自 SK hynix 和 MT40A512M16TB-062E:R 出自 Micron Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

SK hynix
H5AN8G6NDJR H5AN8G6NDJR - 8Gb DDR4-3200 SDRAM | SK hynix

H5AN8G6NDJR - 8Gb DDR4-3200 SDRAM | SK hynix

H5AN8G6NDJR ✓ 量产中
Micron Technology
MT40A512M16TB-062E:R MT40A512M16TB-062E:R - 8Gb DDR4 SDRAM 3200MT/s | Micron

MT40A512M16TB-062E:R - 8Gb DDR4 SDRAM 3200MT/s | Micron

MT40A512M16TB-062E:R ✓ 量产中

规格对比

参数 H5AN8G6NDJR MT40A512M16TB-062E:R
品牌 SK hynix Micron Technology
分类 Memory ICs Memory ICs
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $35.00 $60.00
存储器类型 DDR4 SDRAM DDR4 SDRAM
Density 8 Gb —
存储组织 512M x 16 —
数据速率 3200 Mbps (DDR4-3200) 3200 MT/s
电源电压 1.2 V —
封装 96-ball FBGA (13mm x 7.5mm) 96-FBGA (7.5x13 mm)
Number of Terminals 96 —
Maximum Supply Voltage (Vsup) 1.26 V —
Maximum Operating Temperature 85 °C —
Burst Length 8 (BL8), 4 (BC4) —
CAS 延迟 22 cycles (at 3200 Mbps) 22
Access Mode Multi Bank Page Burst —
JESD-30 Code R-PBGA-B96 —
RoHS Compliant —
特性 Auto self-refresh, auto precharge, asynchronous reset, data mask, dynamic ODT, ZQ calibration, CRC, write leveling Auto self-refresh, auto precharge, write leveling, CRC, dynamic on-chip termination, ZQ calibration
存储容量 — 8 Gbit (512M x 16)
Clock Frequency — 1600 MHz
Supply Voltage (VDD/VDDQ) — 1.2V ±60mV
VPP Voltage — 2.5V (-125mV, +250mV)
工作温度 — 0°C to +95°C
接口 — Parallel
数据总线宽度 — 16 bits
Refresh Time — 8192 cycles (64ms at -40°C to 85°C, 32ms at >85°C to 95°C, 16ms at >95°C)
I/O Type — 1.2V pseudo open-drain
RoHS 状态 — Compliant

数据手册与资源

浏览全部产品 创建 BOM 获取报价