K4A8G085WC-BIWE vs K4A8G085WC-BCWE 对比
详细并排对比 K4A8G085WC-BIWE 出自 Samsung Electronics 和 K4A8G085WC-BCWE 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | K4A8G085WC-BIWE | K4A8G085WC-BCWE |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 分类 | Memory ICs | Memory ICs |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $6.29 | $7.38 |
| 存储器类型 | DDR4 SDRAM | DDR4 SDRAM |
| Density | 8 Gb | 8 Gb |
| 存储组织 | 1G x 8 | 1G x 8 |
| 数据速率 | 3200 Mbps | 3200 Mbps (DDR4-3200) |
| Supply Voltage (VDD) | 1.2 V | — |
| Supply Voltage (VDDQ) | 1.2 V | — |
| 工作温度范围 | -40°C to +95°C | — |
| 封装 | 78-FBGA | 78FBGA |
| 安装类型 | Surface Mount | Surface Mount |
| 接口 | POD-12 | DDR4 (parallel, double data rate) |
| Burst Length | 8 (BL8), 4 (BC4) | — |
| CAS 延迟 | 22 (CL22) | — |
| Refresh | Auto-refresh, self-refresh | Standard DDR4 refresh mechanisms |
| RoHS 状态 | Compliant | Compliant (per JLCPCB listing) |
| Lead-Free | Yes | — |
| 电源电压 | — | 1.2 V |
| 工作温度 | — | 0C to +85C |
| Application Class | — | Computing / Embedded main memory |
| Manufacturer | — | Samsung Electronics |
| Bank Group Architecture | — | DDR4 bank groups (8n prefetch) |
| Speed Bin Suffix | — | -BCWE (DDR4-3200, commercial temp) |
| On-Die Termination | — | Yes (DDR4 ODT) |