K3LK4K40CM-BGCP vs K3K8K80BM-JGCT 对比
详细并排对比 K3LK4K40CM-BGCP 出自 Samsung Electronics 和 K3K8K80BM-JGCT 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Samsung Electronics
K3K8K80BM-JGCT - Samsung LPDDR DRAM Memory IC | Samsung Electronics
K3K8K80BM-JGCT ✓ 量产中规格对比
| 参数 | K3LK4K40CM-BGCP | K3K8K80BM-JGCT |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 分类 | DRAM | Memory ICs |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $37.80 | $3.10 |
| 存储器类型 | LPDDR5 SDRAM | Low Power DRAM (LPDDR) component |
| Density | 96 Gb (12 GB) | [DATA_NEEDED: die density in Gb] |
| 存储组织 | 1536M x 64 | [DATA_NEEDED: x8/x16 organization] |
| 数据速率 | 6400 Mbps per pin | — |
| Supply Voltage (VDD) | 1.05 V | [DATA_NEEDED: core supply voltage] |
| 封装 | 496-ball FBGA | — |
| 安装类型 | Surface Mount | Surface Mount |
| 接口 | LPDDR5 (JEDEC) | [DATA_NEEDED: LPDDR4X or LPDDR5] |
| 工作温度 | [DATA_NEEDED: Operating Temperature] | [DATA_NEEDED: operating temperature range] |
| Access Time / CAS Latency | [DATA_NEEDED: CAS Latency] | — |
| Refresh Scheme | Per-bank / all-bank refresh | — |
| Power-Down Modes | Deep sleep / power-down supported | — |
| Application Segment | Mobile, embedded, computing modules | — |
| RoHS 状态 | [DATA_NEEDED: RoHS Status] | [DATA_NEEDED: RoHS compliance] |
| Packaging | [DATA_NEEDED: standard packing quantity] | — |
| Manufacturer | — | Samsung Electronics |
| Product Family | — | K3K mobile DRAM (LPDDR) component series |
| Maximum Data Rate | — | [DATA_NEEDED: Mbps] |
| Supply Voltage (VDDQ) | — | [DATA_NEEDED: I/O supply voltage] |
| Package Type | — | FBGA (Ball Grid Array) |
| Ball Count | — | [DATA_NEEDED: package ball count] |
| Speed Grade Suffix | — | J (per Samsung speed-grade coding) |
| Packing Suffix | — | CT (per Samsung packing-code convention) |
| MSL 等级 | — | [DATA_NEEDED: moisture sensitivity level] |