K4B4G1646D-BHMA vs K4B4G1646D-BYH90 对比
详细并排对比 K4B4G1646D-BHMA 出自 Samsung Electronics 和 K4B4G1646D-BYH90 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | K4B4G1646D-BHMA | K4B4G1646D-BYH90 |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 分类 | Memory ICs | Memory ICs |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $2.90 | $8.80 |
| 存储器类型 | DDR3L SDRAM | DDR3L SDRAM |
| Density | 4 Gb | 4 Gb |
| 存储组织 | 256M x 16 | 512M x 16 |
| 数据速率 | 1866 Mbps | 2133 Mbps/pin |
| 电源电压 | 1.35 V (1.283 V to 1.45 V) | 1.35V (1.283V to 1.45V) |
| 封装 | 96-ball FBGA | 96-ball FBGA (TFBGA) |
| 工作温度 | -40°C to +95°C (TC) | 0°C to +85°C |
| CAS 延迟 | 13 (at 1866 Mbps) | Programmable (e.g., 11, 12, 13) |
| Burst Length | 8 and 4 | 8 and 4 (with burst chop) |
| Number of Terminals | 96 | — |
| Lead-Free | Yes | Yes |
| 无卤 | Yes | Yes |
| RoHS Compliant | Yes | — |
| Die Version | D-die | — |
| Refresh Mode | Auto and Self Refresh | — |
| I/O Interface | — | x16 |
| Number of Banks | — | 8 |
| Ball Pitch | — | 0.8 mm |
| On-Die Termination | — | Yes (ODT pin) |
| ZQ Calibration | — | Yes (240-ohm resistor to ground) |
| RoHS | — | Compliant |