K4A8G085WB vs K4A8G085WC-BIWE 对比
详细并排对比 K4A8G085WB 出自 Samsung Electronics 和 K4A8G085WC-BIWE 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | K4A8G085WB | K4A8G085WC-BIWE |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 分类 | Memory ICs | Memory ICs |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $5.20 | $6.29 |
| 存储器类型 | DDR4 SDRAM (B-die) | DDR4 SDRAM |
| Density | 8 Gbit | 8 Gb |
| 存储组织 | 1G x 8 | 1G x 8 |
| 电源电压 | 1.2 V | — |
| 封装 | 78-pin FBGA | 78-FBGA |
| 安装类型 | Surface Mount | Surface Mount |
| Operating Mode | DLL Enabled mode (per datasheet) | — |
| Speed Grade Suffixes | -BCRC, -BIRC, -BCTD, -BCPB (per family naming) | — |
| 数据速率 | [DATA_NEEDED: speed grade data rate in Mbps] | 3200 Mbps |
| tCL/cas latency | [DATA_NEEDED: CAS latency] | — |
| 工作温度 | [DATA_NEEDED: operating temperature range] | — |
| Refresh | [DATA_NEEDED: refresh rate 1x/2x] | Auto-refresh, self-refresh |
| Bank Groups | [DATA_NEEDED: bank/bank group count] | — |
| Package Dimensions | [DATA_NEEDED: package dimensions] | — |
| MSL 等级 | [DATA_NEEDED: moisture sensitivity level] | — |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | Compliant |
| Termination Voltage (VTT) | [DATA_NEEDED: VTT value] | — |
| Supply Voltage (VDD) | — | 1.2 V |
| Supply Voltage (VDDQ) | — | 1.2 V |
| 工作温度范围 | — | -40°C to +95°C |
| 接口 | — | POD-12 |
| Burst Length | — | 8 (BL8), 4 (BC4) |
| CAS 延迟 | — | 22 (CL22) |
| Lead-Free | — | Yes |