K4A8G085WC vs K4A8G085WB-BCPB 对比
详细并排对比 K4A8G085WC 出自 Samsung Electronics 和 K4A8G085WB-BCPB 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Samsung Electronics
K4A8G085WC - 8Gb DDR4 SDRAM 1Gx8 2666Mbps | Samsung Electronics
K4A8G085WC ✓ 量产中
规格对比
| 参数 | K4A8G085WC | K4A8G085WB-BCPB |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 分类 | Memory ICs | Memory ICs |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $24.90 | $13.78 |
| 存储器类型 | DDR4 SDRAM | DDR4 SDRAM |
| Density | 8 Gbit | 8 Gbit |
| 存储组织 | 1G x 8 | 1G x 8 |
| Speed | 2666 Mbps/pin (DDR4-2666) | — |
| 电源电压 | 1.2 V | 1.2 V (nominal) |
| Supply Voltage Range | 1.14 V to 1.26 V | — |
| Clock Frequency | 1333 MHz (1333.333 GHz nominal, per web data) | — |
| Operating Temperature (K4A8G085WC-BITD) | -40 C to +95 C | — |
| Operating Temperature (K4A8G085WC-BCTD) | 0 C to +95 C | — |
| 封装 | 78-ball FBGA (78FBGA) | 78-ball FBGA |
| 安装类型 | Surface Mount | Surface Mount (BGA) |
| Auto Precharge | Yes | — |
| Asynchronous Reset | Yes | — |
| CRC Function | Yes | — |
| ZQ Calibration | Yes | — |
| Dynamic On-Chip Termination (ODT) | Yes | — |
| Data Mask (DM) | Yes | — |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | Compliant |
| 数据速率 | — | 3200 Mbps (PC4-25600) |
| Speed Grade | — | BC |
| CAS Latency (CL) | — | 22 |
| Burst Length | — | 8 |
| Bank Architecture | — | 16 banks (4 bank groups) |
| Refresh Interval | — | 7.8 us (up to 85C) |
| 接口类型 | — | SSTL-12 |
| Termination | — | ODT / dynamic ODT |
| Self-Refresh | — | Temperature-Compensated Self-Refresh (TCSR) |
| Package Dimensions | — | 11 mm x 11 mm |
| Operating Mode | — | DLL enabled |