K4B4G1646E-BYK000 vs MT41K64M16TW-107 AUT:J 对比

详细并排对比 K4B4G1646E-BYK000 出自 Samsung Electronics 和 MT41K64M16TW-107 AUT:J 出自 Micron Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Samsung Electronics
K4B4G1646E-BYK000 K4B4G1646E-BYK000 - 4Gb DDR3L SDRAM 256Mx16 | Samsung

K4B4G1646E-BYK000 - 4Gb DDR3L SDRAM 256Mx16 | Samsung

K4B4G1646E-BYK000 ✓ 量产中
Micron Technology
MT41K64M16TW-107 AUT:J MT41K64M16TW-107 AUT:J - 1Gbit DDR3L SDRAM 933MHz | Micron

MT41K64M16TW-107 AUT:J - 1Gbit DDR3L SDRAM 933MHz | Micron

MT41K64M16TW-107 AUT:J ✓ 量产中

规格对比

参数 K4B4G1646E-BYK000 MT41K64M16TW-107 AUT:J
品牌 Samsung Electronics Micron Technology
分类 Memory ICs Memory ICs
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $0.56 $2.85
存储器类型 DDR3L SDRAM SDRAM - DDR3L
存储容量 4 Gbit 1 Gbit
存储组织 256M x 16 64M x 16
Speed Grade DDR3-1600 (1.25 ns clock cycle) —
Clock Frequency 800 MHz 933 MHz
CAS Latency (CL) [DATA_NEEDED: CAS latency - 1.25 ns CL grade indicates CL11 but not explicitly stated in provided data] —
Supply Voltage (VDD) 1.35 V (DDR3L), 1.5 V compatible (DDR3) —
Number of Banks [DATA_NEEDED: bank count] —
Die Process Samsung E-die —
封装 96-FBGA (BYK) 96-FBGA (8 x 14 mm)
安装类型 Surface Mount Surface Mount
接口 Parallel Parallel
工作温度 [DATA_NEEDED: operating temperature range] [DATA_NEEDED: operating temperature range]
特性 Auto precharge, asynchronous reset, ZQ calibration, dynamic on-chip termination, data mask —
RoHS 状态 [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Access Time 1.25 ns 20 ns
电源电压 — 1.35 V (DDR3L), 1.5 V compatible
Temperature Grade — AUT (automotive)
CAS 延迟 — [DATA_NEEDED: CAS latency]
Refresh Rate — [DATA_NEEDED: refresh rate]
数据速率 — 1866 MT/s (DDR3L-1866)
Termination — On-Die Termination (ODT)
Packaging — Tray (T/R per listing)

数据手册与资源

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