IS43TR16256AL-107MBLI vs K4B4G1646E-BYMA 对比

详细并排对比 IS43TR16256AL-107MBLI 出自 ISSI, Integrated Silicon Solution Inc 和 K4B4G1646E-BYMA 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

ISSI, Integrated Silicon Solution Inc
IS43TR16256AL-107MBLI IS43TR16256AL-107MBLI - 4Gb DDR3L SDRAM 256Mx16 | ISSI

IS43TR16256AL-107MBLI - 4Gb DDR3L SDRAM 256Mx16 | ISSI

IS43TR16256AL-107MBLI ✓ 量产中
Samsung Electronics
K4B4G1646E-BYMA K4B4G1646E-BYMA - 4Gb DDR3L SDRAM 1866MHz | Samsung

K4B4G1646E-BYMA - 4Gb DDR3L SDRAM 1866MHz | Samsung

K4B4G1646E-BYMA ✓ 量产中

规格对比

参数 IS43TR16256AL-107MBLI K4B4G1646E-BYMA
品牌 ISSI, Integrated Silicon Solution Inc Samsung Electronics
分类 Memory ICs Memory ICs
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $2.00 $14.32
存储器类型 DDR3L SDRAM DDR3L SDRAM
存储容量 4 Gbit —
存储组织 256M x 16 256M x 16
Clock Speed 933 MHz —
数据速率 1866 Mbps 1866 Mbps/pin
Access Time 20 ns —
电源电压 1.35V (backward compatible to 1.5V) 1.35 V (1.28 V to 1.575 V)
封装 / 外壳 96-TWBGA (9x13mm) —
安装类型 Surface Mount Surface Mount
工作温度 [DATA_NEEDED: operating temperature range] 0°C to +95°C
Number of Banks 8 —
Burst Length 8 and 4 [DATA_NEEDED: Burst Length]
On-Die Termination Yes —
RoHS 状态 Compliant —
Memory Interface Parallel —
Density — 4 Gb
Clock Frequency — 933 MHz
Operating Current — 14 mA
Standby Current — 2 mA, 3 mA
封装 — FBGA-96
RoHS — Compliant
CAS 延迟 — [DATA_NEEDED: CAS Latency]
引脚数 — 96

数据手册与资源

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